Abstract: Provided is a substrate for superconductive film formation, which includes a metal substrate, and an oxide layer formed directly on the metal substrate, containing chromium oxide as a major component and having a thickness of 10-300 nm and an arithmetic average roughness Ra of not more than 50 nm. A method of manufacturing a substrate for superconductive film formation, which includes forming an oxide layer directly on a metal substrate, the oxide layer containing chromium oxide as a major component and having a thickness of 10-300 nm and an arithmetic average roughness Ra of not more than 50 nm.

Abstract: Problem: To provide an REBCO superconductor which has electromagnetic properties of an extremely small magnetization in a DC magnetic field or an extremely small pinning loss in a fluctuating magnetic field and thereby enable production of a REBCO superconducting wire with an extremely small magnetization and pinning loss. Solution to Problem: A RE1Ba2Cu3O7-z superconductor characterized by having a magnetization-zero-region on its magnetization curve, wherein in the magnetization-zero-region a rate of change of magnetization remains at about zero near zero magnetization, the magnetization curve is formed when an external magnetic field turns from an increase to a decrease or from a decrease to an increase, and RE is one or more of Y, Gd, Nd, Sm, Eu, Yb, Pr, and Ho.

Abstract: An oxide superconducting tape comprised of a substrate on which a GdBa2Cu3O7-? (?=0 to 1) superconductor layer is formed, characterized in that, inside of said superconductor layer, columnar or rod-shaped BaZrO3 crystals are dispersed such that they are inclined from c-axis of the superconducting crystals and that BaZrO3 crystals adjacent in longitudinal directions are in a skew position.

Abstract: Provided is a substrate for superconductive film formation, which includes a metal substrate, and an oxide layer formed directly on the metal substrate, containing chromium oxide as a major component and having a thickness of 10-300 nm and an arithmetic average roughness Ra of not more than 50 nm. A method of manufacturing a substrate for superconductive film formation, which includes forming an oxide layer directly on a metal substrate, the oxide layer containing chromium oxide as a major component and having a thickness of 10-300 nm and an arithmetic average roughness Ra of not more than 50 nm.

Abstract: A purification process of crude methacrylamide by recrystallization from an aqueous methacrylamide solution, comprising the steps of conducting crystallization by adjusting the hydrogen ion concentration of the aqueous methacrylamide solution to pH 8 or more, separating a methacrylamide crystal, adjusting 5% by weight or more of resulting mother liquor to pH 5 or less, separating precipitated insoluble matter, and reusing thus-treated mother liquor, is provided.The high quality methacrylamide crystal thus obtained is excellent in Hazen number, purity and transparency of a methanol solution and suitable for uses such as windshield glasses.

Abstract: A process for the preparation of an N-substituted unsaturated carboxylic acid amide represented by the following formula: ##STR1## wherein R.sup.1 means a hydrogen atom or methyl group Y denotes a methylene group, oxygen atom or methylimino group, m and n stand individually for an integer of 0 to 5, and m+n is an integer of 3 to 5. The process comprises reacting a specified .beta.-alkoxy-substituted carboxylate with a specified cyclic amine to form a .beta.-alkoxy-substituted carboxylic acid amide compound and then removing an alcohol from the carboxylic acid amide compound in the presence of a basic catalyst to form an unsaturated group.

Abstract: This invention relates to a polyimide powder in use for adhesion and/or coat forming and to a method of preparing said powder, wherein polyamic-acid is chemically imidized which is obtained by reacting tetracarboxylic acid dianhydride with diamine in organic solvents.This invention further relates to a method for adhesion and coat forming by using said polyimide powder.This invention still further relates to a method for preparing prepreg by using said polyimide powder, and a method for adhesion and preparing molded laminates by using said prepreg.