Patents by Inventor Akira HARAO
Akira HARAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9980364Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: GrantFiled: March 22, 2016Date of Patent: May 22, 2018Assignee: YAZAKI CORPORATIONInventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
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Patent number: 9888558Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.Type: GrantFiled: June 3, 2011Date of Patent: February 6, 2018Assignee: YAZAKI CORPORATIONInventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
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Patent number: 9693466Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: GrantFiled: February 16, 2012Date of Patent: June 27, 2017Assignee: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto
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Patent number: 9480142Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: GrantFiled: May 28, 2014Date of Patent: October 25, 2016Assignee: YAZAKI CORPORATIONInventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
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Publication number: 20160205763Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: ApplicationFiled: March 22, 2016Publication date: July 14, 2016Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Publication number: 20140268581Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Publication number: 20140262451Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
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Patent number: 8770991Abstract: A fuse connection unit includes a metal core substrate that includes a metal core plate and insulation layers formed on front and back faces of the metal core plate, and a fuse block mounted on the metal core substrate. The metal core substrate has a fuse connection terminal part which is projected from an end edge of each of the insulation layers. The fuse block has a fuse connection terminal. The fuse connection terminal part and the fuse connection terminal are configured to be connected to a fuse.Type: GrantFiled: February 3, 2012Date of Patent: July 8, 2014Assignee: Yazaki CorporationInventors: Akira Harao, Minoru Kubota
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Patent number: 8586872Abstract: A metal core substrate is provided. A first routing member is comprised of a first area of one sheet of metal core material; a first insulation layer formed on the first area; and a first circuit pattern made of a copper foil and formed on the first insulation layer. A second routing member comprised of: a second area of the one sheet of the metal core material, which is separated from the first area; a second insulation layer formed on the second area; and a second circuit pattern made of a copper foil and formed on the second insulation layer. A connecting member electrically connects the first routing member and the second routing member. The connecting member is comprised of a third area of the one sheet of the metal core material, which is interposed between the first area and the second area.Type: GrantFiled: September 12, 2011Date of Patent: November 19, 2013Assignee: Yazaki CorporationInventors: Tomohiro Sugiura, Akira Harao, Minoru Kubota
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Publication number: 20120211266Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: ApplicationFiled: February 16, 2012Publication date: August 23, 2012Applicant: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto
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Publication number: 20120202383Abstract: A fuse connection unit includes a metal core substrate that includes a metal core plate and insulation layers formed on front and back faces of the metal core plate, and a fuse block mounted on the metal core substrate. The metal core substrate has a fuse connection terminal part which is projected from an end edge of each of the insulation layers. The fuse block has a fuse connection terminal. The fuse connection terminal part and the fuse connection terminal are configured to be connected to a fuse.Type: ApplicationFiled: February 3, 2012Publication date: August 9, 2012Applicant: YAZAKI CORPORATIONInventors: Akira Harao, Minoru Kubota
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Publication number: 20120090881Abstract: A metal core substrate is provided. A first routing member is comprised of a first area of one sheet of metal core material; a first insulation layer formed on the first area; and a first circuit pattern made of a copper foil and formed on the first insulation layer. A second routing member comprised of: a second area of the one sheet of the metal core material, which is separated from the first area; a second insulation layer formed on the second area; and a second circuit pattern made of a copper foil and formed on the second insulation layer. A connecting member electrically connects the first routing member and the second routing member. The connecting member is comprised of a third area of the one sheet of the metal core material, which is interposed between the first area and the second area.Type: ApplicationFiled: September 12, 2011Publication date: April 19, 2012Applicant: YAZAKI CORPORATIONInventors: Tomohiro SUGIURA, Akira HARAO, Minoru KUBOTA
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Publication number: 20110299250Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.Type: ApplicationFiled: June 3, 2011Publication date: December 8, 2011Applicant: YAZAKI CORPORATIONInventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA