Abstract: A metal terminal where a connecting portion has a receiving portion which receives a wire and a contact segment which extends from the receiving portion by way of a bending scheduled portion is prepared. By applying heat and pressure in a state where the wire is placed on the receiving portion for temporarily fixing the wire, the wire is adhered to the receiving portion using a molten or softened insulating resin coating as an adhesive agent. Next, the connecting portion is bent by way of the bending scheduled portion such that the contact segment faces the receiving portion by way of the wire and the contact segment is brought into contact with the wire. Next, by irradiating a laser beam to a portion of the metal terminal, the wire and the metal terminal are welded to each other.

Abstract: A coil component includes a conducting wire and a terminal electrode. The terminal electrode includes a first terminal piece and a second terminal piece that face and overlap each other with the conducting wire interposed therebetween. The first terminal piece and the second terminal piece are coupled to one another with a coupling portion and are integrated in a welded ball at a position different from a position of the coupling portion. An end portion of the conducting wire is in the welded ball.

Abstract: A coil component including a core, first metal terminals, second metal terminals and a wire. The first metal terminals and second metal terminals have mounting portions provided above the mounting surface and aligned above the mounting surface. One of the mounting portions of the first metal terminals has a first end surface facing one of the mounting portions of the second metal terminals and a second end surface other than the first end surface, and the first end surface has a chopped trace where surface roughness is higher than surface roughness of the second end surface.

Abstract: The sum of the area of a region occupied by a top surface of a first flange portion and the area of a region occupied by a top surface of a second flange portion is ? or larger the area of an imaginary quadrangle defined by two vertices on the side of the outer periphery of the top surface of the first flange portion, and two vertices on the side of the outer periphery of the top surface of the second flange portion.

Abstract: A coil component including a wire has a central conductor and an insulating coating layer, and a terminal electrode has a connection part that is electrically connected to the central conductor. The connection part includes a receiving part that receives an end portion of the wire, and a welding part that extends from the receiving part via a fold-back part so as to face the receiving part. The wire becomes sandwiched between the receiving part and the welding part. The central conductor is welded to the welding part in the portion from which the insulating coating layer is removed. The distal end portion of the wire protrudes from the space between the receiving part and the welding part, with the insulating coating layer remaining on the distal end portion.

Abstract: A terminal electrode includes a base extending along the outer end face of a flange, a mounting part extending from the base along the bottom face of the flange via a first bending part that covers the edge portion where the outer end face and the bottom face meet, and a wire connection part extending from the base along a substantially horizontal face via a second bending part that covers the edge portion where the outer end face and the substantially horizontal face meet, the wire connection part being electrically connected to an end portion of a wire.

Abstract: A terminal electrode is secured to a flange portion with an adhesive and includes a base disposed on an outer surface of the flange portion and a mounting portion disposed above a bottom surface of the flange portion and extending from a bent portion extending from the base and covering a ridge line along which the outer surface and the bottom surface meet. The mounting portion is not secured to the flange portion.

Abstract: In the coil component, for dimensions measured along a predetermined direction of a winding core portion, a dimension of each of top surfaces of first and second flange portions is equal to or larger than a dimension of the winding core portion.

Abstract: The sum of the area of a region occupied by a top surface of a first flange portion and the area of a region occupied by a top surface of a second flange portion is ? or larger the area of an imaginary quadrangle defined by two vertices on the side of the outer periphery of the top surface of the first flange portion, and two vertices on the side of the outer periphery of the top surface of the second flange portion.

Abstract: A coil component has a core having a winding core portion and first and second flange portions, a plurality of wires wound around the winding core portion, and a plurality of electrode portions disposed on the first and second flange portions. The first wire and the third wire cross each other on the first flange portion. The first flange portion has a groove at a position of crossing of the first wire and the third wire. The first wire on the lower side passes through the groove so that the first wire and the third wire are separated from each other.

Abstract: A coil component includes two or more coils configuring a common mode choke coil and functions as an inductor against a normal mode AC current. A coil component includes a pot-type core formed in a box-like shape, a flat plate core, coils, and a partition core formed of a magnetic substance. The coils are accommodated inside the pot-type core and form a common mode choke coil by making the central axes thereof substantially match each other. Further, each of end portions of the coils function as outer electrodes. The partition core is provided between the coils.

Abstract: An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section.

Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.

Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.

Abstract: In a printing system in which a roll film is rolled out to be printed by a printer and the film is rolled up after printing and drying, there is a possibility that wrinkles of the film are generated when printing, and printed materials are scratched because the printed film is positioned near the printer. Both end side of a suction stage in the film delivery direction are formed in a circular arc shape, and auxiliary stages are provided near the end portions to suck and hold a film, the auxiliary stages are allowed to be moved lower than a surface of the suction stage in the state to closely attach the film to the suction stage while applying tension to the film, and the film is sucked and held on the suction stage in the state to be printed after position adjustment to a surface of a mask.

Abstract: A substrate is mounted on a first conveying carrier including a flat surface, transferred onto a printing table of a flux printer, transferred from the flux printer onto a second conveying carrier, transferred from the second conveying carrier onto a printing table of a solder ball printer, and transferred from the solder ball printer onto a third conveying carrier using a first carry-in mechanism, a first carry-out mechanism, a second carry-in mechanism, and a second carry-out mechanism including a plurality of vacuum attraction pads. Images of alignment marks provided at four corners of the substrate on the printing tables and four corners of a mask are simultaneously picked up by separate camera units on a front side and a rear side in a conveying direction to calculate a positional deviation amount.

Abstract: The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

Abstract: In a printing system in which a roll film is rolled out to be printed by a printer and the film is rolled up after printing and drying, there is a possibility that wrinkles of the film are generated when printing, and printed materials are scratched because the printed film is positioned near the printer. Both end sides of a suction stage in the film delivery direction are formed in a circular arc shape, and auxiliary stages are provided near the end portions to suck and hold a film, the auxiliary stages are allowed to be moved lower than a surface of the suction stage in the state to closely attach the film to the suction stage while applying tension to the film, and the film is sucked and held on the suction stage in the state to be printed after position adjustment to a surface of a mask.

Abstract: Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.

Abstract: The present invention provides a solder ball printing apparatus and a solder ball printing method in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball feeding unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached so as to surround a solder ball shaking and discharging port of the solder ball feeding unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball loading members, each of which is arranged in the front and rear of the wire member in a convex shape to load the solder balls into an opening area of a mask.