Patents by Inventor Akira AKAISHI

Akira AKAISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230392291
    Abstract: Provided is a GaAs wafer that can suitably be used to produce LiDAR sensors in particular and a method of producing a GaAs ingot that can be used to obtain such a GaAs wafer. The GaAs wafer has a silicon concentration of 5.0×1017 cm?3 or more and less than 3.5×1018 cm?3, an indium concentration of 3.0×1017 cm?3 or more and less than 3.0×1019 cm?3, and a boron concentration of 1.0×1018 cm?3 or more. The average dislocation density of the GaAs wafer is 1500/cm2 or less.
    Type: Application
    Filed: September 27, 2021
    Publication date: December 7, 2023
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Naoya SUNACHI, Ryuichi TOBA, Akira AKAISHI
  • Publication number: 20230243067
    Abstract: Provided is a GaAs ingot with which a GaAs wafer having a carrier concentration of 5.5×1017 cm?3 or less and low dislocation density with an average dislocation density of 500/cm2 or less can be obtained by adding a small amount of In with Si. A seed side end and a center portion of a straight body part of the GaAs ingot each have a silicon concentration of 2.0×1017 cm?3 or more and less than 1.5×1018 cm?3, an indium concentration of 1.0×1017cm?3 or more and less than 6.5×1018 cm?3, a carrier concentration of 5.5×1017 cm?3 or less, and an average dislocation density of 500/cm2 or less.
    Type: Application
    Filed: June 7, 2021
    Publication date: August 3, 2023
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Naoya SUNACHI, Ryuichi TOBA, Akira AKAISHI
  • Patent number: 11195127
    Abstract: A transfer method controls transfer of a template in a system (1) that supports introduction of an ERP package for a plurality of customer companies. The template includes: a plurality of software modules necessary for performing a plurality of functions including functions tailored to a plurality of industries or functions tailored to part of the industries; and a plurality of parameter settings used for determining operations of the software modules. The transfer method includes: a reception step of receiving an instruction to transfer a template; and a transfer step of transferring, on receiving the instruction to transfer a template, a plurality of software modules and a plurality of parameter settings which are included in the template from a first server (20) used for developing the template to a second server (30) used for performing a test for each customer company.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: December 7, 2021
    Assignee: ABeam Consulting Kabushiki Kaisha
    Inventors: Akira Akaishi, Masaki Tomida, Shinjiro Okuda
  • Publication number: 20200356930
    Abstract: A transfer method controls transfer of a template in a system (1) that supports introduction of an ERP package for a plurality of customer companies. The template includes: a plurality of software modules necessary for performing a plurality of functions including functions tailored to a plurality of industries or functions tailored to part of the industries; and a plurality of parameter settings used for determining operations of the software modules. The transfer method includes: a reception step of receiving an instruction to transfer a template; and a transfer step of transferring, on receiving the instruction to transfer a template, a plurality of software modules and a plurality of parameter settings which are included in the template from a first server (20) used for developing the template to a second server (30) used for performing a test for each customer company.
    Type: Application
    Filed: March 2, 2018
    Publication date: November 12, 2020
    Inventors: Akira AKAISHI, Masaki TOMIDA, Shinjiro OKUDA