Abstract: A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability of preventing etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material (8 and 9) formed on the ceramic substrate, and a circuit pattern section jointed to the patterns of brazing material. The patterns of brazing material includes a line pattern along the edge of the circuit pattern. Also, a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.

Abstract: To provide a metal-coated substrate capable of significantly improving an adhesion strength and stability between metal and a plastic film. By laminating a thermoplastic film layer 2 on a base body plastic film layer 3 to obtain a laminated plastic film, and a metal layer 1 is formed on the thermoplastic film layer 2, while controlling a temperature of the laminated plastic film.

Abstract: A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability to prevent etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material 8 and 9 formed on the ceramic substrate, a circuit pattern section jointed onto the pattern of brazing material; wherein the pattern of brazing material includes a line pattern along the edge of the circuit pattern, and a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.

Abstract: A metal substrate having high strength and stability of adhesion between a metal film and a plastic film, wherein the metal film can be made thin. The plastic film as a base is placed inside a device for applying a silane coupling agent and is dried at a temperature of 300° C., after which the vaporized silane coupling agent is blown onto the plastic film while the temperature is maintained at 300° C., and the surface of the plastic film is coated with the silane coupling agent. A film of copper is formed by sputtering on the surface of the plastic film thus coated with the coupling agent, and the plastic film provided with the sputtered copper film is coated with a glossy copper coating having the desired thickness using a plating method.

Abstract: A ferromagnetic powder containing iron as the principal component and containing more than 5 to 50 at. % Co, 0.1 to 30 at. % Al, 0.1 to 10 at. % of a rare earth element inclusive of Y, 0.05% by weight or less of an element belonging to Group 1a of the Periodic Table, and 0.1% by weight or less (inclusive of 0% by weight) of an element belonging to Group 2a of the Periodic Table, the powder comprising flat acicular particles having a mean major axis length of 0.01 to 0.40 &mgr;m and a crystallite diameter as determined by X-ray diffraction (Dx) of 50 to 250 angstrom, provided that the cross section diameter in the minor axis direction cut perpendicular to the major axis has a larger width and a smaller width, and that this cross section ratio in the minor axis direction, which is a larger width to smaller width ratio, uniformly yields a value of greater than 1, preferably 1.5 or higher, and the powder yielding a &sgr;s/Dx ratio of 0.