Patents by Inventor Akio Kotaka

Akio Kotaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor-package measuring method, measuring socket, and semiconductor package
    Patent number: 6791110
    Abstract: Electrical connection of a measuring socket to an IC package, to measure electrical characteristics of the IC package, is realized by bringing a measuring pin of a measuring arm of the measuring socket into contact with an end surface of a distal end of a lead of the IC package. Accordingly, a problem of solder plated to the lead becoming attached to and deposited on an upper side of a socket pin and shaved off by the distal end of the lead, and thereby producing solder residue, is solved. This problem occurs when electrical connection to an IC package is conventionally realized by bringing the distal end of the lead of the IC package into contact with a distal end of the socket pin.
    Type: Grant
    Filed: January 2, 2003
    Date of Patent: September 14, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Kotaka
  • Semiconductor-package measuring method, measuring socket, and semiconductor package
    Publication number: 20030100139
    Abstract: Electrical connection of a measuring socket to an IC package, to measure electrical characteristics of the IC package, is realized by bringing a measuring pin of a measuring arm of the measuring socket into contact with an end surface of a distal end of a lead of the IC package. Accordingly, a problem of solder plated to the lead becoming attached to and deposited on an upper side of a socket pin and shaved off by the distal end of the lead, and thereby producing solder residue, is solved. This problem occurs when electrical connection to an IC package is conventionally realized by bringing the distal end of the lead of the IC package into contact with a distal end of the socket pin.
    Type: Application
    Filed: January 2, 2003
    Publication date: May 29, 2003
    Inventor: Akio Kotaka
  • Semiconductor-package measuring method, measuring socket, and semiconductor package
    Patent number: 6541289
    Abstract: Electrical connection of a measuring socket to an IC package, to measure electrical characteristics of the IC package, is realized by bringing a measuring pin of a measuring arm of the measuring socket into contact with an end surface of a distal end of a lead of the IC package. Accordingly, a problem of solder plated to the lead becoming attached to and deposited on an upper side of a socket pin and shaved off by the distal end of the lead, and thereby producing solder residue, is solved. This problem occurs when electrical connection to an IC package is conventionally realized by bringing the distal end of the lead of the IC package into contact with a distal end of the socket pin.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: April 1, 2003
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Kotaka
  • Semiconductor-package measuring method, measuring socket, and semiconductor package
    Publication number: 20020048827
    Abstract: Electrical connection of a measuring socket to an IC package, to measure electrical characteristics of the IC package, is realized by bringing a measuring pin of a measuring arm of the measuring socket into contact with an end surface of a distal end of a lead of the IC package. Accordingly, a problem of solder plated to the lead becoming attached to and deposited on an upper side of a socket pin and shaved off by the distal end of the lead, and thereby producing solder residue, is solved. This problem occurs when electrical connection to an IC package is conventionally realized by bringing the distal end of the lead of the IC package into contact with a distal end of the socket pin.
    Type: Application
    Filed: February 27, 2001
    Publication date: April 25, 2002
    Inventor: Akio Kotaka