Patents by Inventor Akira Hibasami

Akira Hibasami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060035533
    Abstract: A wiring harness for a vehicle includes a first wire, a second wire and a third wire. The first wire has a conductor formed by aggregating at least one high-tensile wire material and a plurality of conductive element wires. The second wire has a compressed conductor formed by compressing and aggregating a plurality of element wires. The wiring harness is formed by aggregating a cable including the first wire, the second wire. A cross sectional area of the conductor of the first wire is smaller than a cross sectional area of the compressed conductor of the second wire.
    Type: Application
    Filed: August 1, 2005
    Publication date: February 16, 2006
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshiaki Yamano, Toshio Shimizu, Koutarou Maeda, Takeharu Ito, Akira Hibasami
  • Publication number: 20050076478
    Abstract: A branch wire tie band including a strap portion on which ratchet grooves are formed, the strap portion extending from a head portion within which a strap locking channel is formed. A curved attachment coil, which is preformed as an integral portion of the strap portion, is placed around the branched portion of a wire harness after which the strap portion is inserted and locked into the band locking channel. The tie band may includes two tie band strap portions extending from respective head portions and an anchor plate within which left and right through holes are formed. The two tie band straps may be inserted through the left and right through holes in the anchor plate from where they extend diagonally, their tip portions crossing, and their head portions prevented from passing through the through holes.
    Type: Application
    Filed: July 2, 2004
    Publication date: April 14, 2005
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Tomohiro Miyazaki, Yoshihiro Maeda, Akira Hibasami, Mikio Uchida, Masataka Yamauchi, Takeharu Ito, Kouichi Yamaga