Patents by Inventor Akio Baba

Akio Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Oxazolidinone compounds and process for the preparation thereof
    Patent number: 6140506
    Abstract: The present invention produces novel cis-oxazolidinone compound which is racemic form or optically active form, of a formula (1) ##STR1## wherein R represents C.sub.1 -C.sub.6 alkyl group, C.sub.2 -C.sub.6 alkenyl group, C.sub.1 -C.sub.6 alkoxyl group, C.sub.1 -C.sub.6 alkylamino group, aryl group or halogen atom, and oxazolidinone ring is at cis-configuration, comprising reacting cis-1,2-indene epoxide of a formula (3) ##STR2## form, with sulfonyl isocyanate compound of a formula (4) ##STR3## in the presence of metal halide catalyst. Further, cis-1-amino-2-indanol is produced by hydrolyzing the oxazolidinone compound. The latter compound is useful as an intermediate of HIV-drug.
    Type: Grant
    Filed: December 30, 1998
    Date of Patent: October 31, 2000
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Akio Baba, Kenji Suzuki, Yoshinobu Yanagawa, Yoko Ohkuni, Takashi Oda, Masao Shimada, Masami Kozawa
  • Method for the pre-estimation of extruding pressure and extruding velocity in the extrusion molding of particle-reinforced composites
    Patent number: 5658507
    Abstract: The extrusion moldability of particle-reinforced composites under fresh cition relative to the extruding pressure and extruding velocity can be pre-estimated from the cohesion and the coefficient of internal friction of the composite which can be calculated from the relationship of, when a frame divided into the upper and lower halves are filled with the composite and the upper and lower halves of the frame are displaced relative to each other in the horizontal direction under a pressure on the composite filling the frame, the shear stress of the composite against slip deformation.
    Type: Grant
    Filed: July 24, 1995
    Date of Patent: August 19, 1997
    Assignees: Japan as represented by Director General of Agency of Industrial Science and Technology, Japan as represented by Director General of Building Research Institute
    Inventors: Akiko Mori, Akio Baba
  • Method for applying a solder resist ink to a printed wiring board
    Patent number: 4301189
    Abstract: A method of manufacturing a printed wiring board completely free from trouble of solder bridging. The printed wiring board of the present invention is provided with a raised portion of solder resist ink in the form of a ridge around the periphery of the land to be printed or at an area between adjacent lands to be soldered, the said raised portion being an extension of a solder resist thin layer coated on the insulator base board exclusive the said land.
    Type: Grant
    Filed: June 2, 1980
    Date of Patent: November 17, 1981
    Assignee: Tokyo Print Co., Ltd.
    Inventors: Minoru Arai, Akio Baba
  • Printed wiring board
    Patent number: 4220810
    Abstract: A new and unique printed wiring board completely free from trouble of solder bridging that often takes place with the conventional printed wiring board. The printed wiring board of the present invention is provided with a raised portion of solder resist ink in the form of a ridge around the periphery of the land to be printed or at an area between adjacent lands to be soldered, the said raised portion being an extension of a solder resist thin layer coated on the insulator base board exclusive the said land.
    Type: Grant
    Filed: December 7, 1978
    Date of Patent: September 2, 1980
    Assignee: Tokyo Print Industry Co., Ltd.
    Inventors: Minoru Arai, Akio Baba