Patents by Inventor Akira Ebisui

Akira Ebisui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11867580
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: January 9, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
  • Publication number: 20230408355
    Abstract: A sensor apparatus and a robotic apparatus that can detect a distribution of a shearing force. A sensor apparatus according to an embodiment of the present technology includes a sensor section, a separation layer, and a first viscoelastic body layer. The sensor section includes a first pressure sensor on a front side of the sensor section that faces and a second pressure sensor on a rear side of the sensor section, the sensor section detecting a force applied in an in-plane direction. The separation layer is between the first pressure sensor and the second pressure sensor, and is made of a viscoelastic material that is deformed by a load applied to the first pressure sensor. The first viscoelastic body layer is on a front surface of the first pressure sensor, and is made of a viscoelastic material that is deformable on the first pressure sensor in the in-plane direction.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 21, 2023
    Applicant: SONY GROUP CORPORATION
    Inventors: Ken KOBAYASHI, Kei TSUKAMOTO, Yoshiaki SAKAKURA, Tetsuro GOTO, Akira EBISUI
  • Patent number: 11725992
    Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 15, 2023
    Assignee: SONY CORPORATION
    Inventors: Ken Kobayashi, Akira Ebisui, Yoshiaki Sakakura, Tomoko Katsuhara, Hayato Hasegawa, Manami Miyawaki
  • Patent number: 11592941
    Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 28, 2023
    Assignee: SONY CORPORATION
    Inventors: Akira Ebisui, Ken Kobayashi, Hayato Hasegawa, Yoshiaki Sakakura, Manami Miyawaki
  • Publication number: 20220390303
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 8, 2022
    Applicant: SONY GROUP CORPORATION
    Inventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
  • Patent number: 11520446
    Abstract: Provided is a sensor including a sensor electrode unit including: a sensing unit of a capacitance type that detects pressing; and a temperature detection sensing unit of a capacitance type provided in an area corresponding to the sensing unit.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: December 6, 2022
    Assignee: SONY CORPORATION
    Inventors: Tetsuro Goto, Tomoko Katsuhara, Akira Ebisui
  • Patent number: 11481080
    Abstract: A sensor device according to an embodiment of the present disclosure includes a plurality of detection electrode sections of a capacitive type, a reference electrode layer disposed at a position that faces each of the detection electrode sections, and a pressing transmission layer that causes locations, of the reference electrode layer, that face the respective detection electrode sections to be deformed locally in response to pressing performed from outside.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: October 25, 2022
    Assignee: SONY GROUP CORPORATION
    Inventors: Ken Kobayashi, Kei Tsukamoto, Yoshiaki Sakakura, Akira Ebisui
  • Patent number: 11402283
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: August 2, 2022
    Assignee: SONY CORPORATION
    Inventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
  • Patent number: 11397499
    Abstract: [Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: July 26, 2022
    Assignee: SONY GROUP CORPORATION
    Inventors: Akira Ebisui, Ken Kobayashi, Yoshiaki Sakakura, Hayato Hasegawa, Manami Miyawaki
  • Publication number: 20220066598
    Abstract: A sensor device according to an embodiment of the present disclosure includes a plurality of detection electrode sections of a capacitive type, a reference electrode layer disposed at a position that faces each of the detection electrode sections, and a pressing transmission layer that causes locations, of the reference electrode layer, that face the respective detection electrode sections to be deformed locally in response to pressing performed from outside.
    Type: Application
    Filed: December 5, 2019
    Publication date: March 3, 2022
    Inventors: KEN KOBAYASHI, KEI TSUKAMOTO, YOSHIAKI SAKAKURA, AKIRA EBISUI
  • Publication number: 20220027017
    Abstract: [Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.
    Type: Application
    Filed: November 28, 2019
    Publication date: January 27, 2022
    Inventors: AKIRA EBISUI, KEN KOBAYASHI, YOSHIAKI SAKAKURA, HAYATO HASEGAWA, MANAMI MIYAWAKI
  • Publication number: 20210181897
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.
    Type: Application
    Filed: September 14, 2017
    Publication date: June 17, 2021
    Applicant: SONY CORPORATION
    Inventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
  • Patent number: 11029221
    Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body. The pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit. The first deformation layer and the second deformation layer satisfy a predetermined relationship.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: June 8, 2021
    Assignee: Sony Corporation
    Inventors: Ken Kobayashi, Akira Ebisui, Kei Tsukamoto, Taizo Nishimura, Tetsuro Goto, Tomoki Kawabata, Makoto Yamaguchi
  • Publication number: 20210132704
    Abstract: A sensor includes: a sensor layer including a capacitive sensing section; and a metal layer facing a surface on one side of the sensor layer, in which the metal layer has projected portions provided at peripheral edges of regions facing the sensing sections.
    Type: Application
    Filed: March 1, 2018
    Publication date: May 6, 2021
    Applicant: Sony Corporation
    Inventors: Tomoki Kawabata, Hiroshi Mizuno, Ken Kobayashi, Akira Ebisui, Taizo Nishimura
  • Publication number: 20210109627
    Abstract: Provided is a sensor including a sensor electrode unit including: a sensing unit of a capacitance type that detects pressing; and a temperature detection sensing unit of a capacitance type provided in an area corresponding to the sensing unit.
    Type: Application
    Filed: February 14, 2018
    Publication date: April 15, 2021
    Applicant: SONY CORPORATION
    Inventors: Tetsuro GOTO, Tomoko KATSUHARA, Akira EBISUI
  • Publication number: 20210041973
    Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.
    Type: Application
    Filed: March 6, 2019
    Publication date: February 11, 2021
    Inventors: AKIRA EBISUI, KEN KOBAYASHI, HAYATO HASEGAWA, YOSHIAKI SAKAKURA, MANAMI MIYAWAKI
  • Patent number: 10871846
    Abstract: A sensor panel includes a sensor section that detects magnetic force of a contacting surface or a region in the vicinity of the contacting surface on a basis of a change in capacitance and is allowed to output a signal depending on the change in capacitance along with information on a position where the change in capacitance has occurred.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: December 22, 2020
    Assignee: SONY CORPORATION
    Inventors: Taizo Nishimura, Hiroto Kawaguchi, Hiroshi Mizuno, Shogo Shinkai, Fumihiko Iida, Akira Ebisui, Kei Tsukamoto, Tomoko Katsuhara
  • Publication number: 20200348191
    Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.
    Type: Application
    Filed: December 28, 2018
    Publication date: November 5, 2020
    Inventors: KEN KOBAYASHI, AKIRA EBISUI, YOSHIAKI SAKAKURA, TOMOKO KATSUHARA, HAYATO HASEGAWA, MANAMI MIYAWAKI
  • Patent number: 10671180
    Abstract: Provided are an input device and an electronic apparatus each including capacitive elements and being capable of allowing a plurality of information items to be separately input by simple operations. The input device includes: a capacitive element; a conductor that can be electrostatically coupled to the capacitive element; an operation portion that allows a load to be applied to the conductor; and a retaining portion that retains the conductor apart from the capacitive element. The retaining portion is capable of displacing the conductor with respect to the capacitive element in a stepwise manner in accordance with the load that is applied to the conductor through intermediation of the operation portion, and is capable of retaining the conductor at a plurality of positions with respect to the capacitive element.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: June 2, 2020
    Assignee: SONY CORPORATION
    Inventors: Taizo Nishimura, Hiroto Kawaguchi, Hiroshi Mizuno, Takashi Itaya, Akira Ebisui, Tomoko Katsuhara, Yoshiteru Taka
  • Patent number: 10627297
    Abstract: A sensor includes a base layer and a pressing unit protruding with respect to the base layer. The pressing unit includes a first structure unit and a hollow second structure unit disposed on the first structure unit and having a bottom side opened. The second structure unit has a shape portion on a surface facing the base layer.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: April 21, 2020
    Assignee: SONY CORPORATION
    Inventors: Akira Ebisui, Hiroshi Mizuno, Tomoko Katsuhara, Taizo Nishimura, Yoshiaki Sakakura, Toshio Kano, Toshiyuki Onodera, Takeshi Takahashi, Toru Takahashi, Tatsuo Suzuki