Patents by Inventor Akio Kaneda
Akio Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984924Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.Type: GrantFiled: December 12, 2019Date of Patent: May 14, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Seima Kondo, Satoshi Tanaka, Satoshi Arayashiki, Hiroyuki Furusato, Jin Yokoyama, Toru Yamaji, Akio Kaneda, Kiwamu Sakano, Junichi Yoshioka, Tatsuya Tsujiguchi, Atushi Ono
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Publication number: 20230370105Abstract: A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.Type: ApplicationFiled: July 25, 2023Publication date: November 16, 2023Inventors: Hiroyuki NAGAMORI, Akio KANEDA, Hiroshi MURANAKA, Hideki TSUKAMOTO, Daisuke ITO, Kiwamu SAKANO, Daisuke MIYAZAKI
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Patent number: 11757482Abstract: A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.Type: GrantFiled: August 21, 2020Date of Patent: September 12, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroyuki Nagamori, Akio Kaneda, Hiroshi Muranaka, Hideki Tsukamoto, Daisuke Ito, Kiwamu Sakano, Daisuke Miyazaki
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Publication number: 20200382149Abstract: A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.Type: ApplicationFiled: August 21, 2020Publication date: December 3, 2020Inventors: Hiroyuki NAGAMORI, Akio KANEDA, Hiroshi MURANAKA, Hideki TSUKAMOTO, Daisuke ITO, Kiwamu SAKANO, Daisuke MIYAZAKI
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Patent number: 10812047Abstract: An elastic wave filter apparatus includes a transmission-side filter, a reception-side filter, an antenna terminal, and a matching circuit. The matching circuit is connected between a common node of the transmission-side filter and the reception-side filter and the antenna terminal. The transmission-side filter includes a ladder circuit and filter inductors. The matching circuit includes a matching inductor. The ladder circuit includes series arm resonators and parallel arm resonators. The matching inductor is connected between a transmission line connecting the common node and the antenna terminal and a first terminal of the filter inductor on the side of the parallel arm resonator.Type: GrantFiled: December 19, 2018Date of Patent: October 20, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takuma Genji, Akio Kaneda
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Patent number: 10797218Abstract: A substrate includes a substrate main body that includes a first main surface and a second main surface facing the first main surface. First electrode lands are disposed inside a recessed portion of the first main surface of the substrate main body. Second electrode lands are disposed in a region outside the recessed portion. The first electrode land and the second electrode land are connected to different electric potentials.Type: GrantFiled: June 30, 2017Date of Patent: October 6, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Akio Kaneda
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Publication number: 20200195295Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.Type: ApplicationFiled: December 12, 2019Publication date: June 18, 2020Inventors: Seima KONDO, Satoshi TANAKA, Satoshi ARAYASHIKI, Hiroyuki FURUSATO, Jin YOKOYAMA, Toru YAMAJI, Akio KANEDA, Kiwamu SAKANO, Junichi YOSHIOKA, Tatsuya TSUJIGUCHI, Atushi ONO
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Patent number: 10476473Abstract: An elastic wave element includes a piezoelectric substrate, an IDT electrode including a first comb-shaped electrode and a second comb-shaped electrode, and reflectors. Each of the reflectors includes a first reflective busbar electrode, a second reflective busbar electrode, and reflective electrode fingers. The first comb-shaped electrode includes a first busbar electrode connected to the first reflective busbar electrodes, and first electrode fingers. The second comb-shaped electrode includes a second busbar electrode and second electrode fingers. In in-between areas, in each of which a reflective electrode finger and a first electrode finger adjacent to each other in the elastic-wave propagation direction face each other, connecting electrodes which electrically couple the reflective electrode fingers to the first electrode fingers are provided.Type: GrantFiled: December 21, 2018Date of Patent: November 12, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Akio Kaneda
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Publication number: 20190131955Abstract: An elastic wave element includes a piezoelectric substrate, an IDT electrode including a first comb-shaped electrode and a second comb-shaped electrode, and reflectors. Each of the reflectors includes a first reflective busbar electrode, a second reflective busbar electrode, and reflective electrode fingers. The first comb-shaped electrode includes a first busbar electrode connected to the first reflective busbar electrodes, and first electrode fingers. The second comb-shaped electrode includes a second busbar electrode and second electrode fingers. In in-between areas, in each of which a reflective electrode finger and a first electrode finger adjacent to each other in the elastic-wave propagation direction face each other, connecting electrodes which electrically couple the reflective electrode fingers to the first electrode fingers are provided.Type: ApplicationFiled: December 21, 2018Publication date: May 2, 2019Inventor: Akio KANEDA
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Publication number: 20190123715Abstract: An elastic wave filter apparatus includes a transmission-side filter, a reception-side filter, an antenna terminal, and a matching circuit. The matching circuit is connected between a common node of the transmission-side filter and the reception-side filter and the antenna terminal. The transmission-side filter includes a ladder circuit and filter inductors. The matching circuit includes a matching inductor. The ladder circuit includes series arm resonators and parallel arm resonators. The matching inductor is connected between a transmission line connecting the common node and the antenna terminal and a first terminal of the filter inductor on the side of the parallel arm resonator.Type: ApplicationFiled: December 19, 2018Publication date: April 25, 2019Inventors: Takuma GENJI, Akio KANEDA
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Publication number: 20170309807Abstract: A substrate includes a substrate main body that includes a first main surface and a second main surface facing the first main surface. First electrode lands are disposed inside a recessed portion of the first main surface of the substrate main body. Second electrode lands are disposed in a region outside the recessed portion. The first electrode land and the second electrode land are connected to different electric potentials.Type: ApplicationFiled: June 30, 2017Publication date: October 26, 2017Inventor: Akio KANEDA
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Patent number: D538572Type: GrantFiled: November 23, 2005Date of Patent: March 20, 2007Inventors: Akio Kaneda, Katsuji Takata