Patents by Inventor Akio Yoshizawa

Akio Yoshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10041154
    Abstract: An aluminum alloy sheet includes an aluminum alloy substrate having a composition containing, by mass percentage, 3.0 to 4.0% of magnesium, 0.2 to 0.4% of manganese, 0.1 to 0.5% of iron, not less than 0.03% but less than 0.10% of copper, and less than 0.20% of silicon, with the remainder being aluminum and unavoidable impurities. A peak concentration of a copper concentration distribution in a thickness direction in a region at a depth of 15 nm to 200 nm from the surface of the aluminum alloy substrate is equal to or more than 0.15%, and the aluminum alloy substrate has a recrystallized structure with an average grain size of 15 ?m or less.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: August 7, 2018
    Assignees: NIPPON LIGHT METAL COMPANY, LTD., NISSAN MOTOR CO., LTD.
    Inventors: Tomoyuki Hirayama, Pizhi Zhao, Takeshi Handa, Toshiya Anami, Yusuke Nagaishi, Koji Itakura, Hirokazu Miyagawa, Tsutomu Hattori, Shigenori Yoshizawa, Akio Yoshizawa
  • Publication number: 20140166162
    Abstract: An aluminum alloy sheet includes an aluminum alloy substrate having a composition containing, by mass percentage, 3.0 to 4.0% of magnesium, 0.2 to 0.4% of manganese, 0.1 to 0.5% of iron, not less than 0.03% but less than 0.10% of copper, and less than 0.20% of silicon, with the remainder being aluminum and unavoidable impurities. A peak concentration of a copper concentration distribution in a thickness direction in a region at a depth of 15 nm to 200 nm from the surface of the aluminum alloy substrate is equal to or more than 0.15%, and the aluminum alloy substrate has a recrystallized structure with an average grain size of 15 ?m or less.
    Type: Application
    Filed: July 10, 2012
    Publication date: June 19, 2014
    Inventors: Tomoyuki Hirayama, Pizhi Zhao, Takeshi Handa, Toshiya Anami, Yusuke Nagaishi, Koji Itakura, Hirokazu Miyagawa, Tsutomu Hattori, Shigenori Yoshizawa, Akio Yoshizawa