Abstract: There are provided methods of inspecting an optical waveguide including inspecting the degree of curvature of a light reflecting surface formed in a core of the optical waveguide, and of manufacturing an optical waveguide using the same. In the method of inspecting an optical waveguide, light enters the core of the optical waveguide via a connection surface in a second end portion of the core, to reflect from light reflecting surfaces in a first end portion of the core and to exit the optical waveguide, and the exiting light is imaged by a camera. Then, the brightness of the exiting light is measured by determining the brightness of the obtained image. The degree of curvature of the light reflecting surfaces decreases as the measurement value of brightness increases. Thus, an optical waveguide having a brightness greater than a reference value has light reflecting surfaces which are nearly flat.

Abstract: A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 ?m but less than 8 ?m, and the metal wiring layer having a thickness of greater than or equal to 0.1 ?m but less than 0.5 ?m. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.

Abstract: A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 ?m but less than 8 ?m, and the metal wiring layer having a thickness of greater than or equal to 0.1 ?m but less than 0.5 ?m. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.

Abstract: An exposure system includes an exposure device and an image processing device. The exposure device includes a plurality of cameras. Each of the cameras is configured so as to be selectively set to a full scan mode and a partial scan mode. The camera transmits all of obtained image data in the full scan mode, and extracts part of the obtained image data and transmits the partial image data in the partial scan mode. The image processing device paratactically performs processing using the image data transmitted from the camera and processing using the image data transmitted from the camera.

Abstract: When an alignment mark does not exist within an area of an image obtained by a camera, the coordinate of the alignment mark is calculated based on an identification mark existing in the area of the image and a previously stored positional relationship between the alignment mark and the identification mark. A distance by which a long-sized base material is to be moved for causing the alignment mark to be positioned within the imaging area of the camera is calculated based on the calculated coordinate of the alignment mark, and the long-sized base material is moved by the calculated distance.

Abstract: An exposure system includes an exposure device and an image processing device. The exposure device includes a plurality of cameras. Each of the cameras is configured so as to be selectively set to a full scan mode and a partial scan mode. The camera transmits all of obtained image data in the full scan mode, and extracts part of the obtained image data and transmits the partial image data in the partial scan mode. The image processing device paratactically performs processing using the image data transmitted from the camera and processing using the image data transmitted from the camera.

Abstract: When an alignment mark does not exist within an area of an image obtained by a camera, the coordinate of the alignment mark is calculated based on an identification mark existing in the area of the image and a previously stored positional relationship between the alignment mark and the identification mark. A distance by which a long-sized base material is to be moved for causing the alignment mark to be positioned within the imaging area of the camera is calculated based on the calculated coordinate of the alignment mark, and the long-sized base material is moved by the calculated distance.