Abstract: A feeder for a machine tool adapted to move a table relative to a saddle by rotation of a motor includes a ball thread nut fixed to the saddle and a ball thread shaft that engages with the ball thread nut in a rotatable manner but is immovable in an axial direction of the ball thread shaft relative to the table. The motor is fixed to the table and the ball thread shaft is coupled to the motor. A sum of a movable distance of the table relative to the saddle and a length of the saddle in the axial direction is shorter than a length of the table in the axial direction. The feeder further includes rails fixed to the table on its surface where the motor is fixed and bearings that are fixed to the saddle and bear the rails.

Abstract: A feeder for a machine tool moves a table relative to a saddle in one axial direction by rotation of a motor. A ball thread shaft is attached in a manner engaging with a nut fixed to the saddle, and rotatable but immovable relative to the table, and is coupled to the motor fixed to the table. A length obtained by adding a relative movement distance S of the saddle relative to the table to a size Ls of the saddle in a direction of movement relative to the table is shorter than a size Lt of the table in a direction of movement relative to the saddle (i.e., (Ls+S)<Lt).

Abstract: A telescopic cover which relieves impact caused when a cover member is stopped moving and which is less meandering. A braking mechanism is provided between one of two adjacent cover members of the telescopic cover and the other of the two adjacent cover members which telescopically moves into and out of the one cover member. The braking mechanism is provided at a distal end portion of the one cover member, and has an elastic member that presses a slide member against the other cover member. When the other cover member moves relatively to the one cover member, a friction force generated by a pressing force of the slide member serves to brake the movement of the other cover member, whereby impact caused when the other cover member stops moving is relieved. The cover member in motion is always pressed by the slide member with an orientation thereof maintained.

Abstract: A method of producing a semiconductor device constructed by arranging a plurality of substrates, on each of which, thin film semiconductor elements two-dimensionally arranged are installed. The method includes the steps of cutting a substrate along at least a slice line provided on the substrate and on a side facing another substrate, which is one of the substrates when the plurality of substrates are arranged, while detecting a misalignment of a cutting position from the slice line and correcting a cutting position, cutting the substrate of a side opposing the slice line without correcting the cutting position, and adjacently arranging the plurality of substrates on substantially a same plane such that the sides having been cut face each other, while correcting the cutting position of the substrates.

Abstract: In a pallet changer that changes pallets for mounting workpieces on a machine tool work table, a pallet changer clamping mechanism that clamps and unclamps a workpiece-mounting pallet to and from the work table, the pallet changer clamping mechanism comprising a workpiece-mounting pallet whose direction of delivery to and removal from the work table is the same as its direction of movement for clamping and unclamping. The workpiece-mounting pallet moves on a plane parallel to the work table when clamped to and unclamped from the work table.

Abstract: A machine tool having a low-cost pallet change function and a pallet changing method, in which a pallet is conveyed by utilizing a robot for handling a workpiece. Rollers are rotatably arranged on the pallet. The rollers are supported and rolled on rails that are arranged on a pallet changer base and a table of the machine tool. The pallet has a handle. The robot engages the handle by its hand and pulls or pushes the pallet, thereby moving the pallet between the base and the table. On the base, moreover, the robot mounts or dismounts the workpiece on or from the pallet. Since the movement of the pallet requires no substantial force, the robot for handling the workpiece can convey the pallet and change the pallet at low cost.

Abstract: A telescopic cover which relieves impact caused when a cover member is stopped moving and which is less meandering. A braking mechanism is provided between one of two adjacent cover members of the telescopic cover and the other of the two adjacent cover members which telescopically moves into and out of the one cover member. The braking mechanism is provided at a distal end portion of the one cover member, and has an elastic member that presses a slide member against the other cover member. When the other cover member moves relatively to the one cover member, a friction force generated by a pressing force of the slide member serves to brake the movement of the other cover member, whereby impact caused when the other cover member stops moving is relieved. The cover member in motion is always pressed by the slide member with an orientation thereof maintained.

Abstract: A quantitative distributor which can change its discharge volume, can reduce a fluctuation range of the discharge volume, can quickly fill a path from the distributor to an injection point with a substance, and can clean the injection point by the substance. In the distributor, a discharge volume of the substance from the distributor corresponds to the pressure of the substance supplied to the distributor, and an elastic body pressurizing the piston has a Young's modulus which is variable by a position of the piston.

Abstract: By performing an accurate cutting when a substrate is cut, a gap between the substrates when a plurality of substrates are arranged is made constant or is reduced or eliminated, thereby improving electric characteristics of the gap portion between the substrates. For this purpose, a slice line and a guide line are provided on the substrate, the substrate is cut along the slice line, and the guide line is detected upon cutting, thereby detecting a misalignment and cutting the substrate while correcting the misalignment.

Abstract: A large-area and compact radiation image pickup device is provided in which an imaging optical system is arranged between a solid image pickup element and a wavelength converting member, and a radiation such as x-rays as converted into the sensitive wavelength region of the solid image pickup element by the wavelength converting member is guided by the imaging optical systems to convert the radiation into an electric signal by a plurality of photosensors. The radiation that has passed through the wavelength converting member is absorbed by a light transmissive member or a unity magnification erectly imaging optical system, thereby reducing or preventing irradiation of the photosensors or the like with the radiation.

Abstract: In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrates, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

Abstract: In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Abstract: In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Abstract: In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrate, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

Abstract: In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Abstract: A photoelectric conversion apparatus comprises a plurality of transparent substrates. Each of the substrates has a a plurality of photoelectric conversion elements on a front surface thereof on a base. A light-absorbing member is provided on at least one of a rear surface and end faces of the substrate.

Abstract: An imaging apparatus whose substrate or base stand is arranged to be a member to absorb or shield radiation in order to prevent semiconductor element, such as ICs, provided for driving photoelectric elements from making any malfunction or from being deteriorated by the irradiation of radiation, such as X-rays or .gamma.-rays, transmitted from the photoelectric conversion element substrate or base stand or in order to prevent radiation from being scattered.

Abstract: Array type ultrasonic probes including those of the annular array type and the linear array type are produced with a high accuracy of arrangement of unit transducer elements by first providing an integral processed plate wherein unit back electrodes are almost configurated into their final shapes but connected with each other by connecting portions so as to facilitate the handling thereof as an integral plate. The integral processed plate is bonded to a substrate and the connecting portions are removed to leave the back electrodes separately bonded to the substrate. On the back electrodes, a piezoelectric polymer film and a front electrode are applied to give an array type ultrasonic probe adapted for medical diagnosis.

Abstract: An array-type ultrasonic probe for an ultrasonic transducer has a basic structure comprising a substrate on which are successively disposed a plurality of parallel stripe form back electrodes, a polymer piezoelectric film and a front electrode. One end of each stripe-form back electrode is made thin, bent along the side wall of the substrate and connected to a lead wire from the ultrasonic transducer. Such a connection structure allows a tight arrangement of the back electrodes while avoiding contact between the electrodes, thus providing a high resolution to the ultrasonic probe.

Abstract: An ultrasonic detector is provided wherein electrodes are formed on the front and rear surfaces of a high polymer piezoelectric film, such that opposing electrode portion and nonopposing electrode portions are alternately and continually formed, most parts of the electrodes on the front and rear surfaces being opposed to each other through the piezoelectric film at the opposing electrode portions, most parts of the electrodes on the front and rear surfaces of the film which are different from the most parts of the electrodes at the opposing electrode portions being shifted from each other at the nonopposing electrode portions so as to have substantially no capacitance, and the piezoelectric film is wound around a base in an even number of layers such that the opposing electrode portions overlap each other and the nonopposing electrode portions overlap each other.