Patents by Inventor Akinori Okada

Akinori Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11046787
    Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 29, 2021
    Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATION
    Inventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
  • Publication number: 20210187902
    Abstract: The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 24, 2021
    Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
  • Patent number: 10752755
    Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: August 25, 2020
    Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi Fujiwara, Takayuki Hattori, Jyunichi Inagaki, Takafumi Kuninobu, Kazuhiro Takizawa, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
  • Patent number: 10679922
    Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: June 9, 2020
    Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
  • Publication number: 20200123275
    Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.
    Type: Application
    Filed: May 9, 2018
    Publication date: April 23, 2020
    Applicants: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATION
    Inventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
  • Publication number: 20190055444
    Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.
    Type: Application
    Filed: February 28, 2017
    Publication date: February 21, 2019
    Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
  • Patent number: 10202530
    Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 12, 2019
    Assignees: JNC CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
  • Publication number: 20190023900
    Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
    Type: Application
    Filed: February 28, 2017
    Publication date: January 24, 2019
    Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Masako HINATSU, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
  • Publication number: 20190023847
    Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.
    Type: Application
    Filed: February 28, 2017
    Publication date: January 24, 2019
    Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi FUJIWARA, TAKAYUKI HATTORI, JYUNICHI INAGAKI, TAKAFUMI KUNINOBU, Kazuhiro TAKIZAWA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
  • Patent number: 9938371
    Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: April 10, 2018
    Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi Fujiwara, Jyunichi Inagaki, Yukito Yada, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
  • Publication number: 20170306207
    Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.
    Type: Application
    Filed: August 26, 2015
    Publication date: October 26, 2017
    Applicants: JNC CORPORATION, OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE
    Inventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, MASAKO HINATSU, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA
  • Publication number: 20170137561
    Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.
    Type: Application
    Filed: May 8, 2015
    Publication date: May 18, 2017
    Applicants: JNC CORPORATION, Osaka Municipal Technical Research Institute
    Inventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YUKITO YADA, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA
  • Publication number: 20130037843
    Abstract: A light emitting transistor of the present invention has a light emitting layer, both a source electrode and a drain electrode both of which are connected with the light emitting layer electrically, an insulation layer arranged on the light emitting layer, a gate electrode arranged on the insulation layer. The light emitting layer is made from an organic semiconductor material. The light emitting transistor has also a periodic structure and the gate electrode to which an AC voltage is applied. And the emission intensity can be high, and width of the emission spectrum can be reduced. In addition, it is easy to control the amplitude of the emitting light and the width of emission spectrum reproducibly.
    Type: Application
    Filed: February 9, 2011
    Publication date: February 14, 2013
    Inventors: Takeshi Yamao, Shu Hotta, Yoichi Sakurai, Yoshitaka Makino, Kohei Terasaki, Akinori Okada
  • Patent number: 7566249
    Abstract: An electric junction box having an aperture on one side of a case that houses conductive material, the aperture receiving a subsequently installed component when the electric junction box is assembled. The conductive material mounted in the case is exposed at the aperture; wires connecting to other conductive material are passed through the aperture; and a cover provided inside the aperture is folded to cover the conductive material while the wires are installed, preventing interference of the wires with the subsequently installed part.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: July 28, 2009
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Akinori Okada
  • Publication number: 20060131045
    Abstract: An electric junction box having an aperture on one side of a case that houses conductive material, the aperture receiving a subsequently installed component when the electric junction box is assembled. The conductive material mounted in the case is exposed at the aperture; wires connecting to other conductive material are passed through the aperture; and a cover provided inside the aperture is folded to cover the conductive material while the wires are installed, preventing interference of the wires with the subsequently installed part.
    Type: Application
    Filed: November 30, 2005
    Publication date: June 22, 2006
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventor: Akinori Okada
  • Patent number: 5346878
    Abstract: The heat-sensitive recording material disclosed comprises a colorless or pale colored dyestuff precursor, one or more salicylic acid derivative of the formula (1) or metal salt of the derivative and an aliphatic amide compound having 18.about.60 carbon atoms in molecular structure, and is excellent in thermal response and preservation stability of white portions and images. ##STR1## wherein X.sub.1 and X.sub.2 are a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an aralkyl group or an aryl group, Y.sub.1 and Y.sub.2 are an oxygen atom or a sulfur atom, R.sub.1 is a hydrogen atom, an alkyl group, an aralkyl group or an aryl group, and R.sub.2 is an alkyl group, an alkenyl group, an aralkyl group or an aryl group.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: September 13, 1994
    Assignees: Mitsui Toatsu Chemicals, Inc., Mitsubishi Paper Mills Limited
    Inventors: Masakatsu Nakatsuka, Naomasa Koike, Akinori Okada
  • Patent number: 5106814
    Abstract: The present invention provides a heat-sensitive recording material excellent in image stability and heat-responsiveness which contains an aromatic isocyanate compound, an imino compound and at least one compound represented by the following formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each represents an alkyl group.
    Type: Grant
    Filed: December 28, 1990
    Date of Patent: April 21, 1992
    Assignee: Mitsubishi Paper Mills Limited
    Inventors: Shigetoshi Hiraishi, Akinori Okada, Mikiya Sekine
  • Patent number: 5102857
    Abstract: A heat-sensitive recording material which comprises a support and a heat-sensitive recording layer provided on the support, the heat-sensitive recording layer comprising a colorless or pale-colored dye precursor, a developer which reacts with the dye precursor to form color upon heating, and two compounds represented by the following formulas (I) and (II): ##STR1## The heat-sensitive recording material causes little fogging and generates little thermal head scum while having almost the same sensitivity and image stability as conventional heat-sensitive recording materials.
    Type: Grant
    Filed: January 4, 1991
    Date of Patent: April 7, 1992
    Assignee: Mitsubishi Paper Mills Limited
    Inventor: Akinori Okada
  • Patent number: 5043312
    Abstract: A heat-sensitive recording material comprising a support and a heat-sensitive recording layer provided on the support, said heat-sensitive recording layer comprising an aromatic or heterocyclic isocyanate compound, an imino compound, a binder, a specific alcoholic compound, and preferably, a specific biphenyl derivative. The heat-sensitive recording material have an excellent image preservability and heat responsiveness.
    Type: Grant
    Filed: November 2, 1990
    Date of Patent: August 27, 1991
    Assignee: Mitsubishi Paper Mills Limited
    Inventors: Shigetoshi Hiraishi, Akinori Okada, Mikiya Sekine
  • Patent number: 4999332
    Abstract: A heat-sensitive recording material comprising a dye precursor which is colorless or light-colored in the usual state and a color developing agent capable of reacting with said dye precursor upon heating to develop a color which is a combination of compounds of the following chemical formulas (I) and (II).
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: March 12, 1991
    Assignee: Mitsubishi Paper Mills, Limited
    Inventors: Fumio Okumura, Akinori Okada, Kazuyoshi Kondo