Patents by Inventor Akio Matsuyama

Akio Matsuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transfer device for substrate and storing device and hand therein, and substrate handled by the device
    Patent number: 7547175
    Abstract: A transfer device for a substrate is capable of preventing deformation or breakage of the substrate due to bending stress by reducing the amount of dead weight deflection of the substrate, e.g. a large mother glass board. Supporting members extend in opposite directions from two sides of a storage device such that the substrate can be introduced or removed by raising and lowering the hand of a transfer machine inserted into the storage device between the supporting members. The supporting members are comprised of a plurality of supporting members in parallel, formed with a gap between the supporting members facing each other.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: June 16, 2009
    Assignees: Hitachi Plant Technologies, Ltd., Sharp Corporation
    Inventors: Hiroshi Chinbe, Yoshiya Endo, Naoki Shimakawa, Ichiro Fukuwatari, Yoshiaki Hayashida, Yoshio Takakura, Akio Matsuyama, Hideto Kohketsu
  • Transfer device for substrate and storing device therein
    Publication number: 20020197139
    Abstract: The objective of the present invention is to provide a transfer device for substrate capable of preventing deformation or breakage of substrate due to bending stress, by reducing the amount of dead weight deflection of substrate, such as large mother glass boards, etc.
    Type: Application
    Filed: June 26, 2002
    Publication date: December 26, 2002
    Inventors: Hiroshi Chinbe, Yoshiya Endo, Naoki Shimakawa, Ichiro Fukuwatari, Yoshiaki Hayashida, Yoshio Takakura, Akio Matsuyama, Hideto Kohketsu
  • Carbon fiber-reinforced polimide resin composition
    Patent number: 5650463
    Abstract: Moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide to resin. A further aspects relates to, a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide to resin, A still further aspect relates to and a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 22, 1997
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Akio Matsuyama, Eiji Senoue, Fumiaki Kuwano, Osamu Yasui, Tadashi Kobayashi
  • Bisimide compounds, polyimide resin composition prepared therefrom, and carbon fiber-reinforced polyimide resin composition
    Patent number: 5554765
    Abstract: A moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide resin. A further aspect relates to a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide resin. A still further aspect relates to a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 10, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Akio Matsuyama, Eiji Senoue, Fumiaki Kuwano, Osamu Yasui, Yasunori Yoshida, Akinori Ryu, Tadashi Kobayashi
  • Bisimide compounds, polyimide resin composition prepared therefrom, and carbon fiber-reinforced polyimide resin composition
    Patent number: 5457154
    Abstract: A moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide resin. A further aspect relates to a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide resin. A still further aspect relates to a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.
    Type: Grant
    Filed: November 9, 1992
    Date of Patent: October 10, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Akio Matsuyama, Eiji Senoue, Fumiaki Kuwano, Osamu Yasui, Yasunori Yoshida, Akinori Ryu, Tadashi Kobayashi
  • Aromatic polyamide molded article having storage modulus
    Patent number: 4921933
    Abstract: Aromatic polyamide having good high-temperature resistance and processing ability is obtained by specifying the ratio of storage modulus at the glass transition temperature (Tg).degree.C. to that of (Tg+100).degree.C.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: May 1, 1990
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Masanori Osawa, Kohei Shizuka, Masahiro Kouno, Akio Matsuyama, Hirotoshi Katsuoka, Kazumi Mizutani
  • Radiation-curable coating composition
    Patent number: 4694052
    Abstract: Disclosed herein is a coating composition which contains a urethane-modified (meth)acrylate compound and a mono(meth)acrylate and is curable upon its exposure to radiation. Also disclosed herein is a coating, especially, a primary coating for an optical fiber, which coating or cladding is composes of a cured material obtained by curing the composition through its exposure to radiation.
    Type: Grant
    Filed: June 25, 1985
    Date of Patent: September 15, 1987
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Sumio Hirose, Isao Naruse, Akio Matsuyama