Patents by Inventor Akira Hayashida
Akira Hayashida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10789141Abstract: An information processing device includes a device, a management device that is connected to the device via a first transmission route and configured to acquire information regarding the device via the first transmission route, and a processing device that is connected to the device via a second transmission route, connected to the management device via a third transmission route, and configured to initialize the device and acquire the information from the management device via the third transmission route.Type: GrantFiled: August 28, 2018Date of Patent: September 29, 2020Assignee: FUJITSU LIMITEDInventor: Akira Hayashida
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Publication number: 20190073285Abstract: An information processing device includes a device, a management device that is connected to the device via a first transmission route and configured to acquire information regarding the device via the first transmission route, and a processing device that is connected to the device via a second transmission route, connected to the management device via a third transmission route, and configured to initialize the device and acquire the information from the management device via the third transmission route.Type: ApplicationFiled: August 28, 2018Publication date: March 7, 2019Applicant: FUJITSU LIMITEDInventor: Akira Hayashida
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Patent number: 9184069Abstract: A heating apparatus comprises a heating element, an inner shell for supporting the heating element, an outer shell disposed along the outer boundary of the inner shell, a cooling medium passage for conveying a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, a second opening provided in the outer shell, and a partition arranged to extend from the first opening to the second opening for developing at least a space separated from the cooling medium passage and between the inner shell and the outer shell. The heating apparatus further comprises an insulator for shutting up a gap provided between the partition and the second opening.Type: GrantFiled: June 25, 2008Date of Patent: November 10, 2015Assignees: Hitachi Kokusai Electric Inc., Teitokusha Co., Ltd.Inventors: Akira Hayashida, Masaaki Ueno, Masakazu Shimada, Masashi Sugishita, Toshimitsu Miyata, Kimio Kitamura, Kenji Tanaka, Jyunichi Nishihara
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Patent number: 8838952Abstract: An information processing apparatus having a verification capability of a configuration change.Type: GrantFiled: September 21, 2011Date of Patent: September 16, 2014Assignee: Fujitsu LimitedInventor: Akira Hayashida
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Patent number: 8734148Abstract: A heat treatment apparatus capable of achieving high-accuracy processing and high safety and a method of manufacturing a substrate are provided. The heat treatment apparatus 10 includes a reaction tube 42 for processing a substrate, a manifold 44 for supporting the reaction tube 42, a heater 46 installed around the reaction tube 42 to heat an inner part of the reaction tube 42, a surrounding member 500 installed to surround a side portion of the reaction tube 42 arranged in a lower portion than the heater 46; an exhaust device 301 for forcibly exhausting a gap 506 between the surrounding member 500 and the reaction tube 42; and a sealing member 150 installed in a contacting portion between the reaction tube 42 and the manifold 44. Here, an inlet hole 501 through which the exhaust device inhales an atmosphere outside the surrounding member 500 to the gap 506 is installed in the surrounding member 500.Type: GrantFiled: February 24, 2011Date of Patent: May 27, 2014Assignee: Hitachi Kokusai Electric Inc.Inventors: Keishin Yamazaki, Akira Hayashida, Masaaki Ueno, Manabu Izumi, Katsuaki Nogami
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Patent number: 8507296Abstract: A substrate processing method in a processing chamber, has: accommodating a substrate into a processing chamber; and processing the substrate in the processing chamber on the basis of a correlation of a preset temperature of a heating device, a flow rate of fluid supplied by a cooling device and a temperature deviation between the center side of the substrate accommodated in the processing chamber and the outer peripheral side of the substrate while the substrate accommodated in the processing chamber is optically heated from an outer periphery side of the substrate at a corrected preset temperature by the heating device and the fluid is supplied to the outside of the processing chamber at the flow rate based on the correlation concerned to cool the outer peripheral side of the substrate by the cooling device.Type: GrantFiled: March 13, 2009Date of Patent: August 13, 2013Assignee: Hitachi Kokusai Electric Inc.Inventors: Masaaki Ueno, Masakazu Shimada, Takeo Hanashima, Haruo Morikawa, Akira Hayashida
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Patent number: 8501599Abstract: A substrate processing apparatus has: a process chamber in which a substrate is processed; a heating device that optically heats the substrate accommodated in the process chamber from an outer periphery side of the substrate; a cooling device that cools the outer periphery side of the substrate by flowing a fluid in a vicinity of an outer periphery of the substrate optically heated by the heating device; a temperature detection portion that detects a temperature inside the process chamber; and a heating control portion that controls the heating device and the cooling device in such a manner so as to provide a temperature difference between a center portion of the substrate and an end portion of the substrate while maintaining a temperature at the center portion at a pre-determined temperature according to the temperature detected by the temperature detection portion.Type: GrantFiled: February 21, 2007Date of Patent: August 6, 2013Assignee: Hitachi Kokusai Electric Inc.Inventors: Masaaki Ueno, Masakazu Shimada, Takeo Hanashima, Haruo Morikawa, Akira Hayashida
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Patent number: 8158911Abstract: A heating apparatus comprises heating elements arranged of a sheet form and having notches or through holes provided therein, a side wall member made of an electrically conductive material and arranged to surround and define the heating space, and holding members disposed at the heating space side of the side wall member for holding at one end the heating elements. Also, extending members are provided, each member comprising an extending-through portion arranged to project from the heating space side of the side wall member and extend through the notch or through hole between both ends in the heating element and projected portions arranged to project at both, front and back, sides of the heating element from the extending-through portion in a direction, which is orthogonal to the extending direction of the extending-through portion, thus to inhibit the displacement of the heating elements along the extending direction.Type: GrantFiled: June 25, 2008Date of Patent: April 17, 2012Assignees: Hitachi Kokusai Electric Inc., Teitokusha Co., Ltd.Inventors: Akira Hayashida, Masaaki Ueno, Masakazu Shimada, Kimio Kitamura, Kenji Tanaka, Jyunichi Nishihara
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Patent number: 8148271Abstract: A substrate processing apparatus comprises a processing chamber for storing a boat supporting multiple substrates and for processing the multiple substrates, a heater unit installed around the processing chamber for heating the substrates, and a coolant gas supply nozzle including a pipe section extending perpendicular to a main surface of the substrate supported in the boat stored in the processing chamber, and a spray hole formed on the pipe section for spraying coolant gas to at least two of the multiple substrates, wherein the coolant gas supply nozzle is formed so that the cross sectional area of the pipe section in the area where the spray hole is formed is larger than the total opening area of the spray hole.Type: GrantFiled: July 19, 2006Date of Patent: April 3, 2012Assignee: Hitachi Kokusai Electric Inc.Inventors: Masaaki Ueno, Akira Hayashida, Masakazu Shimada, Takenori Oka
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Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices
Patent number: 8116618Abstract: A heating apparatus comprises a wall for surrounding and defining a heating space, a heating element mounted on the inner side of the wall, reflecting members for reflecting the heat emitted from the heating element. Also, a moving unit joined to one end of each of the reflecting members for moving the reflecting members. Moreover, pivotal members joined to the reflecting members beside more their respective other side than one side of the reflecting members for controlling as pivots the movement of the reflecting member driven by the moving unit.Type: GrantFiled: June 25, 2008Date of Patent: February 14, 2012Assignees: Hitachi Kokusai Electric Inc., Teitokusha Co., Ltd.Inventors: Akira Hayashida, Masaaki Ueno, Masakazu Shimada, Masashi Sugishita, Toshimitsu Miyata, Kimio Kitamura, Kenji Tanaka, Jyunichi Nishihara -
Publication number: 20120011353Abstract: An information processing apparatus having a verification capability of a configuration change.Type: ApplicationFiled: September 21, 2011Publication date: January 12, 2012Applicant: FUJITSU LIMITEDInventor: Akira Hayashida
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Publication number: 20110207339Abstract: A heat treatment apparatus capable of achieving high-accuracy processing and high safety and a method of manufacturing a substrate are provided. The heat treatment apparatus 10 includes a reaction tube 42 for processing a substrate, a manifold 44 for supporting the reaction tube 42, a heater 46 installed around the reaction tube 42 to heat an inner part of the reaction tube 42, a circumferential portion 500 installed to surround a side portion of the reaction tube 42 arranged in a lower portion than the heater 46; an exhaust device 301 for forcibly exhausting a gap 506 between the circumferential portion 500 and the reaction tube 42; and a sealing member 150 installed in a contacting portion between the reaction tube 42 and the manifold 44. Here, an inlet port 501 through which the exhaust device inhales an atmosphere outside the circumferential portion 500 to the gap 506 is installed in the circumferential portion 500.Type: ApplicationFiled: February 24, 2011Publication date: August 25, 2011Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Keishin YAMAZAKI, Akira HAYASHIDA, Masaaki UENO, Manabu IZUMI, Katsuaki NOGAMI
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Patent number: 7863204Abstract: A substrate treating device comprising a treatment chamber for storing and treating substrates and a heating device having a heating element and a heat insulator and heating the substrates in the treatment chamber by the heating element. The heating element is so formed that only its one end is held by a holding part, and a projection projected to the treatment chamber side at the intermediate part of the heating element and positioned in proximity to or in contact with the heating element is formed on the heat insulator. A pin with an enlarged part is passed through the heating element and the heat insulator at the intermediate part of the heating element and the enlarged part is positioned in proximity to or in contact with the heating element. The plurality of projections may be formed on the heat insulator and the pins may be disposed between these plurality of projections.Type: GrantFiled: August 23, 2006Date of Patent: January 4, 2011Assignees: Hitachi Kokusai Electric Inc., Teitokusha Co., Ltd.Inventors: Toshimitsu Miyata, Akira Hayashida, Masakazu Shimada, Kimio Kitamura, Kenji Tanaka
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Patent number: 7727780Abstract: A semiconductor manufacturing apparatus and substrate processing method includes a step of acquiring a measurement value based on a first detecting and a second detecting section and determining a first difference of measurement values between the first detecting section and the second detecting section, comparing between a previously stored second difference between measurement values concerning the first detecting section and the second detecting section, calculating a correction value for a pressure in a cooling-gas passage provided between a process chamber and a heating device depending upon the first difference when the first difference is different from the second difference, and correcting the pressure value based on the pressure correction value, and a step of processing the substrate by flowing a cooling gas through the cooling-gas passage while heating the process chamber, and placing the heating device and the cooling device under a control section depending upon a pressure value corrected.Type: GrantFiled: January 23, 2008Date of Patent: June 1, 2010Assignee: Hitachi Kokusai Electric Inc.Inventors: Masashi Sugishita, Masaaki Ueno, Akira Hayashida
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Patent number: 7700054Abstract: An object of the present invention is to improve substrate processing efficiency. A substrate processing apparatus has a reaction tube that processes a substrate inside, and a heating apparatus disposed so as to surround an external periphery of the reaction tube, so that at least a gas inlet tube is disposed on a side surface in an area in which the substrate is processed inside the reaction tube, and the heating apparatus has a heat insulator that surrounds the reaction tube, an inlet opening formed in the shape of a groove in the heat insulator from the lower end of the heating apparatus so as to avoid the gas inlet tube, and a heating element disposed between the heat insulator and the reaction tube.Type: GrantFiled: November 30, 2007Date of Patent: April 20, 2010Assignee: Hitachi Kokusai Electric Inc.Inventors: Akira Hayashida, Masaaki Ueno, Masakazu Shimada, Yukinori Aburatani, Tomoyuki Yamada, Seiyo Nakashima, Masashi Sugishita
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Publication number: 20090291566Abstract: A substrate processing apparatus comprises a processing chamber for storing a boat supporting multiple substrates and for processing the multiple substrates, a heater unit installed around the processing chamber for heating the substrates, and a coolant gas supply nozzle including a pipe section extending perpendicular to a main surface of the substrate supported in the boat stored in the processing chamber, and a spray hole formed on the pipe section for spraying coolant gas to at least two of the multiple substrates, wherein the coolant gas supply nozzle is formed so that the cross sectional area of the pipe section in the area where the spray hole is formed is larger than the total opening area of the spray hole.Type: ApplicationFiled: July 19, 2006Publication date: November 26, 2009Inventors: Masaaki Ueno, Akira Hayashida, Masakazu Shimada, Takenori Oka
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Publication number: 20090197352Abstract: A substrate processing method in a processing chamber, has: accommodating a substrate into a processing chamber; and processing the substrate in the processing chamber on the basis of a correlation of a preset temperature of a heating device, a flow rate of fluid supplied by a cooling device and a temperature deviation between the center side of the substrate accommodated in the processing chamber and the outer peripheral side of the substrate while the substrate accommodated in the processing chamber is optically heated from an outer periphery side of the substrate at a corrected preset temperature by the heating device and the fluid is supplied to the outside of the processing chamber at the flow rate based on the correlation concerned to cool the outer peripheral side of the substrate by the cooling device.Type: ApplicationFiled: March 13, 2009Publication date: August 6, 2009Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Masaaki Ueno, Masakazu Shimada, Takeo Hanashima, Haruo Morikawa, Akira Hayashida
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Publication number: 20090095422Abstract: Provided are a semiconductor manufacturing apparatus and a substrate processing method that can reduce a temperature difference along the circumference of a substrate and continue substrate processing even when a temperature sensor becomes defective. The semiconductor manufacturing apparatus includes a reaction tube configured to process a wafer, a heater configured to heat the reaction tube, an exhaust pipe, a control unit configured to control a cooling gas exhaust device, the heater, and a pressure sensor that detects a pressure inside the exhaust pipe when cooling gas flows through the exhaust pipe. The control unit previously acquires an average value of second temperature detecting units that detect states of a peripheral part of a wafer, and a measure value of a first temperature detecting unit that detects a state of a center part of the wafer so as to control the heat and the cooling device based on the acquired values.Type: ApplicationFiled: September 5, 2008Publication date: April 16, 2009Inventors: Masashi SUGISHITA, Masaaki Ueno, Akira Hayashida
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Publication number: 20090035948Abstract: A substrate treating device comprising a treatment chamber for storing and treating substrates and a heating device having a heating element and a heat insulator and heating the substrates in the treatment chamber by the heating element. The heating element is so formed that only its one end is held by a holding part, and a projection projected to the treatment chamber side at the intermediate part of the heating element and positioned in proximity to or in contact with the heating element is formed on the heat insulator. A pin with an enlarged part is passed through the heating element and the heat insulator at the intermediate part of the heating element and The enlarged part is positioned in proximity to or in contact with the heating element. The plurality of projections may be formed on the heat insulator and the pins may be disposed between these plurality of projections.Type: ApplicationFiled: August 23, 2006Publication date: February 5, 2009Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Toshimitsu Miyata, Akira Hayashida, Masakazu Shimada, Kimio Kitamura, Kenji Tanaka
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Publication number: 20090029486Abstract: A substrate processing apparatus has: a process chamber in which a substrate is processed; a heating device that optically heats the substrate accommodated in the process chamber from an outer periphery side of the substrate; a cooling device that cools the outer periphery side of the substrate by flowing a fluid in a vicinity of an outer periphery of the substrate optically heated by the heating device; a temperature detection portion that detects a temperature inside the process chamber; and a heating control portion that controls the heating device and the cooling device in such a manner so as to provide a temperature difference between a center portion of the substrate and an end portion of the substrate while maintaining a temperature at the center portion at a pre-determined temperature according to the temperature detected by the temperature detection portion.Type: ApplicationFiled: February 21, 2007Publication date: January 29, 2009Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Masaaki Ueno, Masakazu Shimada, Takeo Hanashima, Haruo Morikawa, Akira Hayashida