Abstract: This invention is intended to identify a gene cluster involved in biosynthesis of a cyclic peptide compound produced by a filamentous fungus of the Curvularia species and to establish a system for synthesizing such cyclic peptide compound. The gene is composed of a first module to a tenth module and encodes a protein having activity of synthesizing a nonribosomal peptide constituting a basic peptide backbone of a cyclic peptide compound produced by a filamentous fungus of the Curvularia species.

Abstract: The hermetic terminal includes a metal base that is provided with at least one sealing hole, a lead that is inserted in the sealing hole provided on the metal base, an insulating material that hermetically seals the metal base and the lead, and a heat insulating member that is provided to cover at least a partial surface of the hermetic terminal which is located inside a pressure-resistant container after the hermetic terminal is fixed to the pressure-resistant container and comes into contact with refrigerant sealed in the pressure-resistant container.

Abstract: A method for manufacturing a light-emitting element includes preparing a wafer that includes a semiconductor structure body and a light-transmitting conductive film; forming a first mask on the light-transmitting conductive film; removing the light-transmitting conductive film exposed from the first mask to form an opening in the light-transmitting conductive film, the opening exposing the semiconductor structure body from under the light-transmitting conductive film; forming an n-side exposed part by removing the semiconductor structure body exposed from the first mask; removing the first mask; forming a second mask on the light-transmitting conductive film; removing the light-transmitting conductive film exposed from the second mask; forming an n-side electrode at the n-side exposed part; forming a third mask on the light-transmitting conductive film and on the semiconductor structure body; and removing the semiconductor structure body to form a groove dividing the semiconductor structure body into a plural

Abstract: To provide a hermetic terminal with an insulating cylinder, the hermetic terminal being applicable to insulation coatings that pose difficulties with known insert molding methods, and being producible in small lots without changing the mold for each change in a ring-like outer metal member, and a manufacturing method thereof. Means for Solving Problem A hermetic terminal includes a ring-like outer metal member including at least one sealing hole, a lead inserted through the sealing hole of the ring-like outer metal member, an insulating material hermetically sealing the lead to the ring-like outer metal member, and an insulating cylinder fitted onto the lead and adhering, at at least an end portion of the insulating cylinder, to the ring-like outer metal member.

Abstract: [Problem] Provided is an airtight terminal that is configured to lessen distortion-borne stress caused in a metallic outer ring as a result of screw fastening or other fixing means to prevent the stress from readily propagating to an insulating material in a sealed place of a lead. [Solution] An airtight terminal is provided that includes a metallic outer ring 13 having through holes 11 formed for screw fastening and sealing holes 12, leads 14 inserted through the sealing holes 12 in the metallic outer ring 13, and pieces of an insulating, material 15 to seal gaps between the metallic outer ring 13 and the respective leads 14. The metallic outer ring 13 is provided with pairs of cavities 13a and steps 13b surrounding the respective sealing holes 12.

Abstract: A method of manufacturing light-emitting elements includes: providing a wafer comprising a semiconductor stack that comprises: a first semiconductor layer, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer, wherein the semiconductor stack comprises a plurality of mutually isolated element areas each comprising a part of the first semiconductor layer, a part of the active layer, and a part of the second semiconductor layer; forming a first reflection layer contiguously on or above (i) the second semiconductor layer in the plurality of element areas and (ii) the second semiconductor layer located between adjacent ones of the plurality of element areas; forming a plurality of first masks covering parts of the first reflection layer that are on or above the second semiconductor layer in the plurality of element areas; and forming a groove between the adjacent ones of the element areas.

Abstract: Provided is an airtight terminal that is designed for an automotive electric compressor and that eliminates the need for use of a gasket. The airtight terminal includes a metallic outer ring having through holes formed for screw fastening and sealing holes arranged linearly, leads inserted through the sealing holes in the metallic outer ring, and pieces of an insulating material to seal gaps between the metallic outer ring and the respective leads. The metallic outer ring has a seal coat possessing elastic deformability. The seal coat is put on a predetermined surface of the metallic outer ring that is at least a contact surface to which an external device is attached. The seal coat is put in a shape of an oval embankment, and the sealing holes are disposed inside a region surrounded with the embankment-shaped coat.

Abstract: The hermetic terminal includes a metal base that is provided with at least one sealing hole, a lead that is inserted in the sealing hole provided on the metal base, an insulating material that hermetically seals the metal base and the lead, and a heat insulating member that is provided to cover at least a partial surface of the hermetic terminal which is located inside a pressure-resistant container after the hermetic terminal is fixed to the pressure-resistant container and comes into contact with refrigerant sealed in the pressure-resistant container.

Abstract: Provided is an airtight terminal that is designed for an automotive electric compressor and that eliminates the need for use of a gasket. The airtight terminal includes a metallic outer ring having through holes formed for screw fastening and sealing holes arranged linearly, leads inserted through the sealing holes in the metallic outer ring, and pieces of an insulating material to seal gaps between the metallic outer ring and the respective leads. The metallic outer ring has a seal coat possessing elastic deformability. The seal coat is put on a predetermined surface of the metallic outer ring that is at least a contact surface to which an external device is attached. The seal coat is put in a shape of an oval embankment, and the sealing holes are disposed inside a region surrounded with the embankment-shaped coat.

Abstract: A nitride semiconductor element exhibiting low leakage current and high ESD tolerance includes an active layer of nitride semiconductor that is interposed between a p-sided layer and an n-sided layer, which respectively consist of a plurality of nitride semiconductor layers, the p-side layer including a p-type contact layer as a layer for forming p-ohmic electrodes, the p-type contact layer being formed by laminating p-type nitride semiconductor layers and n-type nitride semiconductor layers in an alternate manner.

Abstract: A nitride semiconductor element exhibiting low leakage current and high ESD tolerance includes an active layer of nitride semiconductor that is interposed between a p-sided layer and an n-sided layer, which respectively consist of a plurality of nitride semiconductor layers, the p-side layer including a p-type contact layer as a layer for forming p-ohmic electrodes, the p-type contact layer being formed by laminating p-type nitride semiconductor layers and n-type nitride semiconductor layers in an alternate manner.

Abstract: A nitride semiconductor element exhibiting low leakage current and high ESD tolerance includes an active layer of nitride semiconductor that is interposed between a p-sided layer and an n-sided layer, which respectively consist of a plurality of nitride semiconductor layers, the p-side layer including a p-type contact layer as a layer for forming p-ohmic electrodes, the p-type contact layer being formed by laminating p-type nitride semiconductor layers and n-type nitride semiconductor layers in an alternate manner.

Abstract: To provide a nitride semiconductor element exhibiting low leakage current and high ESD tolerance, the nitride semiconductor element according to the present invention includes an active layer of nitride semiconductor that is interposed between a p-sided layer and an n-sided layer, which respectively consist of a plurality of nitride semiconductor layers, the p-side layer including a p-type contact layer as a layer for forming p-ohmic electrodes, the p-type contact layer being formed by laminating p-type nitride semiconductor layers and n-type nitride semiconductor layers in an alternate manner.

Abstract: A non-fogging coating composition, which comprises (A) 0 to 50 parts by weight of epoxy group-containing organic silane compounds or partial hydrolyzates thereof, (B) 20 to 80 parts by weight of a polyhydric alcohol having an ethylene oxide chain, (C) 10 to 75 parts by weight of a polymer or copolymer having at least 20% by weight of repeating structural units having the general formula ##STR1## wherein, R.sup.4 and R.sup.5 independently stand for H or a lower alkyl group or carbonyl group and X stands for a side chain possessing an epoxy group, and (D) a catalytic amount of a curing catalyst. And a shaped article of polycarbonate type resin coated therewith.

Abstract: A non-fogging coating composition, which comprises (A) 0 to 50 parts by weight of epoxy group-containing organic silane compounds or partial hydrolyzates thereof, (B) 20 to 80 parts by weight of a polyhydric alcohol having an ethylene oxide chain, (C) 10 to 75 parts by weight of a polymer or copolymer having at least 20% by weight of repeating structural units having the general formula ##STR1## wherein, R.sup.4 and R.sup.5 independently stand for H or a lower alkyl group or carbonyl group and X stands for a side chain possessing an epoxy group, and (D) a catalytic amount of a curing catalyst. And a shaped article of polycarbonate type resin coated therewith.

Abstract: A non-fogging coating composition, which comprises (A) 0 to 50 parts by weight of epoxy group-containing organic silane compounds or partial hydrolyzates thereof, (B) 20 to 80 parts by weight of a polyhydric alcohol having an ethylene oxide chain, (C) 10 to 75 parts by weight of a polymer or copolymer having at least 20% by weight of repeating structural units having the general formula ##STR1## wherein, R.sup.4 and R.sup.5 independently stand for H or a lower alkyl group or carbonyl group and X stands for a side chain possessing an epoxy group, and (D) a catalytic amount of a curing catalyst. And a shaped article of polycarbonate type resin coated therewith.

Abstract: A coated shaped article of a polycarbonate type resin of improved abrasion resistance, which comprises: (I) a shaped substrate of a polycarbonate type resin, (II) an undercoat layer applied to and cured on said substrate, an (III) an overcoat layer applied to and cured on the undercoat layer, which overcoat is formed of a composition containing: (A) at least one hydrolyzate selected from the group of epoxy group-containing silicon compounds, (B) at least one member selected from the group consisting of hydrolyzates of organic silicon compounds colloidal silica and organic titanium compounds, and (C) a curing catalyst.

Abstract: A coating composition, which comprises: (A) at least one hydrolyzate selected from the group of epoxy group-containing silicon compounds, (B) at least one member selected from the group consisting of hydrolyzates of organic silicon compounds, colloidal silica and organic titanium compounds, and (C) a curing catalyst.

Abstract: Coated formed materials of plastics or glass having improved anti-scratching and anti-fogging properties, are produced by applying to the surface of the formed material an undercoating material comprising (a) a mixture of methylolmelamine in which all or a part of the methylol groups are alkyletherified, and a polyhydric alcohol having a molecular weight of 1,500 or less which may contain an ethylene oxide or propylene oxide chain, or a pre-condensate thereof, (b) a mixture of a monomer having a unit of the formula (I), ##STR1## wherein R.sub.1 and R.sub.

Abstract: A non-fogging coating composition, which comprises (A) 0 to 50 parts by weight of epoxy group-containing organic silane compounds or partial hydrolyzates thereof, (B) 20 to 80 parts by weight of a polyhydric alcohol having an ethylene oxide chain, (C) 10 to 75 parts by weight of a polymer or copolymer having at least 20% by weight of repeating structural units having the general formula ##STR1## wherein, R.sup.4 and R.sup.5 independently stand for H or a lower alkyl group or carbonyl group and X stands for a side chain possessing an epoxy group, and (D) a catalytic amount of a curing catalyst. And a shaped article of polycarbonate type resin coated therewith.