Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.

Abstract: A laser processing apparatus for performing processing such as perforation on a ceramic green sheet etc. using a laser beam efficiently. The laser processing apparatus is provided with a plurality of optical path systems disposed between a laser oscillator and an irradiation position control optical system for irradiating a predetermined position on a work piece with a laser beam. The plurality of optical path systems includes an optical path system that guides the laser beam to the irradiation position control optical system without changing its cross sectional shape in the direction perpendicular to the optical axis of the laser beam and an optical path system that guides the laser beam while changing its cross sectional shape so that these optical path systems are selectively used in accordance with the processing condition.

Abstract: A laser processing apparatus for performing processing such as perforation on a ceramic green sheet etc. using a laser beam efficiently. The laser processing apparatus is provided with a plurality of optical path systems disposed between a laser oscillator and an irradiation position control optical system for irradiating a predetermined position on a work piece with a laser beam. The plurality of optical path systems includes an optical path system that guides the laser beam to the irradiation position control optical system without changing its cross sectional shape in the direction perpendicular to the optical axis of the laser beam and an optical path system that guides the laser beam while changing its cross sectional shape so that these optical path systems are selectively used in accordance with the processing condition.