Abstract: A connection terminal includes a terminal main body, a contact member, a locking structure, and a position adjustment structure. The terminal main body is electrically conductive and includes a female connector. The contact member is disposed, in a first region of an internal space of the female connector, to face an inner circumferential surface of the female connector. The locking structure holds the contact member at a position thereof after completion of housing of the contact member in the internal space. The position adjustment structure adjusts the position of the contact member in the internal space. The position adjustment structure includes a locked holder disposed in the contact member and a locking holder disposed in the terminal main body.

Abstract: A connection terminal includes a terminal main body, a contact member, a locking structure, and a position adjustment structure. The terminal main body is electrically conductive and includes a female connector. The contact member is disposed, in a first region of an internal space of the female connector, to face an inner circumferential surface of the female connector. The locking structure holds the contact member at a position thereof after completion of housing of the contact member in the internal space. The position adjustment structure adjusts the position of the contact member in the internal space. The position adjustment structure includes a locked holder disposed in the contact member and a locking holder disposed in the terminal main body.

Abstract: A manufacturing method of a reactor includes: assembling an assembly constituted by a coil and a bobbin by inserting the bobbin, which includes a tube portion and a flange portion, through the coil so that a tip of the tube portion protrudes from the coil; forming a cavity by installing the assembly in a first die so that a portion of a coil lateral face comes into contact with a cavity face of the first die, and closing a second die so that the second die is opposed to the first die; and extending first press rods from a cavity face of the second die toward the bobbin in the cavity, and injecting a resin into the cavity while pressing both ends of the bobbin in an axial direction of the coil from an opposite side to the portion of the coil lateral face.

Abstract: A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.

Abstract: A manufacturing method of a reactor includes: assembling an assembly constituted by a coil and a bobbin by inserting the bobbin, which includes a tube portion and a flange portion, through the coil so that a tip of the tube portion protrudes from the coil; forming a cavity by installing the assembly in a first die so that a portion of a coil lateral face comes into contact with a cavity face of the first die, and closing a second die so that the second die is opposed to the first die; and extending first press rods from a cavity face of the second die toward the bobbin in the cavity, and injecting a resin into the cavity while pressing both ends of the bobbin in an axial direction of the coil from an opposite side to the portion of the coil lateral face.

Abstract: A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.

Abstract: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

Abstract: A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.

Abstract: An automobile includes: a controller for controlling a motor; a main battery for supplying electric power to the motor via the controller; a normally open relay interposed in an electric power supply path extending from the main battery to the controller; and a sub-battery for supplying the electric power to the relay. The controller is mounted with a terminal cover that covers an output terminal for connection with a power supply cable to the motor. The sub-battery is disposed adjacent to the controller so as to interfere with the removal of the terminal cover by a worker.

Abstract: A manufacturing method of a reactor includes: assembling an assembly constituted by a coil and a bobbin by inserting the bobbin, which includes a tube portion and a flange portion, through the coil so that a tip of the tube portion protrudes from the coil; forming a cavity by installing the assembly in a first die so that a portion of a coil lateral face comes into contact with a cavity face of the first die, and closing a second die so that the second die is opposed to the first die; and extending first press rods from a cavity face of the second die toward the bobbin in the cavity, and injecting a resin into the cavity while pressing both ends of the bobbin in an axial direction of the coil from an opposite side to the portion of the coil lateral face.

Abstract: An automobile includes: a controller for controlling a motor; a main battery for supplying electric power to the motor via the controller; a normally open relay interposed in an electric power supply path extending from the main battery to the controller; and a sub-battery for supplying the electric power to the relay. The controller is mounted with a terminal cover that covers an output terminal for connection with a power supply cable to the motor. The sub-battery is disposed adjacent to the controller so as to interfere with the removal of the terminal cover by a worker.

Abstract: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

Abstract: A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.

Abstract: A stacked cooler includes a plurality of refrigerant flow passages and a plurality of semiconductor modules. The refrigerant flow passages and the semiconductor modules are stacked alternately, and each of opposite surfaces in a stacking direction of each of the semiconductor modules is in contact with a corresponding one of the refrigerant flow passages, thereby cooling the semiconductor modules. The semiconductor modules generate different amounts of heat. One or a plurality of the semiconductor modules and one or a plurality of the semiconductor modules are arranged in each of arrangement spaces adjacent to the refrigerant flow passages so that a difference in amount of heat generated between the respective arrangement spaces becomes small. Consequently, cooling capability is equalized throughout the respective arrangement spaces, enabling reduction in waste due to excessive cooling.

Abstract: A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Abstract: A cooling structure of a semiconductor device includes an output electrode, a semiconductor element and a semiconductor element disposed to face each other with the output electrode interposed therebetween, a radiator disposed for the semiconductor element on a side opposite to the output electrode, and a radiator disposed for the semiconductor element on the side opposite to the output electrode. The output electrode includes an element mounting portion and a heat transport portion. The element mounting portion is electrically connected to the semiconductor element and the semiconductor element, and is formed of a conductive material. The heat transport portion is disposed to extend from the element mounting portion toward the radiator and the radiator. With this structure, a cooling structure of a semiconductor device with which excellent cooling efficiency is realized can be provided.

Abstract: A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Abstract: There is provided a semiconductor module having improved heat radiation efficiency. A semiconductor module includes a semiconductor element, a pair of Cu heat radiating plates sandwiching the semiconductor element, insulating and heat radiating plates sandwiching the Cu heat radiating plates, heat radiating fins sandwiching the insulating and heat radiating plates, and solder applied between the Cu heat radiating plates and the insulating and heat radiating plates as well as between the insulating and heat radiating plates and the heat radiating fins.