Patents by Inventor Akira Fukutomi
Akira Fukutomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230055853Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.Type: ApplicationFiled: August 17, 2022Publication date: February 23, 2023Inventors: Takashi Terada, Yuji Mimura, Hiroshi Maeda, Kazutaka Noda, Masaru Honda, Ryoichi Sakamoto, Yutaka Yamasaki, Tatsuya Kitayama, Akira Fukutomi
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Patent number: 10071544Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.Type: GrantFiled: December 4, 2012Date of Patent: September 11, 2018Assignees: Tokyo Electron Limited, INTEL CORPORATIONInventors: Osamu Hirakawa, Masaru Honda, Akira Fukutomi, Takeshi Tamura, Jiro Harada, Kazutaka Noda, Xavier Francois Brun
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Patent number: 9595462Abstract: Disclosed is a peeling system which includes a peeling device, a plurality of first cleaning devices, an inversion device, a second cleaning device, and first to third conveyance devices. The peeling device is configured to separate a superimposed substrate into a first substrate and a second substrate. The plurality of first cleaning devices is configured to clean a bonded surface of the first substrate. The inversion device configured to invert front and rear surfaces of the first substrate. The second cleaning device is configured to clean a non-bonded surface of the first substrate. Delivery positions of the first substrate in the plurality of first cleaning devices are arranged in a region where an operation range of the first conveyance device and an operation range of the second conveyance device overlap each other.Type: GrantFiled: November 11, 2014Date of Patent: March 14, 2017Assignee: Tokyo Electron LimitedInventors: Takeshi Tamura, Akira Fukutomi, Yasuharu Iwashita, Masaaki Umitsuki
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Patent number: 9343349Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.Type: GrantFiled: April 3, 2013Date of Patent: May 17, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Yasuharu Iwashita, Osamu Hirakawa, Eiji Manabe, Takeshi Tamura, Akira Fukutomi
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Publication number: 20150136331Abstract: Disclosed is a peeling system which includes a peeling device, a plurality of first cleaning devices, an inversion device, a second cleaning device, and first to third conveyance devices. The peeling device is configured to separate a superimposed substrate into a first substrate and a second substrate. The plurality of first cleaning devices is configured to clean a bonded surface of the first substrate. The inversion device configured to invert front and rear surfaces of the first substrate. The second cleaning device is configured to clean a non-bonded surface of the first substrate. Delivery positions of the first substrate in the plurality of first cleaning devices are arranged in a region where an operation range of the first conveyance device and an operation range of the second conveyance device overlap each other.Type: ApplicationFiled: November 11, 2014Publication date: May 21, 2015Inventors: Takeshi Tamura, Akira Fukutomi, Yasuharu Iwashita, Masaaki Umitsuki
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Patent number: 8997822Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.Type: GrantFiled: January 12, 2012Date of Patent: April 7, 2015Assignee: Tokyo Electron LimitedInventors: Yasuharu Iwashita, Osamu Hirakawa, Masaru Honda, Akira Fukutomi
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Publication number: 20130292062Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.Type: ApplicationFiled: January 12, 2012Publication date: November 7, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Yasuharu Iwashita, Osamu Hirakawa, Masaru Honda, Akira Fukutomi
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Publication number: 20130264780Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.Type: ApplicationFiled: April 3, 2013Publication date: October 10, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Yasuharu IWASHITA, Osamu HIRAKAWA, Eiji MANABE, Takeshi TAMURA, Akira FUKUTOMI
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Patent number: 8356951Abstract: A wet-processing apparatus, which spouts a coating liquid onto a surface of a substrate, includes: nozzles provided with passages for the coating liquid; a light source which illuminates an area between a plane containing the tips of the nozzles and the surface of the substrate; a camera for forming an image of the area; a control unit which provides a spout signal requesting spouting the liquid from the nozzle toward the substrate, and an imaging signal requesting the camera to start an imaging operation; and a decision unit which decides whether or not the liquid was spouted from the nozzle and whether or not changes occurred in the condition of the liquid spouted from the nozzle toward the substrate on the basis of an image formed by the camera and expressing the brightness of the liquid spouted toward the substrate and illuminated by light emitted by the light source.Type: GrantFiled: May 11, 2011Date of Patent: January 22, 2013Assignee: Tokyo Electron LimitedInventors: Yasuaki Noda, Akira Fukutomi, Takafumi Hayama
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Publication number: 20110286738Abstract: A wet-processing apparatus, which spouts a coating liquid onto a surface of a substrate of a substrate, includes: nozzles provided with passages for the coating liquid; a light source which illuminates an area between a plane containing the tips of the nozzles and the surface of the substrate; a camera for forming an image of the area; a control unit which provides a spout signal requesting spouting the liquid from the nozzle toward the substrate, and an imaging signal requesting the camera to start an imaging operation; and a decision unit which decides whether or not the liquid was spouted from the nozzle and whether or not changes occurred in the condition of the liquid spouted from the nozzle toward the substrate on the basis of an image formed by the camera and expressing the brightness of the liquid spouted toward the substrate and illuminated by light emitted by the light source.Type: ApplicationFiled: May 11, 2011Publication date: November 24, 2011Applicant: Tokyo Electron LimitedInventors: Yasuaki Noda, Akira Fukutomi, Takafumi Hayama
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Patent number: 7179504Abstract: The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.Type: GrantFiled: October 15, 2004Date of Patent: February 20, 2007Assignee: Tokyo Electron limitedInventors: Takahiro Kitano, Shinichi Sugimoto, Shinji Kobayashi, Naoya Hirakawa, Akira Fukutomi, Nobukazu Ishizaka
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Publication number: 20050100679Abstract: The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.Type: ApplicationFiled: October 15, 2004Publication date: May 12, 2005Applicant: TOKYO ELECTRON LIMITEDInventors: Takahiro Kitano, Shinichi Sugimoto, Shinji Kobayashi, Naoya Hirakawa, Akira Fukutomi, Nobukazu Ishizaka
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Patent number: 6824616Abstract: The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.Type: GrantFiled: April 15, 2002Date of Patent: November 30, 2004Assignee: Tokyo Electron LimitedInventors: Takahiro Kitano, Shinichi Sugimoto, Shinji Kobayashi, Naoya Hirakawa, Akira Fukutomi, Nobukazu Ishizaka
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Patent number: 6773510Abstract: The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate.Type: GrantFiled: April 16, 2002Date of Patent: August 10, 2004Assignee: Tokyo Electron LimitedInventors: Takahiro Kitano, Shinichi Sugimoto, Shinji Kobayashi, Naoya Hirakawa, Akira Fukutomi, Nobukazu Ishizaka
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Publication number: 20020148566Abstract: The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate.Type: ApplicationFiled: April 16, 2002Publication date: October 17, 2002Applicant: TOKYO ELECTRON LIMITEDInventors: Takahiro Kitano, Shinichi Sugimoto, Shinji Kobayashi, Naoya Hirakawa, Akira Fukutomi, Nobukazu Ishizaka
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Publication number: 20020150691Abstract: The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.Type: ApplicationFiled: April 15, 2002Publication date: October 17, 2002Applicant: TOKYO ELECTRON LIMITEDInventors: Takahiro Kitano, Shinichi Sugimoto, Shinji Kobayashi, Naoya Hirakawa, Akira Fukutomi, Nobukazu Ishizaka