Patents by Inventor Akio Nakano

Akio Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020008480
    Abstract: A plasma treatment apparatus having the capability of uniformly treating an object with plasma at a high treatment speed and a plasma treatment method are provided. This apparatus comprises a tubular vessel having a laterally elongated cross section, a pair of electrodes arranged such that electric flux lines develop substantially in an axial direction of the tubular vessel when one of an AC voltage and a pulse voltage is applied between the electrodes, a gas supply for supplying a streamer generation gas into the tubular vessel, a power source for applying the voltage between the electrodes to generate plural streamers of the gas in the tubular vessel, and a plasma uniform means for making the plural streamers uniform in a lateral direction of the laterally elongated cross section of the tubular vessel to provide the plasma from one end of the tubular vessel.
    Type: Application
    Filed: May 24, 2001
    Publication date: January 24, 2002
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Keiichi Yamazaki, Yukiko Inooka, Yasushi Sawada, Noriyuki Taguchi, Yoshiyuki Nakazono, Akio Nakano
  • Patent number: 6306957
    Abstract: An organopolysiloxane, a hydrolyzable group-bearing methylpolysiloxane, a thermal conductive filler, and a curing agent are blended to form a silicone rubber composition which is minimized in viscosity or plasticity increase and remains effectively moldable and workable even when loaded with a large amount of the thermal conductive filler. It cures into a silicone rubber part having a high thermal conductivity.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: October 23, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akio Nakano, Hiroshi Takei, Takeshi Hashimoto, Yuuki Sakurai
  • Publication number: 20010007377
    Abstract: The object of the invention is to provide a method for molding a resin-molded article having an excellent surface appearance without any resin-intrusion part on the front surface of a skin thereof. In the invention, the skin is placed on a part of a inner wall of a mold and then injecting a synthetic resin into a cavity of the mold to effect an integral molding of a resin-molded article having the skin on a part thereof, wherein a mold having a first gate on a first inner wall part located on the part other than the back surface of the skin placed on the inner wall of said mold and a second gate on a second inner wall part which faces the back surface of the skin placed on the inner wall is employed; and wherein the synthetic resin is first injected from said first gate until the tip portion of the synthetic resin comes close to the edge of said skin, and then the synthetic resin is injected from the second gate.
    Type: Application
    Filed: December 18, 1998
    Publication date: July 12, 2001
    Inventors: ATSUSHI GOTO, AKIO NAKANO, TATSUO YAMADA, KENICHI FURUTA, MINORU TODA, TETSUYA FUJII
  • Patent number: 6181252
    Abstract: In a remote control system having a transmitter and a receiver, a rolling code is ciphered to generate a ciphered rolling code by repeating, n times, an exclusive-OR operation on a constant code in a rolling code table and the rolling code as well as an-maximum shift keying. A key code specific to each control system is used as a constant code at the k-th exclusive-OR logic operation so that the k-th exclusive-OR logic operation becomes different from system to system resulting in different ciphering method for each system. The key code is set in an EEPROM in the process of control system production so that the rolling code may not be deciphered even by a design engineer as long as the key code is kept undisclosed.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: January 30, 2001
    Assignee: Denso Corporation
    Inventor: Akio Nakano
  • Patent number: 6169142
    Abstract: Silicone rubber parts having a high thermal conductivity and low hardness are obtained by molding and curing a composition comprising (A) 100 parts by weight of an alkenyl-bearing organopolysiloxane having a viscosity of up to about 500,000 centistokes at 25° C., (B) 300-1,200 parts by weight of aluminum oxide powder, (C) 0.05-10 parts by weight of an alkoxysilane of the formula: R1aSi(OR2)(4−a) wherein R1 is a monovalent C6-20 hydrocarbon group, R2 is a C1-6 alkyl group, and a=1, 2 or 3, (D) a platinum group metal catalyst, and (E) an organohydrogenpolysiloxane containing at least two SiH groups in a molecule. The composition is formulated so as to suppress the viscosity increase of a liquid silicone rubber composition due to heavy loading of aluminum oxide.
    Type: Grant
    Filed: June 17, 1999
    Date of Patent: January 2, 2001
    Assignee: Shin Etsu Chemical Co., Ltd.
    Inventors: Akio Nakano, Takeshi Hashimoto
  • Patent number: 5476690
    Abstract: Disclosed is a process for preparing a printed circuit board, which comprises the steps of:(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.
    Type: Grant
    Filed: June 3, 1994
    Date of Patent: December 19, 1995
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Fumihiko Ohta, Takeshi Nojiri, Shinji Tsuchikawa, Akio Nakano, Toshiaki Ishimaru, Hiroshi Yamazaki, Haruo Akahoshi, Mineo Kawamoto, Akio Takahashi
  • Patent number: 5352731
    Abstract: A silicone rubber composition having thermal conductivity higher than 5.times.10.sup.-3 cal/cm.multidot.sec.multidot..degree.C. and excellent workability in various molding processes, which comprises A) 95-50 parts by weight of an organopolysiloxane having an average polymerization degree of 6,000-12,000, B) 5-50 parts by weight of an organopolysiloxane having an average polymerization degree of 200-2,000, C) 500-1,200 parts by weight of a spherical aluminum oxide powder and D) a curing agent ample for curing the composition consisting of A) to C) .
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: October 4, 1994
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akio Nakano, Tsutomu Yoneyama, Nobumasa Tomizawa
  • Patent number: 5343387
    Abstract: A system is provided for the preparation of a cyclic maintenance work schedule table. The system includes a display unit which can show boxes defined by dates in a desired period and the names of individual workers.
    Type: Grant
    Filed: November 27, 1991
    Date of Patent: August 30, 1994
    Assignees: Hitachi, Ltd., Hitachi Building Systems and Engineering Service Co.
    Inventors: Masaki Honma, Akio Nakano, Kouzou Mabuti, Isamu Asahi, Setsuo Tsuruta, Nobuhiro Fujino, Nobuhisa Kobayashi
  • Patent number: 5229037
    Abstract: The electroconductive silicone rubber composition of the invention is prepared by compounding a diorganopolysiloxane with each a specified amount of spherical particles of a cured silicone elastomer, metallic electroconductivity-imparting agent, e.g., metal powder, and a curing agent, e.g., organic peroxide. The composition has good molding workability and is capable of giving a cured electroconductive silicone rubber body having good mechanical properties along with high electroconductivity despite the formulation including the metal powder. Improvements can be obtained in the elastic resilience and permanent compression set of the cured silicone rubber body by the admixture of the composition with a specific liquid organosilicon compound having a phenyl group or an alkyl group of 3 to 10 carbon atoms bonded to the silicon atoms.
    Type: Grant
    Filed: October 30, 1990
    Date of Patent: July 20, 1993
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akio Nakano, Mikio Iino
  • Patent number: 5221575
    Abstract: A thermally conductive sheet comprising a metal foil of which at least one side is coated with a graphite powder-containing silicone rubber layer to gain improved thermally conductive efficiency without attended by decrease in thermal conductivity with time and increase in production cost, and further to enable the enhancement of adhesiveness to other materials by easy incorporation of organopolysiloxanes of adhesion-conferring type into the silicone rubber layer, thus showing excellent aptitude for a thermally conductive sheet of full pack mold transistors.
    Type: Grant
    Filed: October 29, 1991
    Date of Patent: June 22, 1993
    Assignee: Shin-Etsu Chemical Co. Ltd.
    Inventors: Akio Nakano, Nobumasa Tomizawa
  • Patent number: 5062933
    Abstract: An untrasonic machining method which comprises applying an electric current across a workpiece and a tool subject to ultrasonic vibration and ultrasonically vibrating the tool, while supplying an electrolyte to the gap between the workpiece and the tool, said workpiece and tool being positioned a certain distance apart, said electrolyte containing spherical soft abrasive grains suspending therein, said ultrasonic vibration actuating said abrasive grains so that they remove the film formed on the work surface of the workpiece by electrolysis, with the removed film being discharged from said gap during machining. Alternatively, the electrolyte and abrasive grains are supplied separately and mixed in the gap.
    Type: Grant
    Filed: October 31, 1989
    Date of Patent: November 5, 1991
    Inventor: Akio Nakano
  • Patent number: 4983642
    Abstract: The invention provides a foamable silicon rubber composition capable of giving a foamed and cured silicone rubber body which exhibits, different from conventional foamed silicone rubbers, a retarded and controlled rate of elastic recoverty from a compressed state when the compressive force is released so as to be useful for certain applications. This unique characteristic of the foamed silicon rubber can be obtained by formulating the composition, besides conventional ingredients, a low molecular-weight organopolysiloxane represented by the general formula HO--(--SiR.sup.1.sub.2 --O--).sub.m --(--SiMe.sub.2 --O--).sub.n --H, in which Me is a methyl group, R.sup.1 is an unsubstituted or substituted monovalent hydrocarbon group, at least one of the groups denoted by R.sup.1 in each of the units of the formula --SiR.sup.1.sub.
    Type: Grant
    Filed: June 6, 1990
    Date of Patent: January 8, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akio Nakano, Hirosi Takei
  • Patent number: 4834166
    Abstract: This invention relates to a die casting machine in which high pressure is applied to molten metal to inject and fill the molten metal all over the mold before the molten metal is solidified to continuously mold molded articles (products), which have a beautiful casting surface and a high dimensional precision, every cycle of the machine. One or both of a fixed mold or a movable mold, which serves as a molding mold, and a core incorporated into one or both the molds are formed of high strength ceramics, and in addition, a movable hob for pressurizing molten metal injected and filled into both the fixed and movable molds is formed of high strength ceramics thereby providing a mold construction which is excellent in mechanical characteristics such as strength, hardness, breaking toughness and the like and having durability and pressure resistance enough to withstand high temperature thermal shock and high pressure, and being capable of easily controlling the temperature distribution within the mold.
    Type: Grant
    Filed: January 6, 1987
    Date of Patent: May 30, 1989
    Inventor: Akio Nakano
  • Patent number: 4798237
    Abstract: This invention concerns an improvement in a molding die for use in casting in which a metal article is molded by charging a molten metal to the inside of a molding die comprising paired male and female dies, and then cooling the temperature of the molten metal to a solidification region and a solidification range where the solid phase and the liquid phase are present together, wherein one or both of paired male and female dies constituting the molding die equipped retractably with a pressurizing insert for applying the pressure to the molten metal charged to the molding die is made of ceramics thereby obtaining a molding die that can facilitate the control for the temperature distribution over the entire molding die, particularly, within the molding die upon cooling to solidify the molten metal, as well as having sufficient strength such as thermal shock resistance, shock resistance and durability enabling to mold a high temperature metal article by solidifying the high temperature molten metal of about 600.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: January 17, 1989
    Inventor: Akio Nakano
  • Patent number: 4753283
    Abstract: The present invention relates to an improvement of an injection apparatus in a die casting machine of a horizontal injection type in which molten metal is poured into an injection sleeve mounted and held in a horizontal state with a fore end opening connected to an inlet of a die, and the poured molten metal is injected into the die by a piston motion of a plunger of an injection cylinder. A storage vessel capable of being sealed hermetically is attached to a pouring port formed in the injection sleeve and molten metal in a heat retaining furnace is supplied to the storage vessel periodically through a feed pipe, whereby the pouring into the injection sleeve is quickened to thereby increase the number of shots per hour despite the die casting machine having the injection apparatus of a horizontal injection type.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: June 28, 1988
    Inventor: Akio Nakano
  • Patent number: 4749021
    Abstract: This invention relates to improvements on an injection device in a hot chamber type die casting machine in which molten metal reserved in a heat retaining furnace or the like is injected into a mold according to a hot pressurizing chamber system. A goose neck formed of ceramics is provided in a heat retaining pot formed of ceramics for reserving molten metal such that the bottom of the goose neck is attached fixedly to the inside surface of bottom of the heat retaining pot, and by additionally providing a heat retaining material incorporating a heating wire and formed of ceramics on the outer surface of bottom and the outer peripheral surface of the heat retaining pot is firmly fixed the goose neck in the heat retaining pot while shock load forces applied to the bottom of the goose neck are transmitted to the bottom of heat retaining pot and absorbed and reduced by the bottom and further the heat retaining pot is effectively reinforced by the heat retaining material.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: June 7, 1988
    Inventor: Akio Nakano
  • Patent number: 4730658
    Abstract: The present invention relates to an injection method and apparatus for carrying out the method in a hot chamber type die casting machine for injecting and filling melting metal or so-called molten metal stored in a retaining furnace into a mold in a system of a thermally pressurizing chamber to cast and mold metal products, wherein brought into communication with a drawing-up cylindrical body stood upright with a lower opened end dipped into the retaining furnace is an injection cylindrical body with one opened end connected to a sprue of a mold to form a cross-shape sleeve, by which molten metal within the retaining furnace is drawn up outside the retaining furnace by a suction force, and the thus drawn-up molten metal is injected and filled into the mold by a pressing force.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: March 15, 1988
    Inventor: Akio Nakano
  • Patent number: 4727922
    Abstract: A mold and method for producing, or casting a high-melting metal article from a high-melting metal having a melting point of about 900.degree. to 1600.degree. C.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: March 1, 1988
    Inventor: Akio Nakano