Patents by Inventor Akira Hideno

Akira Hideno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7909087
    Abstract: A heat exchanger including a base plate portion with at least one heat generating component thermally connected thereto; at least one fin portion comprising a plurality of fins thermally connected to said base plate portion, arranged in parallel at a prescribed angle along a longitudinal direction of said base plate portion; an inlet portion through which a cooling fluid is introduced to each of said at least one fin portion; a baffle plate portion and a partition plate portion guiding said cooling fluid so that the cooling fluid is decelerated to be uniformly flown through fins in said at least one fin portion; and an outlet portion to evacuate the cooling fluid.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: March 22, 2011
    Assignee: Furukawa-Sky Aluminum Corp.
    Inventors: Naoki Kimura, Akira Hideno
  • Publication number: 20080023189
    Abstract: A heat exchanger including a base plate portion with at least one heat generating component thermally connected thereto; at least one fin portion comprising a plurality of fins thermally connected to said base plate portion, arranged in parallel at a prescribed angle along a longitudinal direction of said base plate portion; an inlet portion through which a cooling fluid is introduced to each of said at least one fin portion; a baffle plate portion and a partition plate portion guiding said cooling fluid so that the cooling fluid is decelerated to be uniformly flown through fins in said at least one fin portion; and an outlet portion to evacuate the cooling fluid.
    Type: Application
    Filed: July 19, 2007
    Publication date: January 31, 2008
    Applicant: Furukawa-Sky Aluminum Corp.
    Inventors: Naoki Kimura, Akira Hideno
  • Publication number: 20020170706
    Abstract: A heat exchanger comprising: a corrugated plate; a base plate;
    Type: Application
    Filed: March 28, 2002
    Publication date: November 21, 2002
    Inventors: Toshiyuki Hosokawa, Akira Hideno
  • Patent number: 5993576
    Abstract: A wear-resistant wrought Al alloy having a desirable high fatigue strength, toughness and flexure strength when subjected to a quenching and an age hardening heat treatment. The Al alloy contains 8.0 to 13.0% by weight of Si, 0.1 to 0.5% by weight of Fe, 1.5 to 5.0% by weight of Cu, 0.4 to 1.5% by weight of Mg, 0.05 to 0.5% by weight of Cr, 0.05 to 0.5% by weight of Ni, an element selected from the group consisting of 0.005 to 0.05% by weight of Sr and 0.05 to 0.3% by weight of Sb, and the remainder being Al and unavoidable impurities, wherein there is no more than 0.04% by weight of Mn as an unavoidable impurity. The Al alloy having Si particles being finely dispersed therein, wherein an average diameter of an equivalent circle of Si particles is not more than 5.00 .mu.m and an average roundness of Si particles is not less than 0.50. The amounts of Fe, Cr and Ni contained in the alloy and the amount of Mn as an impurity are such to prevent Si particles and other intermetallic compounds from enlarging.
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: November 30, 1999
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Akira Ichinose, Akira Hideno, Nobuaki Ohara
  • Patent number: 5981085
    Abstract: A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: November 9, 1999
    Assignee: The Furukawa Electric Co., Inc.
    Inventors: Junji Ninomiya, Akira Hideno, Takahiro Okada
  • Patent number: 5846348
    Abstract: An aluminum alloy cast molding produced by a high-pressure casting method, and having a composition containing Si in an amount of 0.6 to 1.0% by weight (which will be hereinafter simply referred to as %), Cu in an amount of 0.6 to 1.2%, Mg in an amount of 0.8 to 1.2%, Zn in an amount of 0.4 to 1.2%, Ti in an amount of 0.01 to 0.20%, and B in an amount of 0.002 to 0.015%, with the remainder being aluminum and inevitable impurities. The maximum dendrite cell size of the metal structure of the aluminum alloy casting is limited to 60 .mu.m or less. The present invention also provides a method of manufacturing an aluminum alloy casting by high-pressure casting, which manufacturing method includes the steps of charging a mold with a molten aluminum alloy having the above alloy composition, and subsequently solidifying the charged molten metal under pressures as high as 500 Kgf/cm.sup.2 or above so that the maximum dendrite cell size of the metal structure of the aluminum alloy casting is limited to 60 .mu.
    Type: Grant
    Filed: August 26, 1996
    Date of Patent: December 8, 1998
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shoichi Sakoda, Akira Hideno, Nobuaki Ohara