Abstract: A semiconductor device according to the present disclosure includes a base body having a first face and a second face, a lead passing through a through hole penetrating the base body and extending to a side of the first face, a sealing body filling the through hole, a dielectric substrate having a first main surface and a second main surface erected with respect to the first face, a semiconductor laser provided on a side of the first main surface of the dielectric substrate, a signal line provided on the first main surface and electrically connected to the semiconductor laser, a connecting member electrically connecting the signal line and the lead to each other, and a rear surface conductor provided on the second main surface, wherein the sealing body is provided directly below the rear surface conductor as viewed from a direction perpendicular to the first face.

Abstract: An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.

Abstract: This optical module comprises: a semiconductor laser, an optical receiver, and a lens that are mounted on a carrier; an optical fiber; and a control circuit that controls the injection current of the laser such that the output current is kept constant. The lens and at least a part of the receiver are respectively fixed on the carrier with resin bonding materials that undergo thermosetting shrinkage. Initial positions in the laser, a tip end part of the optical fiber, the receiver, and the lens with respect to a reference as the rear surface of the carrier are determined such that change trends of the optical coupling efficiency characteristics between the laser and the receiver and between the laser and the optical fiber are to be the same with respect to an exposure time during which the optical module is exposed to environmental temperature higher than room temperature.

Abstract: An inspection method for inspecting a semiconductor laser device integrated with a semiconductor laser, an electroabsorption modulator for input the output of the semiconductor laser, and a photodetector for detecting intensity of part of the laser light output from the semiconductor laser includes a step of acquiring a transverse-mode light output characteristic that is a relationship between an injection current to the semiconductor laser and the output of the photodetector; a step of applying a reverse bias voltage to the electroabsorption modulator and acquiring a total light output characteristic that is a relationship between the injection current to the semiconductor laser and a photocurrent output from the electroabsorption modulator; and a step of comparing the total light output characteristic with the transverse-mode light output characteristic, thereby to determine whether or not the semiconductor laser device under inspection is abnormal in the transverse mode.

Abstract: Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.

Abstract: Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.

Abstract: An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.

Abstract: An optical module includes a semiconductor laser element, a lens configured to collect emitted light that is emitted from the semiconductor laser element, a cap configured to hold the lens and hermetically seal the semiconductor laser element, a monitor light-receiving element configured to receive backlight of the semiconductor laser element, a transmission plate arranged between the semiconductor laser element and the monitor light-receiving element and configured to attenuate the backlight according to decrease in a temperature around the cap so as to cause the backlight to enter the monitor light-receiving element, and a control unit configured to control an injection current of the semiconductor laser element such that an output of the monitor light-receiving element is kept at a constant level.

Abstract: An optical module includes: a stem; a temperature control module; a carrier; a light emitting element fixed on a light emitting element fixing surface of the carrier, having a front surface and a rear surface opposite to each other, emitting signal light from a first emission point in the front surface, and emitting back light from a second emission point in the rear surface; a light receiving element fixed on the carrier by a light receiving element fixing surface; a lens cap; and a lens, wherein a reflecting surface is provided on the carrier, the light receiving element receives the back light reflected by the reflecting surface, and a center of a light receiving surface of the light receiving element is positioned between the front surface and the rear surface in an optical axis direction of the signal light.

Abstract: An optical module includes: a stem; a temperature control module; a carrier; a light emitting element fixed on a light emitting element fixing surface of the carrier, having a front surface and a rear surface opposite to each other, emitting signal light from a first emission point in the front surface, and emitting back light from a second emission point in the rear surface; a light receiving element fixed on the carrier by a light receiving element fixing surface; a lens cap; and a lens, wherein a reflecting surface is provided on the carrier, the light receiving element receives the back light reflected by the reflecting surface, and a center of a light receiving surface of the light receiving element is positioned between the front surface and the rear surface in an optical axis direction of the signal light.