Patents by Inventor Akinori Uchino
Akinori Uchino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200326762Abstract: A cover member is capable of dispersion of heat generated in a portable information device. A cover member is to be mounted on a portable information device. The cover member includes a first cover portion, a second cover portion, a connecting portion connecting the first cover portion and the second cover portion in a foldable manner, and a heat conductive sheet disposed so as to extend from the first cover portion to the second cover portion through the connecting portion.Type: ApplicationFiled: June 30, 2019Publication date: October 15, 2020Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Akinori Uchino, Takuroh Kamimura, Ryota Watanabe, Atsushi Ohyama
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Publication number: 20200233479Abstract: An apparatus for controlling power efficiency of an information processing device is disclosed. The apparatus includes a voltage converter that converts an input voltage into a predetermined output voltage, an information processing device that consumes power supplied by the voltage converter, a battery pack that is charged using power supplied at a predetermined charging voltage by the voltage converter, and a controller that determines the input voltage where the power supplied by the voltage converter exceeds power consumed by the information processing device and a difference between the input voltage and the predetermined charging voltage is minimized. A method and a system also perform various functions of the apparatus.Type: ApplicationFiled: March 11, 2020Publication date: July 23, 2020Inventors: Hideshi Tsukamoto, Kazuhiro Kosugi, Yuichiro Seto, Akinori Uchino
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Patent number: 10677539Abstract: A plate-type heat transport device is provided. The plate-type heat transport device includes a metal plate having a meandering shape flow passage. The flow passage includes multiple linear channels and return channels. The linear channels extends in parallel to each other from a first end of the metal plate to a second end of the metal plate. The return channels are located in the first and second ends of the metal plate to allow the linear channels to communicate with each other. A first area of the metal plate associated with the linear channels is thinner than a second area of the metal plate associated with the return channels. The flow passage of the metal plate contains a hydraulic fluid.Type: GrantFiled: April 26, 2018Date of Patent: June 9, 2020Assignee: LENOVO (SINGAPORE) PTE LTDInventors: Atsunobu Nakamura, Takuroh Kamimura, Akinori Uchino
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Publication number: 20200072247Abstract: A fan having reduced discrete tone noise is disclosed. The fan includes a fan chassis having an air inlet and an air outlet formed open at an outer surface of the fan chassis; an impeller part provided in the fan chassis; a wall part forming an air passage, the air passage is provided in the fan chassis to allow air to be introduced through the air inlet by rotation of the impeller part to flow to the air outlet; and a resonator having a cavity part communicating with said air passage through a communication passage passing through the wall part.Type: ApplicationFiled: August 29, 2019Publication date: March 5, 2020Inventors: Ryota Watanabe, Takuroh Kamimura, Atsunobu Nakamura, Akinori Uchino
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Patent number: 10546799Abstract: An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.Type: GrantFiled: July 19, 2018Date of Patent: January 28, 2020Assignee: LENOVO (SINGAPORE) PTE LTDInventors: Akinori Uchino, Kazuo Fujii, Takuroh Kamimura, Kenji Watamura, Hiroshi Yamazaki, Takanori Hoshino
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Publication number: 20190377393Abstract: An apparatus for heat suppression in an initial setting mode includes, in one embodiment, an execution unit of an information processing device that executes an operation related to an initial setting mode of the information processing device, a power supply that supplies power to one or more heat generating components of the execution unit, and a controller that controls at least the power supplied by the power supply to make an amount of heat generation of the execution unit in the initial setting mode lower than the amount of heat generation of the execution unit in an operating mode after termination of the initial setting mode until fulfillment of a predetermined condition. A method and a computer program product also perform functions of the apparatus.Type: ApplicationFiled: May 22, 2019Publication date: December 12, 2019Inventors: Akinori Uchino, Toyoaki Inada, Yusaku Morishige, Kazuhiro Kosugi, Hajime Yoshizawa, Yuhsaku Sugai, Hiroki Oda
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Publication number: 20190339764Abstract: An apparatus for controlling power efficiency of an information processing device is disclosed. The apparatus includes a voltage converter that converts a selected input voltage into a predetermined output voltage, an information processing device that uses power supplied by the voltage converter; and a controller that determines the selected input voltage based on an operating state of the information processing device where the operating state includes one or more parameters selected from fan speed, power consumption, power consumption fluctuation, processor usage, processor usage fluctuation, system temperature, sensor-specific temperature, mobility, and acceleration. A method and a system also perform various functions of the apparatus.Type: ApplicationFiled: May 1, 2019Publication date: November 7, 2019Inventors: Hideshi Tsukamoto, Kazuhiro Kosugi, Yuichiro Seto, Akinori Uchino
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Patent number: 10401925Abstract: An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.Type: GrantFiled: November 30, 2016Date of Patent: September 3, 2019Assignee: LENOVO (SINGAPORE) PTE LTDInventors: Akinori Uchino, Hiroaki Agata, Takuroh Kamimura, Tomoaki Kosugi
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Patent number: 10356947Abstract: An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.Type: GrantFiled: June 27, 2017Date of Patent: July 16, 2019Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Akinori Uchino, Takuroh Kamimura, Hajime Yoshizawa, Shusaku Tomizawa
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Publication number: 20190037725Abstract: An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.Type: ApplicationFiled: July 19, 2018Publication date: January 31, 2019Inventors: Akinori Uchino, Kazuo Fujii, Takuroh Kamimura, Kenji Watamura, Hiroshi Yamazaki, Takanori Hoshino
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Publication number: 20180313615Abstract: A plate-type heat transport device is provided. The plate-type heat transport device includes a metal plate having a meandering shape flow passage. The flow passage includes multiple linear channels and return channels. The linear channels extends in parallel to each other from a first end of the metal plate to a second end of the metal plate. The return channels are located in the first and second ends of the metal plate to allow the linear channels to communicate with each other. A first area of the metal plate associated with the linear channels is thinner than a second area of the metal plate associated with the return channels. The flow passage of the metal plate contains a hydraulic fluid.Type: ApplicationFiled: April 26, 2018Publication date: November 1, 2018Inventors: ATSUNOBU NAKAMURA, TAKUROH KAMIMURA, AKINORI UCHINO
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Publication number: 20180088637Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.Type: ApplicationFiled: August 8, 2017Publication date: March 29, 2018Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: AKINORI UCHINO, KAZUYA TATSUNO, TAKATERU ADACHI, TAKUROH KAMIMURA
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Patent number: 9904335Abstract: An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.Type: GrantFiled: December 7, 2016Date of Patent: February 27, 2018Assignee: LENOVO (SINGAPORE) PTE LTDInventors: Takuroh Kamimura, Hiroaki Agata, Akinori Uchino, Tomoaki Kosugi, Yoshiyuki Shibayama, Eiji Shinohara
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Publication number: 20180027694Abstract: An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.Type: ApplicationFiled: June 27, 2017Publication date: January 25, 2018Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: AKINORI UCHINO, TAKUROH KAMIMURA, HAJIME YOSHIZAWA, SHUSAKU TOMIZAWA
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Publication number: 20170160772Abstract: An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.Type: ApplicationFiled: December 7, 2016Publication date: June 8, 2017Inventors: TAKUROH KAMIMURA, HIROAKI AGATA, AKINORI UCHINO, TOMOAKI KOSUGI, YOSHIYUKI SHIBAYAMA, EIJI SHINOHARA
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Publication number: 20170153678Abstract: An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.Type: ApplicationFiled: November 30, 2016Publication date: June 1, 2017Inventors: AKINORI UCHINO, HIROAKI AGATA, TAKUROH KAMIMURA, TOMOAKI KOSUGI
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Patent number: 9436230Abstract: A hinge which may be used for example in portable electronic devices may raise the upper body of the device from the lower body in response to rotation of the upper body about the hinge. The need to include a half-pipe section on the upper surface of the lower body maybe avoided. Thus more internal space of the lower body may be used without having to accommodate for the hinge. In an exemplary embodiment, the hinge may include a cam surface. The cam surface may be configured to shift a longitudinal axis of the hinge on response to the rotation of the upper body. In some embodiments, the shift of the longitudinal axis may be away from the lower body allowing a rear edge of the upper body to move across a rear edge of an upper surface of the lower body.Type: GrantFiled: July 14, 2014Date of Patent: September 6, 2016Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Chin Kai Lee, Akinori Uchino, Takuroh Kamimura
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Patent number: 9317074Abstract: The invention broadly contemplates an electronic apparatus that provides improved antenna characteristics, while maintaining a thin size and light weight. The electronic apparatus of the present invention includes a display casing having a nonconductive resin region and a conductive resin region in a bottom surface thereof; a display module accommodated in the display casing; an antenna disposed in the nonconductive resin region; and a system casing accommodating a wireless module connected to the antenna. By disposing the antenna in the nonconductive resin region formed in the bottom surface of the display casing, it is possible to secure high radio wave sensitivity while preventing an antenna mounting portion from being exposed to the outside of the display casing. The casing structure of the electronic apparatus does not become thick because of butt joining even when the joint portions are in a projection area of an LCD module.Type: GrantFiled: January 9, 2009Date of Patent: April 19, 2016Assignee: Lenova (Singapore) Pte. Ltd.Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
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Publication number: 20160011631Abstract: A hinge which may be used for example in portable electronic devices may raise the upper body of the device from the lower body in response to rotation of the upper body about the hinge. The need to include a half-pipe section on the upper surface of the lower body maybe avoided. Thus more internal space of the lower body may be used without having to accommodate for the hinge. In an exemplary embodiment, the hinge may include a cam surface. The cam surface may be configured to shift a longitudinal axis of the hinge on response to the rotation of the upper body. In some embodiments, the shift of the longitudinal axis may be away from the lower body allowing a rear edge of the upper body to move across a rear edge of an upper surface of the lower body.Type: ApplicationFiled: July 14, 2014Publication date: January 14, 2016Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Chin Kai Lee, Akinori Uchino, Takuroh Kamimura
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Patent number: 9095046Abstract: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.Type: GrantFiled: March 6, 2013Date of Patent: July 28, 2015Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Akinori Uchino, Tetsuya Ohtani, Masahiro Kitamura, Tatsuya Ushioda