Patents by Inventor Akio Taniguchi
Akio Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7799869Abstract: The present invention provides an acrylic block copolymer composition improving melt flowability at molding and being excellent in heat resistance in addition to maintain weather resistance, chemical resistance, adhesivity, flexibility and abrasion resistance which are the characteristics of the acrylic block copolymer. It is attained by a thermoplastic elastomer composition comprising an acrylic block copolymer (A) which comprises a methacrylic polymer block (a) and an acrylic polymer block (b), wherein at least one of polymer blocks among the methacrylic polymer block (a) and the acrylic polymer block (b) has a functional group (X), and a compound (B) containing 1.1 or more of functional groups (Y) in one molecule.Type: GrantFiled: January 24, 2005Date of Patent: September 21, 2010Assignee: Kaneka CorporationInventors: Akio Taniguchi, Takeshi Chiba
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Patent number: 7732529Abstract: The present invention provides an acrylic block copolymer composition improving melt flowability at molding and being excellent in heat resistance in addition to keep weather resistance, chemical resistance, adhesion property, flexibility and abrasion resistance which are the characteristics of the acrylic block copolymer. It is attained by a thermoplastic elastomer composition comprising an acrylic block copolymer (A) which comprises a methacrylic polymer block (a) and an acrylic polymer block (b), wherein at least one of polymer blocks among the methacrylic polymer block (a) and the acrylic polymer block (b) has an acid anhydride group and/or a carboxyl group, and an acrylic polymer (B) having 1.1 or more of epoxy groups in one molecule.Type: GrantFiled: January 24, 2005Date of Patent: June 8, 2010Assignee: Kaneka CorporationInventors: Akio Taniguchi, Takeshi Chiba
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Publication number: 20100016495Abstract: An object of the present invention is to provide: a thermoplastic elastomer composition, which is accompanied by less environmental burden, and which has flexibility, rubber elasticity, formability and recyclability; and a molded product obtained using the same. The present invention is directed to a thermoplastic elastomer composition comprising a thermoplastic resin (A) derived from a non-petroleum source, and at least one rubber (B) selected from a natural rubber, a diene polymer rubber, an olefin polymer rubber, an acrylic rubber and a silicone rubber, the thermoplastic elastomer composition being obtained by allowing the rubber (B) to be dynamically crosslinked with a crosslinking agent (C) in the presence of the thermoplastic resin (A). Preferred (A) is a polylactic acid, or a poly(3-hydroxybutyrate), and preferred (B) is a natural rubber.Type: ApplicationFiled: August 29, 2007Publication date: January 21, 2010Applicant: Kaneka CorporationInventor: Akio Taniguchi
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Publication number: 20080227905Abstract: The object of the present invention is to provide a thermoplastic elastomer composition having a good balance between the hardness and the mechanical strength, exhibiting superior rubber elasticity, high-temperature creep characteristics and formability in a wide range of temperature, and having oil resistance and heat resistance. The thermoplastic elastomer composition comprises (A) (meth)acrylic block copolymer; (B) a compound containing at least two amino groups in its molecule; and (C) a thermoplastic resin. The (meth)acrylic block copolymer (A) comprises (A1) a (meth)acrylic copolymer block and (A2) an acrylic copolymer block. A1 least one of the polymer blocks has at least one acid anhydride group. The (meth)acrylic block copolymer (A) and the compound (B) are dynamically vulcanized in the thermoplastic resin (C).Type: ApplicationFiled: March 5, 2004Publication date: September 18, 2008Inventors: Atsushi Kumasaki, Akio Taniguchi, Tadashi Kokubo, Takeshi Chiba
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Patent number: 7407694Abstract: The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.Type: GrantFiled: August 11, 2005Date of Patent: August 5, 2008Assignee: Kaneka CorporationInventors: Akio Taniguchi, Kentaro Takesada, Yutaka Kaneda, Tadashi Kokubo, Nobuaki Ohshiro, Atsushi Kumasaki, Takeshi Chiba, Tomoki Hiiro
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Patent number: 7309736Abstract: The present invention provides a novel acrylic block copolymer rich in flexibility and excellent in mechanical strength, moldability, oil resistance, heat resistance, thermal decomposition resistance, weather resistance, and compression set, and further rich in reactivity. The present invention also provides compositions, seal products, and automobile, electric, and electronic parts, all of which include the acrylic block copolymer. The acrylic block copolymer includes a methacrylic polymer block (a) and an acrylic polymer block (b), at least one of the polymer blocks containing, in its main chain, at least one acid anhydride group (c) represented by formula (1): (wherein R1s each represent hydrogen or a methyl group and may be the same or different, n represents an integer of 0 to 3, and m represents an integer of 0 or 1).Type: GrantFiled: July 31, 2003Date of Patent: December 18, 2007Assignee: Kaneka CorporationInventors: Akio Taniguchi, Tadashi Kokubo, Kentaro Takesada, Kozo Kondo, Takeshi Chiba, Atsushi Kumasaki, Yutaka Kaneda
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Publication number: 20070173604Abstract: The present invention provides an acrylic block copolymer composition improving melt flowability at molding and being excellent in heat resistance in addition to maintain weather resistance, chemical resistance, adhesivity, flexibility and abrasion resistance which are the characteristics of the acrylic block copolymer. It is attained by a thermoplastic elastomer composition comprising an acrylic block copolymer (A) which comprises a methacrylic polymer block (a) and an acrylic polymer block (b), wherein at least one of polymer blocks among the methacrylic polymer block (a) and the acrylic polymer block (b) has a functional group (X), and a compound (B) containing 1.1 or more of functional groups (Y) in one molecule.Type: ApplicationFiled: January 24, 2005Publication date: July 26, 2007Inventors: Akio Taniguchi, Takeshi Chiba
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Publication number: 20070123651Abstract: The present invention provides an acrylic block copolymer composition improving melt flowability at molding and being excellent in heat resistance in addition to keep weather resistance, chemical resistance, adhesion property, flexibility and abrasion resistance which are the characteristics of the acrylic block copolymer. It is attained by a thermoplastic elastomer composition comprising an acrylic block copolymer (A) which comprises a methacrylic polymer block (a) and an acrylic polymer block (b), wherein at least one of polymer blocks among the methacrylic polymer block (a) and the acrylic polymer block (b) has an acid anhydride group and/or a carboxyl group, and an acrylic polymer (B) having 1.1 or more of epoxy groups in one molecule.Type: ApplicationFiled: January 24, 2005Publication date: May 31, 2007Inventors: Akio Taniguchi, Takeshi Chiba
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Publication number: 20070110825Abstract: The present invention herein provides antimicrobial zeolite which hardly causes any color change with the elapse of time even when it is incorporated into a resin to form an antimicrobial resin composition. The present invention thus relates to antimicrobial zeolite which comprises zeolite whose ion-exchangeable ions are partially or wholly replaced with hydrogen ions and silver ions; and an antimicrobial resin composition which comprises the foregoing antimicrobial zeolite in an amount ranging from 0.05 to 80% by mass.Type: ApplicationFiled: January 3, 2007Publication date: May 17, 2007Applicant: Sinanen Zeomic Co., Ltd.Inventors: Akio Taniguchi, Kumiko Miyake, Yasuo Kurihara
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Patent number: 7125570Abstract: An antibacterial composition is provided which comprises a base, an antibacterial agent consisting of a silver-supporting inorganic compound and a water-soluble salt of a nitrogen atom-containing 6-membered heterocyclic compound. In the antibacterial composition, the silver component susceptible to discoloration is effectively stabilized by the use of the water-soluble salt of a nitrogen atom-containing 6-membered heterocyclic compound and therefore, the antibacterial composition never or hardly undergoes any discoloration with the lapse of time.Type: GrantFiled: February 28, 2003Date of Patent: October 24, 2006Assignee: Sinanen Zeomic Co., Ltd.Inventors: Akio Taniguchi, Yasuo Kurihara, Masashi Uchida
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Publication number: 20050272865Abstract: The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.Type: ApplicationFiled: August 11, 2005Publication date: December 8, 2005Inventors: Akio Taniguchi, Kentaro Takesada, Yutaka Kaneda, Tadashi Kokubo, Nobuaki Ohshiro, Atsushi Kumasaki, Takeshi Chiba, Tomoki Hiiro
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Publication number: 20050234199Abstract: The present invention provides a novel acrylic block copolymer rich in flexibility and excellent in mechanical strength, moldability, oil resistance, heat resistance, thermal decomposition resistance, weather resistance, and compression set, and further rich in reactivity. The present invention also provides compositions, seal products, and automobile, electric, and electronic parts, all of which include the acrylic block copolymer. The acrylic block copolymer includes a methacrylic polymer block (a) and an acrylic polymer block (b), at least one of the polymer blocks containing, in its main chain, at least one acid anhydride group (c) represented by formula (1): (wherein R1s each represent hydrogen or a methyl group and may be the same or different, n represents an integer of 0 to 3, and m represents an integer of 0 or 1).Type: ApplicationFiled: July 31, 2003Publication date: October 20, 2005Applicant: Kaneka CorporationInventors: Akio Taniguchi, Tadashi Kokubo, Kentaro Takesada, Kozo Kondo, Takeshi Chiba, Atsushi Kumasaki, Yutaka Kaneda
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Publication number: 20050085592Abstract: The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.Type: ApplicationFiled: February 12, 2003Publication date: April 21, 2005Inventors: Akio Taniguchi, Kentaro Takesada, Yutaka Keneda, Tadashi Kokubo, Nobuaki Ohshiro, Atsushi Kumasaki, Takeshi Chiba, Tomoki Hiiro
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Publication number: 20040146567Abstract: An antibacterial composition is provided which comprises a base, an antibacterial agent consisting of a silver-supporting inorganic compound and a water-soluble salt of a nitrogen atom-containing 6-membered heterocyclic compound. In the antibacterial composition, the silver component susceptible to discoloration is effectively stabilized by the use of the water-soluble salt of a nitrogen atom-containing 6-membered heterocyclic compound and therefore, the antibacterial composition never or hardly undergoes any discoloration with the lapse of time.Type: ApplicationFiled: February 28, 2003Publication date: July 29, 2004Applicant: SINANEN ZEOMIC CO., LTD.Inventors: Akio Taniguchi, Yasuo Kurihara, Masashi Uchida
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Patent number: 4314014Abstract: Disclosed is an electrophotographic plate having a laminated structure comprising a first Se layer containing 3 to 10% by weight of As, a second Se layer containing 40 to 47% by weight of Te and 3 to 10% by weight of As and a fourth Se layer consisting solely of Se or comprising Se and up to 10% by weight of As or an organic semiconductor layer, wherein a substrate is arranged so that at least the face of the substrate which is contiguous to the face of one of said first Se layer and said fourth Se layer or organic semiconductor layer, that is located on the outer side of the laminated structure, is electrically conductive.It is preferred that the fourth Se layer be formed by vacuum evaporation deposition while maintaining the substrate temperature at 50.degree. to 80.degree. C. The residual potential of the electrophotographic plate can be reduced.Type: GrantFiled: June 11, 1980Date of Patent: February 2, 1982Assignee: Hitachi, Ltd.Inventors: Hideaki Yamamoto, Akio Taniguchi, Shinkichi Horigome, Susumu Saito, Yoshiaki Mori, Eiichi Maruyama