Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Abstract: A resistor having reliability in electrical connection between an upper surface electrode and a side face electrode, and in bonding strength between a first thin film and a second thin film is provided. The resistor includes upper surface electrodes formed on a main surface a substrate and side face electrodes disposed to side faces of the substrate and connected electrically to the pair of upper surface electrodes, respectively. The upper surface electrode includes a first upper surface electrode layer and a bonding layer overlying the first upper surface electrode layer. The side face electrode includes a first thin film disposed to a side face of the substrate, a second thin film composed of copper-base alloy film and connected electrically to the first thin film, a first plating film formed by nickel plating for covering the second thin film, and a second plating film covering the first plating film.

Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: A resistor having reliability in electrical connection between an upper surface electrode and a side face electrode, and in bonding strength between a first thin film and a second thin film is provided. The resistor includes upper surface electrodes formed on a main surface a substrate and side face electrodes disposed to side faces of the substrate and connected electrically to the pair of upper surface electrodes, respectively. The upper surface electrode includes a first upper surface electrode layer and a bonding layer overlying the first upper surface electrode layer. The side face electrode includes a first thin film disposed to a side face of the substrate, a second thin film composed of copper-base alloy film and connected electrically to the first thin film, a first plating film formed by nickel plating for covering the second thin film, and a second plating film covering the first plating film.

Abstract: An object of the present invention is to provide chip electronic components excellent in mass production feasibility, of which the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component of the present invention comprises a substrate 11, and side electrodes 15 disposed at the end portions of the substrate 11, wherein the lightness of an entire surface of the side electrode 15 is not more than 6 as defined in JIS-Z8721.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate (11) made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer (12) formed on a top face of discrete substrate (11); resistor layer (13) formed such that a part of resistor layer (13) overlaps top electrode layer (12); protective layers (14, 16) formed so as to cover resistor layer (13); side electrode layer (17) formed on a side face of discrete substrate (11) such that side electrode layer is electrically coupled to top electrode layer (12).

Abstract: A pair of upper electrode layers 12, connected to resistor layer 14, is formed with a gold system electro-conductive material containing glass frit on the side portion towards the edge of the upper surface of substrate 11. The adhesive strength of which electrode layer to the substrate 11 is strong enough and the electrode layer withstands a thermal stress and a corrosive environment. A resistor thus manufactured maintains its superior electrical characteristics with a high operational reliability even in the harsh operating environment where there is a thermal amplitude lasting for a long term, in a corrosive atmosphere, etc.

Abstract: The present invention minimizes the deviations of desired fuse time in the resistors with fuse function, and this is made of a resistor layer 21 consisting of fine electro-conductive particles, fine glass particles having a melting temperature higher than the forming temperature of the fine electro-conductive particles, a solvent dispersing these particles uniformly, and metal caps 23 connecting resistor film 21 at the ends of substrate 22.

Abstract: A high precision chip resistor having a low resistance and a small TCR is obtained. This chip resistor includes an insulating substrate, a resistive layer made of a Cu--Ni alloy formed at least on one face of the insulating substrate, and end face electrodes provided on a pair of end faces of the insulating substrate facing each other so as to be connected to the resistive layer. The resistive layer is formed by heat-treating a plating layer containing Cu and Ni at high temperature. The end face electrodes are formed by metal thin film deposition technique at low temperature. A method for producing the chip resistor is also provided.