Patents by Inventor Akinori Uchino

Akinori Uchino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190339764
    Abstract: An apparatus for controlling power efficiency of an information processing device is disclosed. The apparatus includes a voltage converter that converts a selected input voltage into a predetermined output voltage, an information processing device that uses power supplied by the voltage converter; and a controller that determines the selected input voltage based on an operating state of the information processing device where the operating state includes one or more parameters selected from fan speed, power consumption, power consumption fluctuation, processor usage, processor usage fluctuation, system temperature, sensor-specific temperature, mobility, and acceleration. A method and a system also perform various functions of the apparatus.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 7, 2019
    Inventors: Hideshi Tsukamoto, Kazuhiro Kosugi, Yuichiro Seto, Akinori Uchino
  • Patent number: 10401925
    Abstract: An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: September 3, 2019
    Assignee: LENOVO (SINGAPORE) PTE LTD
    Inventors: Akinori Uchino, Hiroaki Agata, Takuroh Kamimura, Tomoaki Kosugi
  • Patent number: 10356947
    Abstract: An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: July 16, 2019
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Akinori Uchino, Takuroh Kamimura, Hajime Yoshizawa, Shusaku Tomizawa
  • Publication number: 20190037725
    Abstract: An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 31, 2019
    Inventors: Akinori Uchino, Kazuo Fujii, Takuroh Kamimura, Kenji Watamura, Hiroshi Yamazaki, Takanori Hoshino
  • Publication number: 20180313615
    Abstract: A plate-type heat transport device is provided. The plate-type heat transport device includes a metal plate having a meandering shape flow passage. The flow passage includes multiple linear channels and return channels. The linear channels extends in parallel to each other from a first end of the metal plate to a second end of the metal plate. The return channels are located in the first and second ends of the metal plate to allow the linear channels to communicate with each other. A first area of the metal plate associated with the linear channels is thinner than a second area of the metal plate associated with the return channels. The flow passage of the metal plate contains a hydraulic fluid.
    Type: Application
    Filed: April 26, 2018
    Publication date: November 1, 2018
    Inventors: ATSUNOBU NAKAMURA, TAKUROH KAMIMURA, AKINORI UCHINO
  • Publication number: 20180088637
    Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.
    Type: Application
    Filed: August 8, 2017
    Publication date: March 29, 2018
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: AKINORI UCHINO, KAZUYA TATSUNO, TAKATERU ADACHI, TAKUROH KAMIMURA
  • Patent number: 9904335
    Abstract: An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: February 27, 2018
    Assignee: LENOVO (SINGAPORE) PTE LTD
    Inventors: Takuroh Kamimura, Hiroaki Agata, Akinori Uchino, Tomoaki Kosugi, Yoshiyuki Shibayama, Eiji Shinohara
  • Publication number: 20180027694
    Abstract: An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.
    Type: Application
    Filed: June 27, 2017
    Publication date: January 25, 2018
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: AKINORI UCHINO, TAKUROH KAMIMURA, HAJIME YOSHIZAWA, SHUSAKU TOMIZAWA
  • Publication number: 20170160772
    Abstract: An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.
    Type: Application
    Filed: December 7, 2016
    Publication date: June 8, 2017
    Inventors: TAKUROH KAMIMURA, HIROAKI AGATA, AKINORI UCHINO, TOMOAKI KOSUGI, YOSHIYUKI SHIBAYAMA, EIJI SHINOHARA
  • Publication number: 20170153678
    Abstract: An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.
    Type: Application
    Filed: November 30, 2016
    Publication date: June 1, 2017
    Inventors: AKINORI UCHINO, HIROAKI AGATA, TAKUROH KAMIMURA, TOMOAKI KOSUGI
  • Patent number: 9436230
    Abstract: A hinge which may be used for example in portable electronic devices may raise the upper body of the device from the lower body in response to rotation of the upper body about the hinge. The need to include a half-pipe section on the upper surface of the lower body maybe avoided. Thus more internal space of the lower body may be used without having to accommodate for the hinge. In an exemplary embodiment, the hinge may include a cam surface. The cam surface may be configured to shift a longitudinal axis of the hinge on response to the rotation of the upper body. In some embodiments, the shift of the longitudinal axis may be away from the lower body allowing a rear edge of the upper body to move across a rear edge of an upper surface of the lower body.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: September 6, 2016
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Chin Kai Lee, Akinori Uchino, Takuroh Kamimura
  • Patent number: 9317074
    Abstract: The invention broadly contemplates an electronic apparatus that provides improved antenna characteristics, while maintaining a thin size and light weight. The electronic apparatus of the present invention includes a display casing having a nonconductive resin region and a conductive resin region in a bottom surface thereof; a display module accommodated in the display casing; an antenna disposed in the nonconductive resin region; and a system casing accommodating a wireless module connected to the antenna. By disposing the antenna in the nonconductive resin region formed in the bottom surface of the display casing, it is possible to secure high radio wave sensitivity while preventing an antenna mounting portion from being exposed to the outside of the display casing. The casing structure of the electronic apparatus does not become thick because of butt joining even when the joint portions are in a projection area of an LCD module.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: April 19, 2016
    Assignee: Lenova (Singapore) Pte. Ltd.
    Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
  • Publication number: 20160011631
    Abstract: A hinge which may be used for example in portable electronic devices may raise the upper body of the device from the lower body in response to rotation of the upper body about the hinge. The need to include a half-pipe section on the upper surface of the lower body maybe avoided. Thus more internal space of the lower body may be used without having to accommodate for the hinge. In an exemplary embodiment, the hinge may include a cam surface. The cam surface may be configured to shift a longitudinal axis of the hinge on response to the rotation of the upper body. In some embodiments, the shift of the longitudinal axis may be away from the lower body allowing a rear edge of the upper body to move across a rear edge of an upper surface of the lower body.
    Type: Application
    Filed: July 14, 2014
    Publication date: January 14, 2016
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Chin Kai Lee, Akinori Uchino, Takuroh Kamimura
  • Patent number: 9095046
    Abstract: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: July 28, 2015
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Akinori Uchino, Tetsuya Ohtani, Masahiro Kitamura, Tatsuya Ushioda
  • Publication number: 20140254071
    Abstract: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Akinori Uchino, Tetsuya Ohtani, Masahiro Kitamura, Tatsuya Ushioda
  • Patent number: 8687354
    Abstract: A hinge is provided that permits a user to use a computer system either as a laptop computer or a tablet computer. The hinge may comprise a hinge block and an inhibitor stopper. The hinge block may have a first hinge member and a second hinge member. The inhibitor stopper may be disposed between the first hinge member and the second hinge member. The inhibitor stopper may have a first wing and a second wing. The inhibitor stopper may be attached to the hinge block. The first and second wings may be rotatable around an axis.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: April 1, 2014
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Yoshiharu Uchiyama, Kenshin Yonemochi, Akinori Uchino
  • Patent number: 8576372
    Abstract: An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: November 5, 2013
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
  • Publication number: 20130194741
    Abstract: A hinge is provided that permits a user to use a computer system either as a laptop computer or a tablet computer. The hinge may comprise a hinge block and an inhibitor stopper. The hinge block may have a first hinge member and a second hinge member. The inhibitor stopper may be disposed between the first hinge member and the second hinge member. The inhibitor stopper may have a first wing and a second wing. The inhibitor stopper may be attached to the hinge block. The first and second wings may be rotatable around an axis.
    Type: Application
    Filed: January 30, 2012
    Publication date: August 1, 2013
    Inventors: YOSHIHARU UCHIYAMA, KENSHIN YONEMOCHI, AKINORI UCHINO
  • Patent number: 8379164
    Abstract: The invention provides a casing structure for an electronic apparatus that achieves a thin size and light weight. The casing structure is capable of accommodating a display module, and comprises a sidewall and a bottom surface in which a conductive resin region and a nonconductive resin region are butt joined in a curved line. The casing structure of the electronic apparatus does not become thick due to the butt joining even when the joint portions are in a projection area of the display module. Furthermore, on the display side of the casing structure, there is no need to have special frame members for securing strength in addition to the display casing. The display casing accommodates and protects the display module from an external pressing force and also has a design function that the outer surface of the casing resembles that of an outer surface of a conventional notebook PC.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: February 19, 2013
    Assignee: Lenovo (Singapore) Pte. Ltd
    Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
  • Patent number: 8199491
    Abstract: A drainage system is provided for draining liquid accidentally spilled on a casing having a plurality of pushbuttons on a surface of the casing. An electronic apparatus may comprise a casing and a drainage system. The drainage system may be connected with the casing. The drainage system may include a liquid collecting basin, a drainage exit, and a liquid passageway. The liquid passageway may have a capillary surface and may lead the liquid from the liquid collecting basin to the drainage exit.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: June 12, 2012
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Yoshiharu Uchiyama, Akinori Uchino, Tsutomu Chonan, Hiroyuki Noguchi, Kimio Kumada