Abstract: A vane member comprises a first member and a second member, the first member and the second member are joined by that an insert member whose melting temperature is lower than melting temperatures of the first and second members contacts the first and second members, the insert member is heated to a welding temperature which is lower than the melting temperatures of the first and second members and is higher than the melting temperature of the insert member so that a mutual diffusion between at least an original base component of the insert member and at least an original base component of the first member different from the original base component of the insert member and a mutual diffusion between at least the original base component of the insert member and at least an original base component of the second member different from the original base component of the insert member are caused by the heating, and the mutual diffusions by the heating are continued at least until the original base component of the i

Abstract: An electromagnetic flowmeter comprises a ceramic measuring tube through which fluid to be measured flows, a pair of electromagnetic coils disposed on the outer surface of the measuring tube in the central region thereof at diametrically opposite positions and generating a magnetic field in a direction perpendicular to the direction of flow of the fluid, a pair of measuring electrodes fixed to the outer surface of the measuring tube in the central region thereof at diametrically opposite positions and having electrode axes perpendicular to both the direction of flow of the fluid and the direction of the magnetic field, and a pair of metallic shields fixed to the outer surface of the measuring tube in surrounding relation to the measuring electrodes. A pair of the measuring electrodes and a pair of the metallic shields are fixed to the ceramic measuring tube by a reaction product due to an interface reaction with the ceramic measuring tube under heating.

Abstract: Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like.

Abstract: An electromagnetic flowmeter for measuring the flow rate of a fluid. The flowmeter has a measuring tube made of ceramics and defining a fluid passage therein for the fluid, electrodes having ends exposed to an interior of the measuring tube through holes which are formed in a wall of the measuring tube, a magnetic field generating device disposed around the electrodes, and a case encasing the measuring tube, the electrodes and the magnetic field generating means. A ratio t/R between a wall thickness t and a mean radius R of the measuring tube is determined such that stress generated in the measuring tube by the fluid in the measuring tube does not exceed the rupture stress of the measuring tube. The measuring tube can have flanges on both axial ends thereof, a radial height of the flange from an outer surface of the measuring tube is not greater than the wall thickness of the tube when the tube is made of Al.sub.2 O.sub.

Abstract: A slider unit having a reading or reproducing head, with the head being adapted to float over a surface of an information recording disc. The slider unit includes a slider body having a flying height sensor with float surfaces on an underside thereof to generate a lifting force. A piezoelectrically or electrostatically controlled valve layer may be positioned over a vent communicating between an upper surface of the slider, with the vent opening to a recess for generating a negative lift component at an underside of the slider unit. The slider body is made from a ceramic base portion and includes a semiconductive insert portion of, for example, silicon or a photosensitive glass with an adjustment device being formed by utilization of microfabrication techniques such as deposition and etching.

Abstract: In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrodes which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrodes even when water permeates to the side face of the stacked body during operation in a humid atmosphere.

Abstract: According to the present invention, there are provided a stack-type piezoelectric element constructed of a stacked body comprising plural layers of sintered piezoelectric ceramic material and electrodes which lie between the respective layers of the piezoelectric ceramic material, wherein said electrodes are formed of a material capable of diffusion-bonding with said piezoelectric ceramic material at a lower temperature than the sintering temperature of said ceramic material, a process for producing the same, and a stack-type piezoelectric device using said stack-type piezoelectric element.

Abstract: A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

Abstract: In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrode which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrode even when water permeates to the side face of the stacked body during operation in humid atmosphere.

Abstract: An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

Abstract: A ceramic conduit with a metal outer tube is joined to bonding rings through insert members between end surfaces of the rings and annular bonding surfaces, with the annular bonding surface being not parallel to the axis of the conduit and the insert member being bonded to the ring and conduit. The rings are joined to the outer tube through welds between forward ends of annular protrusions provided in end surfaces which are the reverse surfaces of the surface bonded with the insert members and the forward ends of annular protrusions provided in axial end surfaces of the outer tube. The inner periphery of the outer tube is fitted on the outer periphery of the conduit with a small gap therebetween. The rings are bonded to the conduit with the insert members by being pressed against the conduit in the axial direction of the conduit and only a small quantity of heat is transmitted from the welds to other portions.

Abstract: A three-layer clad plate or a laminated sheet comprising a core piece made of aluminum or its alloy and surfaces made of an aluminum-silicon alloy is inserted between the bonding surfaces of ceramics or between the bonding surface of a ceramic and that of a metal. The resulting structure is maintained at a bonding temperature lower than the melting point of aluminum or its alloy and higher than the solidus of the aluminum-silicon alloy while pressurizing the inserting material, thus bonding the ceramics to each other or the ceramic to the metal.

Abstract: This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method.The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.

Abstract: When a ceramic is bonded to a metal having a low thermal expansion, if a Cr layer of a Cr diffusion layer is formed on the surface of the metal and the ceramic is bonded to the metal through this Cr layer or Cr diffusion layer by an Al insert, a bonded structure having a good air-tightness and a high strength is obtained.

Abstract: A method of bonding alumina to a metal characterized in that an aluminum or aluminum-base alloy sheet is inserted between the alumina and the metal when they are bonded together by being heated and pressed, thereby obtaining a product which has a high reliability in strength at the joint and a high dimensional accuracy.

Abstract: The present invention relates to a method for bonding a non-oxide ceramic to a metal through an intermediate material comprising at least one member selected from metals of the Groups VIa and VIII of the Periodic Table. This method is suitably used for bonding of a structural part of a machine, an electronic part and the like.

Abstract: In an apparatus wherein heat generating bodies such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member which has a plurality of layers of cavity groups and apertures for bringing the cavity groups into communication is installed on a surface of each of the heat generating bodies.