Patents by Inventor Akira Hokibara

Akira Hokibara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7861387
    Abstract: A method for manufacturing a piezoelectric resonator element from a substrate made of piezoelectric material is provided. The method includes forming a first dry etching mask in a first masking region of a first surface of the substrate in a first mask forming process and performing a first dry etching process to remove a portion of the substrate in areas between the first dry etching mask after the first mask forming process. The method further includes maintaining a first un-etched portion of the substrate between the first dry etching mask after the first dry etching process and removing the first dry etching mask in a mask removing process after the first dry etching process. A wet etching process is performed to remove the first un-etched portion of the substrate after the mask removing process, thereby forming the piezoelectric resonator element.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: January 4, 2011
    Assignee: Epson Toyocom Corporation
    Inventors: Akira Hokibara, Sachi Yamamoto
  • Publication number: 20070222342
    Abstract: [Problems] This invention is intended to provide a method for manufacturing a piezoelectric resonator element that has a small affected layer on a surface and a resonating property not much different from a designed resonating property. [Means to solve the problems] A wet etching is performed to form a tuning-fork quartz resonator element 10 in a separated manner after removal of a metal mask 30, so that an affected layer 23, which results from a dry etching, can be exposed and removed by a wet etching. As a result, a method for manufacturing the tuning-fork quartz resonator element 10 having a resonating property not much different from a desired resonating property can be achieved.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 27, 2007
    Applicant: EPSON TOYOCOM CORPORATION
    Inventors: Akira HOKIBARA, Sachi YAMAMOTO