Abstract: The present invention provides an automatic defect detection and correction system for a tape-mounted electronic components assembly which allows detection and correction of various types of defects in the production of a tape-mounted electronic components assembly without interrupting operation of a taping machine. A storing section allows storage of a length of tape coming out of the taping machine. A defect detecting section detects various types of defects of the tape coming out of the storing section. A defect correcting section enables correction of detected defects, and a take-up section winds the corrected tape on a reel. The tape coming out of the taping machine is continually wound between a fixed shaft and a movable shaft in the storing section and is thus temporarily stored in a specified length. When the tape leaves the storing section for the defect detecting section and the defect correction section, the movable shaft approaches the fixed shaft, forwarding the temporarily stored tape.