Patents by Inventor Akio Komamura

Akio Komamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Peeling apparatus and peeling method
    Patent number: 10574039
    Abstract: A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: February 25, 2020
    Assignees: HONDA MOTOR CO., LTD, SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Hideki Shigematsu, Masafumi Saito, Keita Miyashita, Ryuzo Sakamoto, Hiroyuki Miyajima, Akio Komamura
  • PEELING APPARATUS AND PEELING METHOD
    Publication number: 20180083428
    Abstract: A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2.
    Type: Application
    Filed: September 18, 2017
    Publication date: March 22, 2018
    Inventors: Hideki Shigematsu, Masafumi Saito, Keita Miyashita, Ryuzo Sakamoto, Hiroyuki Miyajima, Akio Komamura