Patents by Inventor Akio Otsuka

Akio Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180163091
    Abstract: A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
    Type: Application
    Filed: February 8, 2018
    Publication date: June 14, 2018
    Inventors: Suprotik Das, Sheenfar S. Fong, Akio Otsuka, Laurence B. Saidman
  • Patent number: 9920222
    Abstract: A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: March 20, 2018
    Assignee: Nordson Corporation
    Inventors: Suprotik Das, Sheenfar S. Fong, Akio Otsuka, Laurence B. Saidman
  • Publication number: 20160122592
    Abstract: A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
    Type: Application
    Filed: November 3, 2015
    Publication date: May 5, 2016
    Inventors: Suprotik Das, Sheenfar S. Fong, Akio Otsuka, Laurence B. SAIDMAN
  • Patent number: 5711232
    Abstract: A Stirling engine has an external combustion chamber for burning a kerosene and transferring a high temperature therein to working fluid in heater tubes. In the case of the present invention, the external combustion chamber is connected to a furnace for burning industrial waste materials such as plastic materials or rubber materials so that the high temperature above 900.degree. C. is able to be supplied to the combustion chamber. This serves in raising an output power of the Stirling engine. A conduit for connecting the furnace with the combustion chamber is proveded with a dumper capable of interrupting a flow of the high temperature combustion gases toward the combustion chamber of the Stirling engine.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: January 27, 1998
    Assignees: Aisin Seiki Kabushiki Kaisha, Kabushiki Kaisha Semitsu
    Inventors: Akira Yamaguro, Naoki Minamoto, Tomohiro Tokunaga, Akio Otsuka
  • Patent number: 5382554
    Abstract: High-packing silicon nitride powder having a tap density of at least about 0.9 g/cm.sup.3 is prepared by reacting a metallic silicon powder having a mean particle size of about 1 to 10 .mu.m, a BET specific surface area of about 1 to 5 m.sup.2 /g, and a purity of at least about 99% with nitrogen in a nitrogen atmosphere containing about 5 to 20% by volume of hydrogen at about 1,350 to 1,450.degree. C., and milling the resulting silicon nitride powder in a dry attritor. The powder is moldable into a compact having a density of at least about 1.70 g/cm.sup.3, from which a sintered part having improved dimensional precision and strength is obtained.
    Type: Grant
    Filed: November 10, 1993
    Date of Patent: January 17, 1995
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Haruyoshi Kuwabara, Akio Otsuka, Meguru Kashida
  • Patent number: 5348919
    Abstract: High-packing silicon nitride powder is prepared by reacting metallic silicon powder having a mean particle size of 1 to 10 .mu.m and a purity of at least 99% directly with nitrogen for forming silicon nitride powder, milling the silicon nitride powder in a dry attritor until the tap density exceeds 0.9 g/cm.sup.3 and the content of particles having an aspect ratio of up to 3 exceeds 95% by weight, and further milling the silicon nitride powder in a wet attritor for finely dividing coarse particles having a particle size of at least 2 .mu.m. The silicon nitride powder has a tap density of at least 0.9 g/cm.sup.3 and a mean particle size of 0.4 to 0.6 .mu.m and contains at least 95% by weight of particles having an aspect ratio of up to 3 and up to 5% by weight of coarse particles having a particle size of at least 2 .mu.m. The powder is moldable into a high density compact, from which a sintered part having improved dimensional precision and strength is obtained.
    Type: Grant
    Filed: June 15, 1993
    Date of Patent: September 20, 1994
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Haruyoshi Kuwabara, Akio Otsuka, Yasuyuki Maki, Meguru Kashida