Abstract: The object of the present invention is to provide an aqueous dispersion that can give the required properties for a wide range of uses including electronic materials, magnetic materials, optical materials and polishing materials, and to provide an aqueous dispersion for chemical mechanical polishing (CMP slurry) that gives an adequate polishing rate without creating scratches in polishing surfaces. Another object of the present invention is, to provide a method for manufacture of semiconductor devices using a CMP slurry that can control progressive erosion due to scratches and the like during polishing and that can achieve efficient flattening of working films, and to provide a method for formation of embedded wiring.

Abstract: The polymer particles of the invention are characterized by being obtained by polycondensation of at least one from among Compound 1 represented by general formula (1), its hydrolysates and its partial condensates, and at least one from among Compound 2 represented by general formula (2), its hydrolysates and its partial condensates, and by having a mean particle size of 3-1000 nm. M(OR1)z  (1) (R2)nM(OR3)z-n  (2) where M is Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ge, Zr, Nb, Mo, Sn, Sb, Ta, W, Pb or Ce; z is the atomic valence of M; R1 and R3 are each an alkyl group of 1-5 carbon atoms, an acyl group of 1-6 carbon atoms or an aryl group of 1-9 carbon atoms; R2 is a monovalent organic group of 1-8 carbon atoms; n is an integer of from 1 to (z−2); and R1, R2 and R3 may be the same or different. These particles are used in polishing compositions used for chemical mechanical polishing.

Abstract: A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite particles, the composite particles containing polymer particles having at least one of a silicon compound portion or section and a metal compound portion or section formed directly or indirectly on the polymer particles.

Abstract: Water-laden solid matter is provided which is obtained by adding 40 to 300 weight parts of water to 100 weight parts of inorganic oxide particles synthesized by fumed process or metal evaporation oxidation process, slurry for polishing is provided which is manufactured by using the water-laden solid matter, and a method for manufacturing a semiconductor device using the above slurry. Said water-laden solid matter is within a range of 0.3 to 3 g/cm3 in bulk density and within a range of 0.5 to 100 mm&phgr; in average particle size when manufactured granular. Said slurry for polishing is manufactured from the water-laden solid matter, and the average particle size thereof after being dispersed in water is within a range of 0.05 to 1.0 &mgr;m.

Abstract: It is an object of the present invention to provide an aqueous dispersion and CMP slurry that can achieve polishing at an adequate rate without producing scratches in the polishing surfaces of wafer working films, and a polishing process for wafer surfaces and a process for manufacture of a semiconductor device using them. A CMP slurry and the like of the present invention contains polymer particles with a crosslinked structure and a mean particle size of 0.13-0.8 &mgr;m. The CMP slurry may contain no surfactant, and may contain the surfactant of not greater than 0.15 wt %. A CMP slurry and the like of another present invention contains polymer particles and inorganic particles of silica, aluminum and the like. A mean particle size of the polymer particles may be not greater than a mean particle size of the inorganic particles. And the mean particle size of the inorganic coagulated particles may be 0.1-1.0 &mgr;m, and may be smaller than the mean particle size of the polymer particles.

Abstract: The polymer particles of the invention are characterized by being obtained by polycondensation of at least one from among Compound 1 represented by general formula (1), its hydrolysates and its partial condensates, and at least one from among Compound 2 represented by general formula (2), its hydrolysates and its partial condensates, and by having a mean particle size of 3-1000 nm.

Abstract: The present invention provides aqueous dispersion slurry of inorganic particles which is so stable as not to increase in viscosity, gel or sediment even if stored for a long time and therefore can be used as raw materials for, for example, cosmetics, paint, coating materials and lapping slurry for semiconductor wafers, and production method of such aqueous dispersion slurry. The aqueous dispersion slurry according to the present invention has the number of particles whose a particle diameter of 1.3 .mu.m or more is 180,000 or less per mL in terms of 30 wt % in concentration, and the average particle diameter thereof is in a range of 0.05-0.9 .mu.m. The number of particles having aparticle diameter of 1.3 .mu.m or more is counted by using Particle Sensor KS-60, which is a light extinction type sensor for detecting particles, and Particle Counter KL-11, which is a particle counter, both of which made by the same manufacturer, Rion Electro Corp.

Abstract: A process for producing a hydrogenation product of ring-opening polymer by hydrogenating, in the presence of a hydrogenation catalyst, the non-aromatic carbon-to-carbon double bond present in a ring-opening polymer obtained by subjecting to ring-opening polymerization at least one norbornene derivative represented by general formula (I): ##STR1## wherein A and B independently represent hydrogen atoms or hydrocarbon groups having 1-10 carbon atoms, X and Y independently represent hydrogen atoms, halogen atoms or monovalent organic groups, and m is 0 or 1, alone or in combination with a monomer copolymerizable with said norbronene derivative, characterized by using, as the hydrogenation catalyst, a ruthenium compound represented by general formula (II):RuH.sub.k Q.sub.n T.sub.p Z.sub.q (11)wherein Q represents a halogen atom, T represents at least one atomic group selected from the group consisting of CO, NO and CH.sub.3 COCH.sub.2 COCH.sub.3, Z represents PR.sup.1 R.sup.2 R.sup.3 (R.sup.1, R.sub.2 and R.sup.

Abstract: A transparent resin material consisting of a hydrogenation product of a (co)polymer obtained by subjecting at least one compound represented by general formula (I) or a combination of at least 5% by weight of said compound and 95% by weight or less of other copolymerizable cyclic olefin monomer to metathesis polymerization: ##STR1## wherein A and B are independently hydrogen atoms or C.sub.1-10 hydrocarbon groups; and X and Y are independently hydrogen atoms, C.sub.1-10 hydrocarbon groups, --C(CH.sub.2).sub.n COOR.sup.1 groups or --(CH.sub.2).sub.n OCOR.sup.1 groups [R.sup.1 is a C.sub.1-20 hydrocarbon group and n is 0 or an integer of 1-10] with the proviso that at least one of X and Y is selected from the above --(CH.sub.2).sub.n COOR.sup.1 and --(CH.sub.2).sub.n OCOR.sup.1 groups. Said transparent resin material is moldable and has sufficient optical properties, low hygroscopicity, good heat resistance and excellent adhesion to recording layer.

Abstract: A transparent resin material consisting of a (co)polymer obtained by subjecting at least one compound represented by the general formula (I) or a combination of said compound and other copolymerizable monomer to metathesis polymerization, or a hydrogenation product of the (co)polymer: ##STR1## wherein A and B are independently hydrogen atoms or C.sub.1-10 hydrocarbon groups; X and Y are independently hydrogen atoms, C.sub.1-10 hydrocarbon groups, halogen atoms, halogen-substituted C.sub.1-10 hydrocarbon groups, --(CH.sub.2).sub.n COOR.sup.1, --(CH.sub.2).sub.n OCOR.sup.1, --(CH.sub.2).sub.n OR.sup.1, --(CH.sub.2).sub.n CN, --(CH.sub.2).sub.n CONR.sup.2 R.sup.3, --(CH.sub.2).sub.n COOZ, --(CH.sub.2).sub.n OCOZ, --(CH.sub.2).sub.n OZ or --(CH.sub.2).sub.n W [R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently C.sub.1-20 hydrocarbon groups, Z is a halogen-substituted hydrocarbon group, W is SiR.sub.p.sup.5 D.sub.3-p (R.sup.5 is a C.sub.1-10 hydrocarbon group, D is a halogen atom, --OCOR.sup.5 or --OR.sup.

Abstract: A pressure-sensitive adhesive composition comprising as a base polymer a mixed block copolymer comprising a polymer block of a monovinyl-substituted aromatic compound and a polymer block of a conjugated diene compound. The pressure-sensitive adhesive composition is useful to seal, for example, corrugated board or carton.

Abstract: Methacrylic acid is produced from methacrolein by gaseous phase oxidation in a very high selectivity, when methacrolein, molecular oxygen-containing gas and steam in a molar ratio of methacrolein:molecular oxygen:steam of 1:1-3:0-50 are subjected to reaction at a temperature in the range of 250.degree. to 400.degree. C., at a space velocity of 250 to 3,000 hr.sup.-1 (at 0.degree. C. and 1 atm.) with a novel catalyst having the following composition formula in atomic ratio:Mo.sub.a P.sub.b Zr.sub.c V.sub.d Mn.sub.e X.sub.f O.sub.gwherein X represents at least one member selected from the group consisting of potassium, rubidium, cesium and thallium, and a, b, c, d, e, f or g represents the number of atoms of Mo, P, Zr, V, Mn, X or O, respectively, and when a is 12, b is 0.5 to 5, c is 0.1 to 5, d is 0.05 to 3, e is 0.05 to 1.5, f is 0.1 to 3 and g is 40 to 60; and g is a number sufficient enough to satisfy the valencies of the respective catalyst component elements.

Abstract: In a process for producing methacrolein by the gas phase catalytic reaction of isobutene with molecular oxygen in the presence of a catalyst consisting of Mo, Bi, Fe, Co, Sb and O, the catalyst is prepared by using as the Sb component, a mixture of a trivalent Sb compound and a pentavalent Sb compound. When said catalyst is used, the reaction can be continued over a long period of time without formation of complete oxidation products, i.e. CO and CO.sub.2, and, even when the starting isobutene contains n-butene, the reaction proceeds smoothly to make it possible to produce methacrolein and 1,3-butadiene simultaneously.

Abstract: A process for producing styrene which comprises subjecting 4-vinylcyclohexene to gas phase catalytic oxidation with a molecular oxygen-containing gas, for example, air, characterized in that the oxidation is carried out by use of a catalyst composition represented by the general formula,Mo.sub.12 Bi.sub.0.1.sub.-10 Fe.sub.0.sub.-15 Co.sub.0.sub.-15 Pb.sub.0.sub.-15 X.sub.0.sub.-10 Y.sub.0.sub.-3 O.sub.nwherein X is at least one element selected from the group consisting of zirconium, cadmium, niobium, and antimony; Y is at least one element selected from the group consisting of lithium, sodium, potassium, rubidium, cesium and thallium; 1.ltoreq.Fe + Co + Pb.ltoreq.25; and n is the number of oxygen atoms sufficient to replenish the valences of other elements. According to the above-mentioned process, styrene can be produced in a high yield.