Patents by Inventor Akio Mogi

Akio Mogi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin compositions, production process thereof, and products using the resin compositions
    Patent number: 5543189
    Abstract: A resin composition comprises 100 parts by weight of an ethylene-base resin comprising at least 2 wt. % of linear low-density polyethylene and 0.1-30 parts by weight of an organopolysiloxane having an average molecular weight of at least 100,000. The resin composition can be produced by melting and kneading the organopolysiloxane together with the linear low-density polyethylene and then melting and kneading the resulting polymer blend together with the ethylene-base resin other than the linear low-density polyethylene. The resin composition may additionally comprise 0.1-100 parts by weight of a propylene-base resin. In the latter resin composition, the organopolysiloxane is contained in an amount of 0.1-30 parts by weight per 100 parts by weight of the sum of the ethylene-base resin and the propylene-base resin.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 6, 1996
    Assignees: Tokuyama Corporation, Fujikura, Ltd.
    Inventors: Yasushi Nakakura, Hideki Tanaka, Akira Sano, Akio Mogi, Matsuhiro Miyamoto, Kazunari Suzuki
  • Resin compositions, production process thereof, and products using the resin compositions
    Patent number: 5492970
    Abstract: A resin composition comprises 100 parts by weight of an ethylene-base resin comprising at least 2 wt. % of linear low-density polyethylene and 0.1-30 parts by weight of an organopolysiloxane having an average molecular weight of at least 100,000. The resin composition can be produced by melting and kneading the organopolysiloxane together with the linear low-density polyethylene and then melting and kneading the resulting polymer blend together with the ethylene-base resin other than the linear low-density polyethylene. The resin composition may additionally comprise 0.1-100 parts by weight of a propylene-base resin. In the latter resin composition, the organopolysiloxane is contained in an amount of 0.1-30 parts by weight per 100 parts by weight of the sum of the ethylene-base resin and the propylene-base resin.
    Type: Grant
    Filed: July 10, 1995
    Date of Patent: February 20, 1996
    Assignees: Tokuyama Corporation, Fujikura, Ltd.
    Inventors: Yasushi Nakakura, Hideki Tanaka, Akira Sano, Akio Mogi, Mitsuhiro Miyamoto, Kazunari Suzuki