Abstract: Provided are a non-contact charging module and a non-contact charging instrument such that the non-contact module can be made thin in a state where a sufficient cross-sectional area of a planar coil portion has been ensured and power transmission efficiency has been enhanced. The non-contact module comprises the planar coil portion (2) on which a plurality of conducting wires have been spirally wound, and a magnetic sheet provided so as to oppose a surface of a coil (21) of the planar coil portion (2), the plurality of conducting wires are respectively connected together at both ends, and the planar coil portion (2) has a part wound overlapped in multiple layers and another part wound in a single layer.

Abstract: It is an object to provide a non-contact charging module that uses a magnet included in a counterpart-side non-contact charging module or does not use the magnet when aligning with the counterpart-side non-contact charging module is performed. An L value of a coil that is provided in the non-contact charging module is not changed. This non-contact charging module includes a planar coil portion where electrical lines are wound and a magnetic sheet that places a coil surface of the planar coil portion and faces the coil surface of the planar coil portion, and in the magnetic sheet, a hole portion is provided at the position corresponding to a hollow portion of the planar coil portion.

Abstract: It is an object to provide a non-contact charging module that prevents the magnet from negatively influencing particularly the inside portion of a coil and improves power transmission efficiency, even when a magnet is used for alignment. This non-contact charging module is a reception-side non-contact charging module, to which power is transmitted from a transmission-side non-contact charging module which is equipped with magnet, by electromagnetic induction, in which the non-contact charging module includes a planar coil portion around which spiral electric lines are wound, and a magnetic sheet disposed to face the surface of coil of the planar coil portion so that it faces the magnet of the transmission-side contact module, in which the inner diameter of the planar coil portion is larger than the magnet.

Abstract: An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.

Abstract: A multilayer capacitor 1 has a laminated body 20 configured by laminating a plurality of dielectric substrates 2 each having a plurality of internal electrodes 3 and 5 formed on its main surface and a capacitance component is generated between the facing internal electrodes 3 and 5. The dielectric constant of the dielectric substrate located at a central portion of a lamination direction of the laminated body 20 is lower than that of the dielectric substrate 2 located at the edge of the lamination direction.

Abstract: A mulitilayer A capacitor includes a plurality of dielectric substrates (2) which are layered; a pair of terminal electrodes formed on the plurality of dielectric substrates; a plurality of internal electrodes (3) arranged on each of the dielectric substrates and having outer edges (30) opposed apart by a predetermined interval, wherein at least one of the internal electrodes (3) is arranged apart from the adjacent internal electrode (3) by the maximum interval (5) at the center of the outer edges (30).

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

Abstract: A multilayer capacitor 1 has a laminated body 20 configured by laminating a plurality of dielectric substrates 2 each having a plurality of internal electrodes 3 and 5 formed on its main surface and a capacitance component is generated between the facing internal electrodes 3 and 5. The dielectric constant of the dielectric substrate located at a central portion of a lamination direction of the laminated body 20 is lower than that of the dielectric substrate 2 located at the edge of the lamination direction.

Abstract: An electronic component includes plural elements, a pair of terminal sections provided to each one of the elements, and a packaging material covering the elements and parts of the terminal sections. A non-conductive shielding section is provided between the terminal sections led outside the packaging material. The presence of the shielding section allows the electronic component to downsize the electronic apparatus, embody a greater density in mounting, and eliminate adverse influence to the apparatus for achieving higher performance as well as improving the durability.

Abstract: A multilayer capacitor including a base body, which is a dielectric substance; and a plurality of electrode layers, which is laminated in the base body and has a plurality of divided electrodes, in which there are at least three or more kinds of electrode layers having different number of electrodes, and the electrode layer having the most electrodes is interposed between the other electrode layers. The multilayer capacitor achieves high withstand voltage and high reliability with no damage to the size reduction and high capacitance of the capacitor and a mold capacitor having the multilayer capacitor built-in.

Abstract: A multilayer capacitor including a base body, which is a dielectric substance; and a plurality of electrode layers, which is laminated in the base body and has a plurality of divided electrodes, in which there are at least three or more kinds of electrode layers having different number of electrodes, and the electrode layer having the most electrodes is interposed between the other electrode layers. The multilayer capacitor achieves high withstand voltage and high reliability with no damage to the size reduction and high capacitance of the capacitor and a mold capacitor having the multilayer capacitor built-in.

Abstract: An electronic component is provided which has a plurality of elements, a pair of terminal parts which are disposed on the element, and an armoring material which covers the elements and a part of the terminal parts. The electronic component has a configuration such that the plurality of elements are disposed in the armoring material at a predetermined interval, and a guiding part for guiding the armoring material toward an opposed region of the element is disposed on opposed surfaces between the elements.

Abstract: An electronic component includes plural elements, a pair of terminal sections provided to each one of the elements, and a packaging material covering the elements and parts of the terminal sections. A non-conductive shielding section is provided between the terminal sections led outside the packaging material. The presence of the shielding section allows the electronic component to downsize the electronic apparatus, embody a greater density in mounting, and eliminate adverse influence to the apparatus for achieving higher performance as well as improving the durability.

Abstract: An electronic component which has a plurality of elements, a pair of terminal parts which are disposed on the element, and an armoring material which covers the elements and a part of the terminal parts, and of such a configuration that the plurality of elements are disposed in the armoring material at a predetermined interval, and a guiding part of the armoring material toward an opposed region of the element is disposed on an opposed surfaces between the elements.

Abstract: The present invention aims at providing an electronic component that can be readily reduced in size. Further, even when the electronic component is reduced in size, the miniaturized electronic component has (i) a wide range in capacitance, (ii) is allowed to be produced easily, (iii) has excellent electrical characteristics and (iv) can prevent defects due to a poor connection between the electronic component and a circuit board caused by warpage of the circuit board and the like when the electronic component is connected to the circuit board. The electronic component includes a capacitor element with a pair of lead terminals and an exterior packaging material disposed so as to encapsulate the capacitor element. The maximum length of the exterior packaging material is 7.5 mm or less and the maximum length of the capacitor element is 5.5 mm or less. Capacitance C of the capacitor element satisfies an inequality of 4 pF≦C≦4700 pF and a DC break down voltage BDV satisfies an inequality of BDV≧4.5 KV.

Abstract: The present invention aims at providing an electronic component that can be readily reduced in size. Further, even when the electronic component is reduced in size, the miniaturized electronic component has (i) a wide range in capacitance, (ii) is allowed to be produced easily, (iii) has excellent electrical characteristics and (iv) can prevent defects due to a poor connection between the electronic component and a circuit board caused by warpage of the circuit board and the like when the electronic component is connected to the circuit board. The electronic component includes a capacitor element with a pair of lead terminals and an exterior packaging material disposed so as to encapsulate the capacitor element. The maximum length of the exterior packaging material is 7.5 mm or less and the maximum length of the capacitor element is 5.5 mm or less. Capacitance C of the capacitor element satisfies an inequality of 4 pF≦C≦4700 pF and a DC break down voltage BDV satisfies an inequality of BDV≧4.5 KV.

Abstract: A surface mount component includes a substrate having two main faces, and first electrodes made of a metal, such as zinc, which is unlikely to cause migration. The first electrodes are formed on most of the entire face of both main faces of the substrate. Second electrodes made of a superior bonding material, such as copper, are disposed on the first electrodes. Lead terminals are bonded to the second electrodes by a bonding material, and an external packaging material covers the surface mount component. This configuration suppresses the occurrence of migration and improves resistance to electrical breakdown.

Abstract: A surface-mount type ceramic capacitor particularly suitable for use in an intermediate to high tension circuit is disclosed, wherein lead terminals are spaced from a dielectric ceramic substrate except for a portion joined with electrodes. With this spaced arrangement, the ceramic capacitor has a high electric breakdown strength and an improved heat-resisting property and, hence, is capable of operating reliably over a long period of use.

Abstract: The lower mold which forms the external side of the vehicle wheel is water-cooled by water-cooling pipes. The rib-forming portions of the upper mold which forms the internal side of the vehicle wheel are forcibly air-cooled by the air passages provided along the rib-forming portions. Since water-cooling has better cooling capacity than air-cooling, the molten material inside the cavity between the lower mold and the upper mold is solidified from the external side thereof, and no defects such as shrinkage cavities occur on the external side thereof. When the internal side is solidified, the rib portions are solidified not much later than the other portion of the internal side, thereby shortening the casting cycle time. The split molds which form the cavity for forming therein the rim portion of the vehicle wheel are opened earlier than the upper mold, at the time when the surface layer portion of the molten material in the cavity has been solidified.

Abstract: A process for casing a fiber-reinforced metal body by placing a shaped fibrous article made of a reinforcing fiber into a cavity in a casting mold and filling a molten metal into the shaped fibrous article to solidify it, the process further including the steps of pouring the molten metal into the cavity from the lower portion thereof, while venting gas present within the cavity through a gas vent passage having a very small opening communicating with the upper portion of the cavity, and closing the gas vent passage and completely solidifying the molten metal under a higher pressure.