Patents by Inventor Akio Watakabe

Akio Watakabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6720790
    Abstract: There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: April 13, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koji Eriguchi, Yukiko Hashimoto, Akio Watakabe
  • Publication number: 20030169065
    Abstract: There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
    Type: Application
    Filed: March 12, 2003
    Publication date: September 11, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koji Eriguchi, Yukiko Hashimoto, Akio Watakabe
  • Patent number: 6583640
    Abstract: There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: June 24, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koji Eriguchi, Yukiko Hashimoto, Akio Watakabe
  • Publication number: 20020024351
    Abstract: There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
    Type: Application
    Filed: March 15, 2001
    Publication date: February 28, 2002
    Inventors: Koji Eriguchi, Yukiko Hashimoto, Akio Watakabe