Abstract: Provided is a PSA sheet having first and second faces. The first face is an adhesive face formed of one surface of a PSA layer. The first face has a maximum static friction force of 4.0 N/cm2 or less and an adhesive strength N2 of 8 N/20mm or greater at 23° C. after subjected to 5 minutes of heating at 80 ° C. after the first face is applied to a stainless steel plate.

Abstract: A semiconductor device includes: a semiconductor module and a heat dissipation sheet attached to a bottom surface of the semiconductor module, the heat dissipation sheet including: a sheet-shaped first conduction part that has a first main surface bonded to the bottom surface of the circuit substrate, a thermal conductivity of the first conduction part in directions along the first main surface being higher than a thermal conductivity of the first conduction part in a thickness direction; and a sheet-shaped second conduction part that is provided next to the first conduction part at an end of the first conduction part and that has a second main surface continuing from the first main surface, a thermal conductivity of the second conduction part in a thickness direction being higher than a thermal conductivity of the second conduction part in directions along the second main surface.

Abstract: A semiconductor device includes: a semiconductor module and a heat dissipation sheet attached to a bottom surface of the semiconductor module, the heat dissipation sheet including: a sheet-shaped first conduction part that has a first main surface bonded to the bottom surface of the circuit substrate, a thermal conductivity of the first conduction part in directions along the first main surface being higher than a thermal conductivity of the first conduction part in a thickness direction; and a sheet-shaped second conduction part that is provided next to the first conduction part at an end of the first conduction part and that has a second main surface continuing from the first main surface, a thermal conductivity of the second conduction part in a thickness direction being higher than a thermal conductivity of the second conduction part in directions along the second main surface.

Abstract: Provided is a filler-containing pressure-sensitive adhesive tape having an excellent pressure-sensitive adhesive strength while suppressing the occurrence of a volatile component. The filler-containing pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing an acrylic polymer and a filler dispersed in the pressure-sensitive adhesive resin, in which the acrylic polymer contains at least a constituent unit derived from a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms, a constituent unit derived from a nitrogen-containing monomer, and a constituent unit derived from a carboxyl group-containing monomer, and has a ratio (mass ratio) of the constituent unit derived from the carboxyl group-containing monomer to the constituent unit derived from the nitrogen-containing monomer of from 0.01 to 40.

Abstract: Provided is a conductive pressure-sensitive adhesive tape that achieves both strong adhesion to an adherend and a reworking property. A conductive pressure-sensitive adhesive tape (1) includes a pressure-sensitive adhesive layer (2) containing a pressure-sensitive adhesive resin containing a pressure-sensitive adhesive polymer and conductive particles (4) dispersed in the pressure-sensitive adhesive resin, in which: the pressure-sensitive adhesive layer (2) has a surface layer (22) that is formed of the pressure-sensitive adhesive resin and that forms a surface of the pressure-sensitive adhesive layer; and a thickness of the surface layer (22) includes an analysis depth from the surface of the pressure-sensitive adhesive layer when a spectral intensity derived from the conductive particles in glow discharge spectrometry becomes one half of a maximum thereof, and is 0.1 ?m or more and 0.9 ?m or less.

Abstract: Provided is a conductive pressure-sensitive adhesive tape having high flexibility. The conductive pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on at least one surface side of the base material, in which the tape has a total thickness of 30 ?m or less.

Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left standing at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.

Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left stand at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.

Abstract: A wireless communication apparatus and a wireless communication method are disclosed. At least one processor performs a reception processing of intermittently executing, while executing a first processing, a second processing in place of the first processing. The at least one processor has, as operation modes, a first operation mode and a second operation mode. In the first operation mode, the at least one processor stops executing the first processing and executes a search processing of searching for a signal transmitted in accordance with the second wireless communication scheme in a case where the at least one processor fails to acquire the second data in the reception processing. In the second operation mode, the at least one processor continues the reception processing without executing the search processing in a case where the at least one processor fails to acquire the second data in the reception processing.

Abstract: A radiant heat conduction-suppressing sheet according to an embodiment of the present invention includes: a heat conduction-suppressing layer and a heat conductive layer. The heat conduction-suppressing layer has a heat conductivity of 0.06 W/m·K or less. The heat conductive layer has a far-infrared absorptivity at a wavelength of 7 ?m to 10 ?m of 0.6 or less, and a heat conductivity of 200 W/m·K or more. The radiant heat conduction-suppressing sheet is used by being fixed to a housing containing a heating element under a state in which a side of the heat conduction-suppressing layer is fixed to the housing at such a position that the heat conductive layer faces a heat radiating surface of the heating element while being free of close contact with the heating element.

Abstract: The present invention relates to a photocurable acrylic viscoelastic material composition including: an acrylic monomer mixture containing an alkyl (meth)acrylate as a main monomer component and a polar group-containing vinyl monomer, or a partial polymerization product thereof; a (meth)acrylate compound having at least one isocyanate group within the molecule thereof; and a photopolymerization initiator. The photocurable acrylic viscoelastic material composition of the present invention has, by virtue of the above-described construction, excellent pot life and excellent storage stability, despite containing an isocyanate compound having at least one isocyanate group within the molecule thereof, and further can form an acrylic viscoelastic material excellent in the holding power at high temperatures through photocuring. Also, the acrylic viscoelastic material and acrylic viscoelastic material layer tape or sheet of the present invention is excellent in the holding power at high temperatures.

Abstract: Provided are a novel foam which has a uniform fine-cell structure and is excellent in toughness and heat resistance, and a production method therefor. Also provided is a functional foam which includes the above-mentioned foam and has imparted thereto various functions. The foam includes spherical cells, in which: the spherical cells each have an average pore diameter of less than 20 ?m; the foam has a density of 0.15 g/cm3 to 0.9 g/cm3; and the foam is crack-free in a 180° bending test. The functional foam includes the foam.

Abstract: Provided is a W/O emulsion, including a continuous oil phase component and an aqueous phase component immiscible with the continuous oil phase component, in which: the continuous oil phase component includes a hydrophilic polyurethane-based polymer and an ethylenically unsaturated monomer; the hydrophilic polyurethane-based polymer includes a polyoxyethylene polyoxypropylene unit derived from polyoxyethylene polyoxypropylene glycol; and the polyoxyethylene polyoxypropylene unit includes 5 wt % to 25 wt % of polyoxyethylene. Also provided is a foam, including a hydrophilic polyurethane-based polymer, in which: the foam has an open-cell structure in which through-holes are present between adjacent spherical cells; the spherical cells each have an average pore diameter of less than 20 ?m; the through-holes each have an average pore diameter of 5 ?m or less; and the foam has surface openings each having an average pore diameter of 20 ?m or less in a surface thereof.

Abstract: Provided is a novel composite sheet, including a substrate and a foamed layer which is provided on at least one surface side of the substrate, at a low cost in an environment-friendly manner, in which the composite sheet includes a foamed layer having a uniform fine-cell structure, the average pore diameter of each of spherical cells of the foamed layer can be precisely controlled to a small one, the control range of the density of the foamed layer is wide, the control range of the thickness of the foamed layer is wide, and the composite sheet can express an excellent mechanical strength and is preferably excellent in toughness and heat resistance. The composite sheet includes a substrate; and a foamed layer which is provided on at least one surface side of the substrate, in which: the foamed layer has spherical cells, an average pore diameter of each of the spherical cells being less than 30 ?m; and the foamed layer has a density of 0.1 g/cm3 to 0.9 g/cm3.

Abstract: Provided is a method of reusably separating two adhered plates, including step 1 for firmly adhering two plates adhered to each other via a pressure-sensitive adhesive sheet or a curable resin layer to a first jig and a second jig, respectively, step 2 for detaching the two plates by moving at least one of the first jig and the second jig to produce a shear stress causing breakage of the pressure-sensitive adhesive sheet or the curable resin layer, and step 3 for removing the two plates after detachment from the jigs, wherein, in the aforementioned step 1, one or both of the plates is(are) firmly adhered to the jig(s) via a silicone pressure-sensitive adhesive sheet or porous pressure-sensitive is adhesive sheet. Using the method, two plates adhered to each other via a pressure-sensitive adhesive sheet or a curable resin layer can be stably and reusably detached by certainly fixing them by using jig fixtures.

Abstract: Disclosed is a resin foam which excels in properties such as strength, flexibility, cushioning properties, and strain recovery, particularly has a cell structure resistant to shrinkage caused by the restoring force of the resin, and has a high expansion ratio. The cross-linked resin foam is obtained by heating a resin composition containing an elastomer, an active-energy-ray-curable compound, and a thermal crosslinking agent to form a cross-linked structure derived from the thermal crosslinking agent in the resin composition; subjecting the cross-linked-structure-containing resin composition to foam molding to give a foamed structure; and irradiating the foamed structure with an active energy ray to form another cross-linked structure derived from the active-energy-ray-curable compound to give the cross-linked resin foam.

Abstract: The present invention relates to an ultraviolet-curable pressure-sensitive adhesive composition including (a) a monomer component containing 70 to 99 wt % of an alkyl (meth)acrylate with the carbon number in the alkyl group being 1 to 20 and 1 to 30 wt % of a polar group-containing vinyl monomer, (b) at least one polyfunctional (meth)acrylate having four or more (meth)acryloyl groups within one molecule and having an acryl equivalent of 150 or less, in an amount of 0.01 to 0.1 parts by mol based on 100 parts by mol of the monomer component, and (c) a photopolymerization initiator; an ultraviolet-curable pressure-sensitive adhesive sheet using the same; and a process for producing the same.

Abstract: Disclosed is a heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet which maintains a high adhesion force but the bonded part can be easily separated/debonded regardless of whether the surface of the adherend is uneven. The heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet includes a viscoelastic body containing both bubbles and microparticles, and on at least one side thereof, a pressure-sensitive adhesive layer containing a blowing agent. The heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet preferably contains bubbles in an amount of 3 to 30 percent by volume based on the total volume of the viscoelastic body.

Abstract: The present invention relates to a thermally-foamable re-releasable acrylic pressure-sensitive adhesive tape or sheet including a microparticle-containing viscoelastic substrate and a thermal foaming agent-containing pressure-sensitive adhesive layer provided on at least one surface of the microparticle-containing viscoelastic substrate. The thermally-foamable re-releasable acrylic pressure-sensitive adhesive tape or sheet of the present invention can be easily separated or disassembled at the separation or disassembling of the bonded part while maintaining a high normal-state adhesive strength at the bonding.

Abstract: The present invention relates to a photocurable acrylic viscoelastic material composition including: an acrylic monomer mixture containing an alkyl (meth)acrylate as a main monomer component and a polar group-containing vinyl monomer, or a partial polymerization product thereof; a (meth)acrylate compound having at least one isocyanate group within the molecule thereof; and a photopolymerization initiator. The photocurable acrylic viscoelastic material composition of the present invention has, by virtue of the above-described construction, excellent pot life and excellent storage stability, despite containing an isocyanate compound having at least one isocyanate group within the molecule thereof, and further can form an acrylic viscoelastic material excellent in the holding power at high temperatures through photocuring. Also, the acrylic viscoelastic material and acrylic viscoelastic material layer tape or sheet of the present invention is excellent in the holding power at high temperatures.