Patents by Inventor Akira Fujie

Akira Fujie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4771080
    Abstract: There is disclosed expandable vinylidene chloride-based resin particles comprising 100 parts by weight of a non-crystalline vinylidene chloride-based resin composition and 1 to 40 parts by weight of a volatile organic blowing agent or a composition thereof, said resin composition consisting ofa tetrahydrofuran-soluble component [A] which is a random copolymer having a weight-average molecular weight of 10,000 to 600,000 and constituted of different units represented severally by the following general formulae ##STR1## wherein; R.sub.1 denotes alkyl of 1 to 4 carbon atoms, cyclohexyl, phenyl, or each of R.sub.6 and R.sub.7 being --CH.sub.3, --C.sub.2 H.sub.5, --Cl, --Br, --OCH.sub.3, or --H; each of R.sub.2 and R.sub.4 denotes --H or --CH.sub.3 ; R.sub.3 denotes halogen, --CN, ##STR2## n being an integer 1 to 8 and R.sub.
    Type: Grant
    Filed: December 24, 1987
    Date of Patent: September 13, 1988
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Ichiro Ibuki, Akira Fujie, Nobuo Miura
  • Patent number: 4644013
    Abstract: The present disclosure is directed to foam particles of a linear, uncrosslinked ethylenic resin which can be expansion molded by heating in its uncrosslinked state. The present disclosure is also concerned with a process for preparing foam particles of a linear uncrosslinked ethylenic resin and a process for the in-mold foam molding of said resin particles.
    Type: Grant
    Filed: April 6, 1984
    Date of Patent: February 17, 1987
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Akira Fujie, Tsukasa Yamagishi
  • Patent number: 4493788
    Abstract: A foamable, electroconductive polyolefinic resin composition comprising 70 to 95 weight percent of a polyolefinic resin and 5 to 30 weight percent of an electrically-conductive particulate furnace black having a specific surface area of at least 900 square meters per gram. Foam products prepared from this composition, preferably by extrusion foaming, are particularly useful for packaging sensitive electronic parts.
    Type: Grant
    Filed: August 10, 1982
    Date of Patent: January 15, 1985
    Assignee: The Dow Chemical Company
    Inventors: Akira Fujie, Minoru Hisamatsu
  • Patent number: 4431575
    Abstract: Electroconductive olefin polymer foams which are suitable for use as packaging/cushioning materials for sensitive electronic parts are prepared from olefin polymer compositions which comprise a major proportion by weight of an olefin polymer, from 5 to 30 weight percent, based on said olefin polymer, of an electroconductive carbon black and from 0.1 to 10 weight percent, based on said olefin polymer of a saturated fatty acid amide compound.
    Type: Grant
    Filed: November 8, 1982
    Date of Patent: February 14, 1984
    Assignee: The Dow Chemical Company
    Inventors: Akira Fujie, Minoru Hisamatsu