Patents by Inventor Akio Tanda

Akio Tanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package having a low profile structure and high strength
    Patent number: 5302852
    Abstract: A semiconductor device includes a semiconductor element, a base, a cap, leads, and low-melting glass. The semiconductor element is mounted on the base, and the base consists of high-purity alumina and has a thickness of 0.5 mm or less. The cap is arranged on the base to cover the semiconductor element, consists of translucent alumina, and has a thickness of 0.4 mm or less. The leads extend out of the semiconductor device to be interposed between the base and the cap, and are electrically connected to the semiconductor element. The low-melting glass integrally and hermetically seals the base, the leads, and the cap.
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: April 12, 1994
    Assignee: NEC Corporation
    Inventors: Kenichi Kaneda, Akio Tanda
  • Glass-sealed semiconductor device
    Patent number: 5087963
    Abstract: In a glass-sealed semiconductor device, low-melting glass is glazed on a ceramic base to fix a lead frame. A distal end portion of the lead frame, the distal end portion being connected to a semiconductor element, is fixed to the ceramic base through devitrifying glass layer.
    Type: Grant
    Filed: October 12, 1990
    Date of Patent: February 11, 1992
    Assignee: NEC Corporation
    Inventors: Kenichi Kaneda, Akio Tanda