Abstract: A piezoelectric resonator device includes a metal base through which at least two metal lead terminals are erected via an insulating material, a piezoelectric resonator plate that is placed on the metal lead terminals and is electrically connected to the metal lead terminals via an electroconductive resin adhesive, and a metal lid that hermetically covers the piezoelectric resonator plate placed on the metal lead terminals. The electroconductive resin adhesive has flexibility of at least a pencil hardness of 4B. Also, an anticorrosive film is formed on the outer surface of the metal base and the metal lead terminals, and the electroconductive resin adhesive is used for the direct electrical connecting and mechanical joining of the ends of the piezoelectric resonator plate to the upper face of the anticorrosive film of the metal lead terminals inside the hermetic seal.