Patents by Inventor Akio Kaneda

Akio Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984924
    Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Seima Kondo, Satoshi Tanaka, Satoshi Arayashiki, Hiroyuki Furusato, Jin Yokoyama, Toru Yamaji, Akio Kaneda, Kiwamu Sakano, Junichi Yoshioka, Tatsuya Tsujiguchi, Atushi Ono
  • Publication number: 20230370105
    Abstract: A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Hiroyuki NAGAMORI, Akio KANEDA, Hiroshi MURANAKA, Hideki TSUKAMOTO, Daisuke ITO, Kiwamu SAKANO, Daisuke MIYAZAKI
  • Patent number: 11757482
    Abstract: A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: September 12, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroyuki Nagamori, Akio Kaneda, Hiroshi Muranaka, Hideki Tsukamoto, Daisuke Ito, Kiwamu Sakano, Daisuke Miyazaki
  • Publication number: 20200382149
    Abstract: A frontend circuit includes a wide-band filter, a transmit filter, and switches. The wide-band filter passes both the receive frequency band of a first communication frequency band and that of a second communication frequency band which is close to or overlaps that of the first communication frequency band. The transmit filter passes the transmit frequency band of the first or second communication frequency band. The switches are capable of simultaneously bringing, into conduction, at least two of multiple filters including the wide-band filter and the transmit filter. In carrier aggregation using the receive frequency bands of the first and second communication frequency bands, the switches simultaneously bring the wide-band filter and the transmit filter into conduction. Thus, in carrier aggregation using signals of multiple communication frequencies simultaneously in communication, attenuation of signals due to signal leakage in two receive frequency bands, which are close to each other, is suppressed.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 3, 2020
    Inventors: Hiroyuki NAGAMORI, Akio KANEDA, Hiroshi MURANAKA, Hideki TSUKAMOTO, Daisuke ITO, Kiwamu SAKANO, Daisuke MIYAZAKI
  • Patent number: 10812047
    Abstract: An elastic wave filter apparatus includes a transmission-side filter, a reception-side filter, an antenna terminal, and a matching circuit. The matching circuit is connected between a common node of the transmission-side filter and the reception-side filter and the antenna terminal. The transmission-side filter includes a ladder circuit and filter inductors. The matching circuit includes a matching inductor. The ladder circuit includes series arm resonators and parallel arm resonators. The matching inductor is connected between a transmission line connecting the common node and the antenna terminal and a first terminal of the filter inductor on the side of the parallel arm resonator.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takuma Genji, Akio Kaneda
  • Patent number: 10797218
    Abstract: A substrate includes a substrate main body that includes a first main surface and a second main surface facing the first main surface. First electrode lands are disposed inside a recessed portion of the first main surface of the substrate main body. Second electrode lands are disposed in a region outside the recessed portion. The first electrode land and the second electrode land are connected to different electric potentials.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: October 6, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akio Kaneda
  • Publication number: 20200195295
    Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 18, 2020
    Inventors: Seima KONDO, Satoshi TANAKA, Satoshi ARAYASHIKI, Hiroyuki FURUSATO, Jin YOKOYAMA, Toru YAMAJI, Akio KANEDA, Kiwamu SAKANO, Junichi YOSHIOKA, Tatsuya TSUJIGUCHI, Atushi ONO
  • Patent number: 10476473
    Abstract: An elastic wave element includes a piezoelectric substrate, an IDT electrode including a first comb-shaped electrode and a second comb-shaped electrode, and reflectors. Each of the reflectors includes a first reflective busbar electrode, a second reflective busbar electrode, and reflective electrode fingers. The first comb-shaped electrode includes a first busbar electrode connected to the first reflective busbar electrodes, and first electrode fingers. The second comb-shaped electrode includes a second busbar electrode and second electrode fingers. In in-between areas, in each of which a reflective electrode finger and a first electrode finger adjacent to each other in the elastic-wave propagation direction face each other, connecting electrodes which electrically couple the reflective electrode fingers to the first electrode fingers are provided.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akio Kaneda
  • Publication number: 20190131955
    Abstract: An elastic wave element includes a piezoelectric substrate, an IDT electrode including a first comb-shaped electrode and a second comb-shaped electrode, and reflectors. Each of the reflectors includes a first reflective busbar electrode, a second reflective busbar electrode, and reflective electrode fingers. The first comb-shaped electrode includes a first busbar electrode connected to the first reflective busbar electrodes, and first electrode fingers. The second comb-shaped electrode includes a second busbar electrode and second electrode fingers. In in-between areas, in each of which a reflective electrode finger and a first electrode finger adjacent to each other in the elastic-wave propagation direction face each other, connecting electrodes which electrically couple the reflective electrode fingers to the first electrode fingers are provided.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 2, 2019
    Inventor: Akio KANEDA
  • Publication number: 20190123715
    Abstract: An elastic wave filter apparatus includes a transmission-side filter, a reception-side filter, an antenna terminal, and a matching circuit. The matching circuit is connected between a common node of the transmission-side filter and the reception-side filter and the antenna terminal. The transmission-side filter includes a ladder circuit and filter inductors. The matching circuit includes a matching inductor. The ladder circuit includes series arm resonators and parallel arm resonators. The matching inductor is connected between a transmission line connecting the common node and the antenna terminal and a first terminal of the filter inductor on the side of the parallel arm resonator.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 25, 2019
    Inventors: Takuma GENJI, Akio KANEDA
  • Publication number: 20170309807
    Abstract: A substrate includes a substrate main body that includes a first main surface and a second main surface facing the first main surface. First electrode lands are disposed inside a recessed portion of the first main surface of the substrate main body. Second electrode lands are disposed in a region outside the recessed portion. The first electrode land and the second electrode land are connected to different electric potentials.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 26, 2017
    Inventor: Akio KANEDA
  • Patent number: D538572
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: March 20, 2007
    Inventors: Akio Kaneda, Katsuji Takata