Patents by Inventor Akira Ikegaya

Akira Ikegaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5342997
    Abstract: The insulating members, almost circular or oval in cross section with an outer diameter virtually equal to the thickness of the rectangular conductor, are arranged in such a manner as to be alternated with the rectangular conductors and are held between the two insulating tapes from both the upper and lower sides, with the adhesive layer filling the space between the two facing tapes. The insulating tapes with adhesive layers on the opposing inner sides are pressed against the conductors and the insulating members by the press-forming rollers to form a tape wire.
    Type: Grant
    Filed: January 6, 1993
    Date of Patent: August 30, 1994
    Assignee: Yazaki Corporation
    Inventors: Toshiaki Kanno, Akira Ikegaya, Tsuneyuki Horiike
  • Patent number: 5171938
    Abstract: A shield wire comprising: a conductor, an insulation layer provided around an outer periphery of the conductor; an electrically-conductive resin layer provided around an outer periphery of the insulation layer; a covering insulation layer formed around an outer periphery of the electrically-conductive resin layer; and shield device for shielding the shield cable from electromagnetic interference, the means formed to electrically contact the electrically-conductive resin layer.
    Type: Grant
    Filed: April 17, 1991
    Date of Patent: December 15, 1992
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Akira Ikegaya, Hidenori Yamanashi, Hitoshi Ushijima
  • Patent number: 5057812
    Abstract: A high-tension resistance cable capable of maintaining a distributed capacitance not greater than 80 pF/m while having an outer diameter not greater than 5 mm includes a central resistance conductor which is no more than 0.8 mm in diameter. In one embodiment, the resistance is formed of a reinforcement core, a ferrite core layer, and a metal winding layer. In the metal winding layer, wires, having an outer diameter of 0.04 to 0.045 mm, are wound at a density of 91-115 times per centimeter around the ferrite core layer.
    Type: Grant
    Filed: October 15, 1990
    Date of Patent: October 15, 1991
    Assignee: Yazaki Corporation
    Inventors: Yoshimi Yukawa, Toshio Inada, Akira Ikegaya