Patents by Inventor Akira HYAKUSAI

Akira HYAKUSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11651124
    Abstract: An anti-warping design method for designing a resin molded article on a programmed computer includes dividing the molded article into a plurality of small elements, calculating sensitivity values for at least part of the elements with respect to warpage of the molded article, and displaying a distribution of the sensitivity values.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: May 16, 2023
    Assignee: TORAY ENGINEERING CO., LTD.
    Inventors: Ryo Nakano, Koshiro Yamakawa, Akira Hyakusai, Shun Igarashi
  • Publication number: 20220277117
    Abstract: A resin behavior analysis apparatus configured to analyze behavior of a fiber when molding a sheet material of a fiber reinforced resin including a fiber bundle which is an assembly of a plurality of the fibers. The apparatus includes: a CPU and a memory connected to the CPU. The CPU is configured to perform: generating a sheet model which is a model of the sheet material; generating a fiber bundle model which is a model of the fiber bundle in the sheet model; generating a fiber model which is a model of the fiber in the fiber bundle model; and analyzing behavior of the fiber model based on a condition for molding the sheet material.
    Type: Application
    Filed: June 18, 2020
    Publication date: September 1, 2022
    Applicant: Honda Motor Co., Ltd.
    Inventors: Masatoshi Kobayashi, Takuya Yamamoto, Tatsuo Sakakibara, Daisuke Urakami, Akira Hyakusai
  • Publication number: 20190197209
    Abstract: An anti-warping design method for designing a resin molded article on a programmed computer includes dividing the molded article into a plurality of small elements, calculating sensitivity values for at least part of the elements with respect to warpage of the molded article, and displaying a distribution of the sensitivity values.
    Type: Application
    Filed: March 5, 2019
    Publication date: June 27, 2019
    Inventors: Ryo NAKANO, Koshiro YAMAKAWA, Akira HYAKUSAI, Shun IGARASHI