Patents by Inventor Akio Idei
Akio Idei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7826217Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.Type: GrantFiled: December 5, 2008Date of Patent: November 2, 2010Assignee: Hitachi, Ltd.Inventors: Yoshihiro Kondo, Akio Idei, Shigeyasu Tsubaki, Hitoshi Matsushima, Tadakatsu Nakajima, Hiroyuki Toyoda, Tomoo Hayashi, Tatsuya Saito, Takeshi Kato, Kenji Ogiro
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Publication number: 20100187037Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.Type: ApplicationFiled: April 1, 2010Publication date: July 29, 2010Applicant: Hitachi, Ltd.Inventors: Akira Goto, Akio Idei, Shigeyasu Tsubaki
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Publication number: 20100124012Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.Type: ApplicationFiled: November 18, 2009Publication date: May 20, 2010Inventors: Yoshihiro KONDO, Tadakatsu NAKAJIMA, Akio IDEI, Shigeyasu TSUBAKI, Hiroyuki TOYODA, Tomoo HAYASHI
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Publication number: 20100078258Abstract: Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.Type: ApplicationFiled: August 6, 2009Publication date: April 1, 2010Inventors: Yosuke TANABE, Masanori Watanabe, Akira Goto, Shigeyasu Tsubaki, Masahiko Usui, Akio Idei
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Publication number: 20100073863Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.Type: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Hitoshi MATSUSHIMA, Tadakatsu Nakajima, Takayuki Atarashi, Yoshihiro Kondo, Hiroyuki Toyoda, Tomoo Hayashi, Akio Idei, Shigeyasu Tsubaki, Takumi Sugiura, Yasuhiro Kashirajima
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Publication number: 20100073866Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.Type: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Hiroyuki TOYODA, Akio Idei, Shigeyasu Tsubaki, Tadakatsu Nakajima, Yoshihiro Kondo, Tomoo Hayashi
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Publication number: 20100073865Abstract: An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conductinType: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Tomoo HAYASHI, Tadakatsu Nakajima, Yoshihiro Kondo, Hiroyuki Toyoda, Akio Idei, Shigeyasu Tsubaki
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Publication number: 20100033931Abstract: A cooling unit which improves the cooling efficiency of a server rack and minimizes rise in the server room temperature. A cooling unit for a server rack housing a server with a heat source includes: a fan unit having an array of fans for discharging hot air generated by the heat source from the rack; and a radiator unit having an array of pipes for guiding coolant to remove heat from the hot air discharged from the rack by rotation of the fans; and a frame unit which integrally combines the fan unit and the radiator unit. The cooling unit constructs a back door from which the hot air inside the rack is discharged.Type: ApplicationFiled: February 26, 2009Publication date: February 11, 2010Inventors: Tomoyuki MIYAZAWA, Takeshi ARAYA, Akio IDEI, Hiroshi IWATA, Kaname IETA, Tsuyoshi EBATO
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Publication number: 20090154104Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.Type: ApplicationFiled: December 5, 2008Publication date: June 18, 2009Inventors: Yoshihiro Kondo, Akio Idei, Shigeyasu Tsubaki, Hitoshi Matsushima, Tadakatsu Nakajima, Hiroyuki Toyoda, Tomoo Hayashi, Tatsuya Saito, Takeshi Kato, Kenji Ogiro
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Publication number: 20090096957Abstract: To provide a liquid crystal display device having excellent uniformity in the brightness so that the performance of displays of liquid crystal can be increased. A liquid crystal display device is provided with: a support member: a heat releasing member provided on this support member; a light guiding plate 121 provided on a rear surface of a liquid crystal panel; and a light source module 124 which is thermally secured to the heat releasing member so as to face an entrance surface 121a formed on one or two sides in the direction of the length of the light guiding plate 121 and has a light source for emitting a light beam toward the entrance surface 121a, wherein the light source is covered with a lens 124c in the light source module 124, and the distance D between the lens 124c and the entrance surface 121a when the light source module 124 is not driven is set within a certain range.Type: ApplicationFiled: October 15, 2008Publication date: April 16, 2009Inventors: Ikuo Hiyama, Akitoyo Konno, Makoto Abe, Akio Idei, Kaoru Katayama
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Publication number: 20060227515Abstract: A cooling apparatus for cooling a plurality of electronic devices each having a large heating value and a small area, capable of effectively cooling the semiconductor chips with the use of a single cooler, comprises a plurality of thermal conductors mounted on the electronic devices and formed with thermal conductive fins, a housing formed with fins fitted with the fins of the thermal conductors, and a cooling device mounted on the housing, for removing heat from the electronic devices, wherein the housing is formed therein with a plane heat-pipe.Type: ApplicationFiled: March 2, 2006Publication date: October 12, 2006Applicant: Hitachi, Ltd.Inventors: Takafumi Enami, Akio Idei, Shigemasa Sato, Chikakazu Ninomiya
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Patent number: 6632780Abstract: There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.Type: GrantFiled: March 5, 2001Date of Patent: October 14, 2003Assignee: Hitachi, Ltd.Inventors: Takao Uematsu, Yutaka Ito, Takahiro Daikoku, Akio Idei, Akihiro Yasuda
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Patent number: 5959351Abstract: There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.Type: GrantFiled: August 9, 1993Date of Patent: September 28, 1999Assignee: Hitachi, Ltd.Inventors: Shigeyuki Sasaki, Tadakatsu Nakajima, Noriyuki Ashiwake, Yasuo Ohsone, Toshio Hatada, Toshiki Iino, Akio Idei, Kenichi Kasai
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Patent number: 5774334Abstract: Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module.Type: GrantFiled: August 28, 1995Date of Patent: June 30, 1998Assignee: Hitachi, Ltd.Inventors: Keizo Kawamura, Noriyuki Ashiwake, Takahiro Daikoku, Akio Idei, Kenichi Kasai, Hideyuki Kimura, Atsuo Nishihara, Toshio Hatada, Shigeyuki Sasaki
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Patent number: 5751062Abstract: A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.Type: GrantFiled: December 13, 1995Date of Patent: May 12, 1998Assignee: Hitachi, Ltd.Inventors: Takahiro Daikoku, Fumiyuki Kobayashi, Noriyuki Ashiwake, Kenichi Kasai, Keizou Kawamura, Akio Idei
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Patent number: 5406807Abstract: An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.Type: GrantFiled: June 16, 1993Date of Patent: April 18, 1995Assignee: Hitachi, Ltd.Inventors: Noriyuki Ashiwake, Tadakatsu Nakajima, Shigeyuki Sasaki, Yasuo Ohsone, Toshio Hatada, Toshiki Iino, Kenichi Kasai, Akio Idei