Patents by Inventor Akio MASUNARI
Akio MASUNARI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240331949Abstract: A capacitor that includes: an insulating substrate having a first main surface and a second main surface; a capacitance forming part facing the first main surface, the capacitance forming part having a conductive metal porous body, a dielectric film covering a surface of the metal porous body, and a conductive film covering the dielectric film; a first external connection line that includes a first via conductor penetrating the insulating substrate and connected to the conductive metal porous body; and a second external connection line that includes a second via conductor penetrating the insulating substrate, and an internal conductor covering the conductive film so as to fill a space inside the capacitance forming part, and the conductive film and the second via conductor are connected with at least the internal conductor interposed therebetween.Type: ApplicationFiled: June 5, 2024Publication date: October 3, 2024Inventors: Haruki KOBAYASHI, Akio MASUNARI
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Publication number: 20240321517Abstract: A capacitor that includes: an insulating substrate having a first main surface and a second main surface opposite to the first main surface; a capacitance forming part facing the first main surface, the capacitance forming part comprising a conductive metal porous body, a dielectric film covering a surface of the metal porous body, and a conductive film covering the dielectric film; a first external connection line connected to the conductive metal porous body; a second external connection line connected to the conductive film; and a support part in the insulating substrate, the support part supporting the capacitance forming part and protruding from the first main surface toward the capacitance forming part, and surrounded by and joined to the capacitance forming part.Type: ApplicationFiled: May 31, 2024Publication date: September 26, 2024Inventors: Haruki Kobayashi, Akio Masunari
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Patent number: 11881356Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.Type: GrantFiled: March 14, 2023Date of Patent: January 23, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shinobu Chikuma, Nobuyuki Koizumi, Akio Masunari, Yukie Watanabe
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Publication number: 20230215645Abstract: A capacitor that includes an insulating substrate; a capacitance forming portion including a metal porous body, a dielectric film, and a conductive film; and a sealing portion that seals the capacitance forming portion. The capacitance forming portion is on a first main surface of the insulating substrate. A first external connection line including a first via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the metal porous body; and a second external connection line including a second via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the conductive film. When viewed in a normal direction of the first main surface, the first via conductor and the second via conductor are both in a region where the capacitance forming portion is disposed.Type: ApplicationFiled: July 25, 2022Publication date: July 6, 2023Inventors: Akio Masunari, Sachiko Hayashi, Naoki Iwaji
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Publication number: 20230215644Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.Type: ApplicationFiled: March 14, 2023Publication date: July 6, 2023Inventors: Shinobu CHIKUMA, Nobuyuki KOIZUMI, Akio MASUNARI, Yukie WATANABE
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Patent number: 11610737Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.Type: GrantFiled: February 8, 2021Date of Patent: March 21, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shinobu Chikuma, Nobuyuki Koizumi, Akio Masunari, Yukie Watanabe
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Publication number: 20220359121Abstract: A capacitor that includes an insulating substrate; a capacitance forming portion including a metal porous body, a dielectric film, and a conductive film; and a sealing portion that seals the capacitance forming portion. The capacitance forming portion is on a first main surface of the insulating substrate. A first external connection line including a first via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the metal porous body; and a second external connection line including a second via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the conductive film. When viewed in a normal direction of the first main surface, the first via conductor and the second via conductor are both in a region where the capacitance forming portion is disposed.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Inventors: Akio Masunari, Sachiko Hayashi, Naoki Iwaji
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Patent number: 11367574Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes and including main surfaces facing each other in a stacking direction, lateral surfaces facing each other in a width direction, and end surfaces facing each other in a length direction, and an external electrode electrically connected with the internal electrodes on the end surfaces. The external electrode includes an end surface covering portion covering each of the end surfaces, and a main surface covering portion covering portions of the main surfaces. The end surface and main surface covering portions each include a base electrode layer covering the ceramic body, and a plating layer covering the base electrode layer. The end surface covering portion further includes, between the base electrode layer and the plating layer, a sintered metal layer including a component different from that of the base electrode layer.Type: GrantFiled: March 2, 2020Date of Patent: June 21, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Akio Masunari, Yukie Watanabe
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Patent number: 11342122Abstract: An electronic component assembly includes an electronic component and a mounting board. The electronic component includes a stacked body, a pair of external electrodes provided on both end surfaces of the stacked body, and an insulating layer entirely covering a first main surface of the stacked body. The mounting board includes a board main body having a mounting surface, and land electrodes on the mounting surface. The first main surface of the electronic component faces the mounting surface of the mounting board, and the pair of external electrodes are mounted on the land electrodes with solder. Both end portions of the insulating layer in the length direction of the electronic component are located on the outer side relative to both end surfaces of the stacked body at least in a cross section taken at the center in the width direction.Type: GrantFiled: April 22, 2020Date of Patent: May 24, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Akio Masunari
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Patent number: 11302484Abstract: An electronic component assembly includes an electronic component and a mounting board. The electronic component includes a stacked body, a pair of external electrodes provided on both end surfaces of the stacked body, and an insulating layer entirely covering a first main surface of the stacked body. The mounting board includes a board main body having a mounting surface, and land electrodes on the mounting surface. The first main surface of the electronic component faces the mounting surface of the mounting board, and the pair of external electrodes are mounted on the land electrodes with solder. Both end portions of the insulating layer in the length direction of the electronic component are located on the outer side relative to both end surfaces of the stacked body at least in a cross section taken at the center in the width direction.Type: GrantFiled: April 22, 2020Date of Patent: April 12, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Akio Masunari
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Publication number: 20210272756Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.Type: ApplicationFiled: February 8, 2021Publication date: September 2, 2021Inventors: Shinobu CHIKUMA, Nobuyuki KOIZUMI, Akio MASUNARI, Yukie WATANABE
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Publication number: 20200365326Abstract: An electronic component assembly includes an electronic component and a mounting board. The electronic component includes a stacked body, a pair of external electrodes provided on both end surfaces of the stacked body, and an insulating layer entirely covering a first main surface of the stacked body. The mounting board includes a board main body having a mounting surface, and land electrodes on the mounting surface. The first main surface of the electronic component faces the mounting surface of the mounting board, and the pair of external electrodes are mounted on the land electrodes with solder. Both end portions of the insulating layer in the length direction of the electronic component are located on the outer side relative to both end surfaces of the stacked body at least in a cross section taken at the center in the width direction.Type: ApplicationFiled: April 22, 2020Publication date: November 19, 2020Inventor: Akio MASUNARI
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Publication number: 20200303124Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes and including main surfaces facing each other in a stacking direction, lateral surfaces facing each other in a width direction, and end surfaces facing each other in a length direction, and an external electrode electrically connected with the internal electrodes on the end surfaces. The external electrode includes an end surface covering portion covering each of the end surfaces, and a main surface covering portion covering portions of the main surfaces. The end surface and main surface covering portions each include a base electrode layer covering the ceramic body, and a plating layer covering the base electrode layer. The end surface covering portion further includes, between the base electrode layer and the plating layer, a sintered metal layer including a component different from that of the base electrode layer.Type: ApplicationFiled: March 2, 2020Publication date: September 24, 2020Inventors: Akio MASUNARI, Yukie WATANABE
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Patent number: 10650974Abstract: A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 ?m from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 ?m or more and about 10.000 ?m or less.Type: GrantFiled: March 9, 2018Date of Patent: May 12, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kohei Shimada, Akio Masunari, Yuta Saito, Shunsuke Abe, Tomoo Yuguchi
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Patent number: 10475584Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.Type: GrantFiled: January 24, 2019Date of Patent: November 12, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Akio Masunari
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Publication number: 20190157007Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.Type: ApplicationFiled: January 24, 2019Publication date: May 23, 2019Inventor: Akio MASUNARI
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Patent number: 10297391Abstract: A composite electronic component includes a substrate with a first main surface and a side end surface, a first electronic component including external electrodes and mounted on the first main surface of the substrate, a second electronic component including external electrodes and being different in electrical function from the first electronic component mounted on the first main surface of the substrate, and a conductive pattern on the first main surface of the substrate, electrically connecting the first electronic component and the second electronic component to each other, and including one end reaching a side of one side end of the substrate, one external electrode of the first electronic component and one external electrode of the second electronic component being located on the side of the one side end of the substrate, another external electrode of the first electronic component and another external electrode of the second electronic component being connected to the conductive pattern, and the composType: GrantFiled: December 27, 2016Date of Patent: May 21, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koki Shibuya, Hirokazu Takashima, Akio Masunari, Tomoyuki Nakamura
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Patent number: 10236124Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.Type: GrantFiled: March 2, 2017Date of Patent: March 19, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Akio Masunari
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Publication number: 20180268999Abstract: A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 ?m from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 ?m or more and about 10.000 ?m or less.Type: ApplicationFiled: March 9, 2018Publication date: September 20, 2018Inventors: Kohei SHIMADA, Akio MASUNARI, Yuta SAITO, Shunsuke ABE, Tomoo YUGUCHI
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Patent number: 9967980Abstract: A multilayer ceramic capacitor includes a ceramic element body including first and second external electrodes on first and second end surface sides of the ceramic element body, respectively. The first external electrode includes an Ni plating layer and an Sn plating layer defining a plating layer. The second external electrode includes an Au plating layer defining a plating layer.Type: GrantFiled: December 23, 2016Date of Patent: May 8, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Akio Masunari, Hirokazu Takashima, Tomoyuki Nakamura