Patents by Inventor Akio ITAMURA

Akio ITAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless Co—W plating film
    Patent number: 11718916
    Abstract: An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 ?m or more.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: August 8, 2023
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Shoji Iguchi, Akio Itamura, Shoichi Fukui, Yukinori Oda, Masaaki Sato, Yoshihito Il, Hiroki Okubo
  • ELECTROLESS Co-W PLATING FILM AND ELECTROLESS Co-W PLATING SOLUTION
    Publication number: 20220389587
    Abstract: An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 ?m or more.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 8, 2022
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Shoji IGUCHI, Akio ITAMURA, Shoichi FUKUI, Yukinori ODA, Masaaki SATO, Yoshihito II, Hiroki OKUBO