Abstract: According to an embodiment of the present disclosure, an apparatus of inspecting an overlapped substrate obtained by bonding substrates together is provided. The apparatus includes a first holding unit configured to hold and rotate the overlapped substrate, and a displacement gauge configured to measure displacements of peripheral sides of a first substrate and a second substrate constituting the overlapped substrate while rotating the overlapped substrate held by the first holding unit.

Abstract: An inspection device for inspecting the interior of an overlapped substrate produced by bonding one substrate and another substrate, comprising: a first holding unit configured to hold the rear surface of the overlapped substrate and include a cutout formed to expose a portion of the rear surface of the overlapped substrate when viewed from the top; a second holding unit configured to hold and rotate the overlapped substrate; an infrared irradiator configured to irradiate the rear surface or front surface exposed from the cutout of the overlapped substrate held on the first holding unit with an infrared ray; and an image pickup unit configured to receive the infrared ray emitted from the infrared irradiator and image the overlapped substrate held on the first holding unit in division for each of regions exposed from the cutout.

Abstract: According to an embodiment of the present disclosure, an apparatus of inspecting an overlapped substrate obtained by bonding substrates together is provided. The apparatus includes a first holding unit configured to hold and rotate the overlapped substrate, and a displacement gauge configured to measure displacements of peripheral sides of a first substrate and a second substrate constituting the overlapped substrate while rotating the overlapped substrate held by the first holding unit.