Patents by Inventor Akinori Okada
Akinori Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11046787Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.Type: GrantFiled: May 9, 2018Date of Patent: June 29, 2021Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATIONInventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
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Publication number: 20210187902Abstract: The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.Type: ApplicationFiled: February 28, 2017Publication date: June 24, 2021Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
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Patent number: 10752755Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.Type: GrantFiled: February 28, 2017Date of Patent: August 25, 2020Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Takayuki Hattori, Jyunichi Inagaki, Takafumi Kuninobu, Kazuhiro Takizawa, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
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Patent number: 10679922Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.Type: GrantFiled: February 28, 2017Date of Patent: June 9, 2020Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
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Publication number: 20200123275Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.Type: ApplicationFiled: May 9, 2018Publication date: April 23, 2020Applicants: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATIONInventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
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Publication number: 20190055444Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.Type: ApplicationFiled: February 28, 2017Publication date: February 21, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
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Patent number: 10202530Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.Type: GrantFiled: August 26, 2015Date of Patent: February 12, 2019Assignees: JNC CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
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Publication number: 20190023900Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.Type: ApplicationFiled: February 28, 2017Publication date: January 24, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Masako HINATSU, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
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Publication number: 20190023847Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.Type: ApplicationFiled: February 28, 2017Publication date: January 24, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, TAKAYUKI HATTORI, JYUNICHI INAGAKI, TAKAFUMI KUNINOBU, Kazuhiro TAKIZAWA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
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Patent number: 9938371Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.Type: GrantFiled: May 8, 2015Date of Patent: April 10, 2018Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Jyunichi Inagaki, Yukito Yada, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
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Publication number: 20170306207Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.Type: ApplicationFiled: August 26, 2015Publication date: October 26, 2017Applicants: JNC CORPORATION, OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTEInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, MASAKO HINATSU, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA
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Publication number: 20170137561Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.Type: ApplicationFiled: May 8, 2015Publication date: May 18, 2017Applicants: JNC CORPORATION, Osaka Municipal Technical Research InstituteInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YUKITO YADA, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA
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Publication number: 20130037843Abstract: A light emitting transistor of the present invention has a light emitting layer, both a source electrode and a drain electrode both of which are connected with the light emitting layer electrically, an insulation layer arranged on the light emitting layer, a gate electrode arranged on the insulation layer. The light emitting layer is made from an organic semiconductor material. The light emitting transistor has also a periodic structure and the gate electrode to which an AC voltage is applied. And the emission intensity can be high, and width of the emission spectrum can be reduced. In addition, it is easy to control the amplitude of the emitting light and the width of emission spectrum reproducibly.Type: ApplicationFiled: February 9, 2011Publication date: February 14, 2013Inventors: Takeshi Yamao, Shu Hotta, Yoichi Sakurai, Yoshitaka Makino, Kohei Terasaki, Akinori Okada
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Patent number: 7566249Abstract: An electric junction box having an aperture on one side of a case that houses conductive material, the aperture receiving a subsequently installed component when the electric junction box is assembled. The conductive material mounted in the case is exposed at the aperture; wires connecting to other conductive material are passed through the aperture; and a cover provided inside the aperture is folded to cover the conductive material while the wires are installed, preventing interference of the wires with the subsequently installed part.Type: GrantFiled: November 30, 2005Date of Patent: July 28, 2009Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Akinori Okada
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Publication number: 20060131045Abstract: An electric junction box having an aperture on one side of a case that houses conductive material, the aperture receiving a subsequently installed component when the electric junction box is assembled. The conductive material mounted in the case is exposed at the aperture; wires connecting to other conductive material are passed through the aperture; and a cover provided inside the aperture is folded to cover the conductive material while the wires are installed, preventing interference of the wires with the subsequently installed part.Type: ApplicationFiled: November 30, 2005Publication date: June 22, 2006Applicant: Sumitomo Wiring Systems, Ltd.Inventor: Akinori Okada
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Patent number: 5346878Abstract: The heat-sensitive recording material disclosed comprises a colorless or pale colored dyestuff precursor, one or more salicylic acid derivative of the formula (1) or metal salt of the derivative and an aliphatic amide compound having 18.about.60 carbon atoms in molecular structure, and is excellent in thermal response and preservation stability of white portions and images. ##STR1## wherein X.sub.1 and X.sub.2 are a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an aralkyl group or an aryl group, Y.sub.1 and Y.sub.2 are an oxygen atom or a sulfur atom, R.sub.1 is a hydrogen atom, an alkyl group, an aralkyl group or an aryl group, and R.sub.2 is an alkyl group, an alkenyl group, an aralkyl group or an aryl group.Type: GrantFiled: August 18, 1993Date of Patent: September 13, 1994Assignees: Mitsui Toatsu Chemicals, Inc., Mitsubishi Paper Mills LimitedInventors: Masakatsu Nakatsuka, Naomasa Koike, Akinori Okada
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Patent number: 5106814Abstract: The present invention provides a heat-sensitive recording material excellent in image stability and heat-responsiveness which contains an aromatic isocyanate compound, an imino compound and at least one compound represented by the following formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each represents an alkyl group.Type: GrantFiled: December 28, 1990Date of Patent: April 21, 1992Assignee: Mitsubishi Paper Mills LimitedInventors: Shigetoshi Hiraishi, Akinori Okada, Mikiya Sekine
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Patent number: 5102857Abstract: A heat-sensitive recording material which comprises a support and a heat-sensitive recording layer provided on the support, the heat-sensitive recording layer comprising a colorless or pale-colored dye precursor, a developer which reacts with the dye precursor to form color upon heating, and two compounds represented by the following formulas (I) and (II): ##STR1## The heat-sensitive recording material causes little fogging and generates little thermal head scum while having almost the same sensitivity and image stability as conventional heat-sensitive recording materials.Type: GrantFiled: January 4, 1991Date of Patent: April 7, 1992Assignee: Mitsubishi Paper Mills LimitedInventor: Akinori Okada
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Patent number: 5043312Abstract: A heat-sensitive recording material comprising a support and a heat-sensitive recording layer provided on the support, said heat-sensitive recording layer comprising an aromatic or heterocyclic isocyanate compound, an imino compound, a binder, a specific alcoholic compound, and preferably, a specific biphenyl derivative. The heat-sensitive recording material have an excellent image preservability and heat responsiveness.Type: GrantFiled: November 2, 1990Date of Patent: August 27, 1991Assignee: Mitsubishi Paper Mills LimitedInventors: Shigetoshi Hiraishi, Akinori Okada, Mikiya Sekine
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Patent number: 4999332Abstract: A heat-sensitive recording material comprising a dye precursor which is colorless or light-colored in the usual state and a color developing agent capable of reacting with said dye precursor upon heating to develop a color which is a combination of compounds of the following chemical formulas (I) and (II).Type: GrantFiled: September 8, 1988Date of Patent: March 12, 1991Assignee: Mitsubishi Paper Mills, LimitedInventors: Fumio Okumura, Akinori Okada, Kazuyoshi Kondo