Abstract: The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

Abstract: Provided is an agent for promoting root nodule formation, which contains cinnamic acid or hydroxycinnamic acid as an active ingredient.

Abstract: The present disclosure is intended to enhance the capability for arbuscular mycorrhizal symbiosis by treating the arbuscular mycorrhizal fungi with oxidized glutathione or cystathionine.

Abstract: The present disclosure is intended to enhance the capability for arbuscular mycorrhizal symbiosis by treating the arbuscular mycorrhizal fungi with oxidized glutathione or cystathionine.

Abstract: A leadframe facilitates the bonding of leads to semiconductor chips. The leadframe has two longitudinal bands transversely spaced from each other, and connected by bar-like segments initially non-perpendicular to the bands, and spaced longitudinally along the leadframe. The leadframe also includes leads projecting from both of the bands, the leads projecting from one band being interleaved with those projecting from the other band. When one moves the longitudinal bands relative to each other longitudinally, the leads projecting from the first band come into alignment with the leads projecting from the second band. Thus, if one has first bonded semiconductor chips to the ends of the leads projecting from the first band, then movement of the bands longitudinally makes it easy to connect the second leads to each of the semiconductor chips.

Abstract: The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cuase the pair of leads to move toward each other, so that a semicondductor chip is sandwiched between the pair of leads for bonding.

Abstract: The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cause the pair of leads to move toward each other, so that a semiconductor chip is sandwiched between the pair of leads for bonding.

Abstract: Solid bodies of polypeptides having repeating units of aspartic, glutamic, and aminoadipic esters are reacted with hydrazine or an amine having at least two NH.sub.2 groups until the ester moieties of the side chains are partly converted to the hydrazines or amides, and the side chains are partly crosslinked hydrazides other units by reaction with the hydrazine or diamine so as to make the polypeptide insoluble and infusible. The remaining ester moieties are saponified, and the resulting hydrophilic, but water-insoluble solid acts as an ampholyte in contact with water or other polar solvents. It may be used for capturing heavy metal ions from their aqueous solutions.