Patents by Inventor Akio Sugito
Akio Sugito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11791304Abstract: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.Type: GrantFiled: November 7, 2019Date of Patent: October 17, 2023Assignee: KAIJO CORPORATIONInventors: Akio Sugito, Susumu Majima, Mami Kushima
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Patent number: 11302667Abstract: To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.Type: GrantFiled: August 26, 2020Date of Patent: April 12, 2022Assignee: KAIJO CORPORATIONInventors: Riki Jindo, Akio Sugito
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Publication number: 20210358881Abstract: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.Type: ApplicationFiled: November 7, 2019Publication date: November 18, 2021Inventors: Akio SUGITO, Susumu MAJIMA, Mami KUSHIMA
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Publication number: 20200388590Abstract: To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.Type: ApplicationFiled: August 26, 2020Publication date: December 10, 2020Inventors: Riki JINDO, Akio SUGITO
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Patent number: 10262969Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.Type: GrantFiled: November 7, 2017Date of Patent: April 16, 2019Assignee: KAIJO CORPORATIONInventor: Akio Sugito
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Publication number: 20180151532Abstract: To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.Type: ApplicationFiled: December 25, 2015Publication date: May 31, 2018Inventors: Riki JINDO, Akio SUGITO
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Patent number: 9935078Abstract: [Problem] To provide a bonding device in which a capillary can perform stable vibration from a low frequency to a high frequency while achieving lightening and downsizing of a load to be driven by a piezoelectric element and in which stable vibration can be transmitted to the capillary without disturbing operation of expansion and contraction of the piezoelectric element as keeping preliminary pressure to the capillary constant.Type: GrantFiled: February 19, 2015Date of Patent: April 3, 2018Assignee: KAIJO CORPORATIONInventor: Akio Sugito
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Publication number: 20180061803Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.Type: ApplicationFiled: November 7, 2017Publication date: March 1, 2018Inventor: Akio SUGITO
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Patent number: 9865562Abstract: To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.Type: GrantFiled: February 19, 2015Date of Patent: January 9, 2018Assignee: KAIJO CORPORATIONInventor: Akio Sugito
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Publication number: 20170005064Abstract: [Problem] To provide a bonding device in which a capillary can perform stable vibration from a low frequency to a high frequency while achieving lightening and downsizing of a load to be driven by a piezoelectric element and in which stable vibration can be transmitted to the capillary without disturbing operation of expansion and contraction of the piezoelectric element as keeping preliminary pressure to the capillary constant.Type: ApplicationFiled: February 19, 2015Publication date: January 5, 2017Inventor: Akio SUGITO
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Publication number: 20170005065Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.Type: ApplicationFiled: February 19, 2015Publication date: January 5, 2017Applicant: Kaijo CorporationInventor: Akio SUGITO
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Publication number: 20140054277Abstract: Improvement of productivity and product quality is achieved by improving bonding properties and reducing adverse effects caused by heating by supplying heated gaseous matter or gas to a limited area and during a limited period required for bonding.Type: ApplicationFiled: October 3, 2012Publication date: February 27, 2014Applicant: KAIJO CORPORATIONInventor: Akio Sugito
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Patent number: 8651355Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.Type: GrantFiled: May 28, 2012Date of Patent: February 18, 2014Assignee: Kaijo CorporationInventor: Akio Sugito
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Publication number: 20130256385Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.Type: ApplicationFiled: May 28, 2012Publication date: October 3, 2013Applicant: KAIJO CORPORATIONInventor: Akio Sugito