Patents by Inventor Akio Ashida

Akio Ashida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6422067
    Abstract: Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa·second at a shear speed of 2/second and of 50-300 mPa·second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: July 23, 2002
    Assignees: Super Silicon Crystal Research Institute Corporation, Ohtomo Chemical Industrial Corporation
    Inventors: Hiroshi Oishi, Keiichiro Asakawa, Junichi Matsuzaki, Akio Ashida
  • Patent number: 6221814
    Abstract: An aqueous cutting fluid which can reduce the impact on working environment and the global environment, and can achieve both preventing precipitates from becoming a hard cake and keeping high dispersibility for abrasive grains is provided. Such an aqueous cutting fluid is obtained by a method comprising dispersing abrasive grains (G) in an aqueous composition comprising a dispersion medium (M) containing a hydrophilic alcohol compound such as ethylene glycol, a lipophilic alcohol compound such as propylene glycol and water, and silica colloid particles dispersed stably in the medium. The dispersion medium (M) is odorless and not flammable. The abrasive grains (G) may settle out after a time, but they do not closely contact with one another, and therefore the resulting precipitates do not become a hard cake, which allows the re-dispersion and reuse of precipitated grains.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: April 24, 2001
    Assignees: Shin-Etsu Handotai Co., Ltd., Ohtomo Chemical Ind., Corp.
    Inventors: Shingo Kaburagi, Akio Ashida, Etsuo Kiuchi
  • Patent number: 6001265
    Abstract: A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurry waste fluid, and making a contribution to a reduction of a total slicing cost by reusing abrasive grains and water soluble coolant.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: December 14, 1999
    Assignees: Shin-Etsu Handotai Co., Ltd., Mimasu Semiconductor Industry Co., Ltd., Ohtomo Chemical Ind., Corp., Hitachi Zosen Metal Works Co., Ltd.
    Inventors: Kohei Toyama, Etsuo Kiuchi, Kazuo Hayakawa, Shingo Kaburagi, Akio Ashida, Takara Ito, Kuniaki Noami
  • Patent number: 5693596
    Abstract: A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity), Na salt of ethylenediamine tetraacetic acid (metallic ion adsorbent), benzotriazole (rust-preventing auxiliary agent), and a silicone type defoaming agent to the main component.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: December 2, 1997
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Shingo Kaburagi, Akio Ashida, Etsuo Kiuchi, Kazuo Hayakawa, Kohei Toyama