Patents by Inventor Akira Ikezawa

Akira Ikezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10412848
    Abstract: A power supply device 1 includes a main circuit board 20, a power component 22 connected to the main circuit board 20, a filter component 24 connected to the main circuit board 20, and a casing 10 which houses the main circuit board 20, the power component 22, and the filter component 24. The casing 10 includes a base plate 11 which includes a flat surface 11a in which a fin 14 for heat dissipation is provided on a bottom-surface side, and a protruding part 15 which protrudes from the flat surface toward the fin. The power component 22 and the main circuit board 20 are placed on the flat surface, and the filter component 24 is housed in the protruding part 15.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: September 10, 2019
    Assignee: TDK CORPORATION
    Inventors: Kengo Tsujimoto, Kouji Utsui, Akira Ikezawa
  • Patent number: 9967994
    Abstract: An insulating component having a first core accommodating section that receives a first magnetic body core, a second core accommodating section that receives a second magnetic body core, and a locking section. The first core accommodating section has two parallel core leg section accommodating sections that individually surround one of at least two leg sections of the first magnetic body core. The second core accommodating section is configured to surround the second magnetic body core. An aperture section is formed in the insulating component between the two parallel core leg section accommodating sections. The locking section is configured to be locked to a bus bar inserted into that aperture section.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: May 8, 2018
    Assignee: TDK CORPORATION
    Inventor: Akira Ikezawa
  • Patent number: 9820413
    Abstract: As a thermal conductive material having fluidity is applied on a base plate, probability of a decrease in thermal conductive performance, i.e., probability of a decrease in a heat radiation property caused by a human work, can be suppressed in comparison with the case in which a heat transfer sheet is installed. When the thermal conductive material having fluidity is used, thermal conductive performance is obtained by applying the thermal conductive material is applied and thus reliability is improved. In addition, as stepped sections are formed at sidewalls of circumferential edges of protrusion surfaces on which the thermal conductive material is applied, even when the thermal conductive material having fluidity sticks out of the protrusion surfaces, since the thermal conductive material is accommodated in the stepped sections, the thermal conductive material is suppressed from sticking to another electronic component or the like to improve reliability.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: November 14, 2017
    Assignee: TDK CORPORATION
    Inventor: Akira Ikezawa
  • Publication number: 20170208702
    Abstract: A power supply device 1 includes a main circuit board 20, a power component 22 connected to the main circuit board 20, a filter component 24 connected to the main circuit board 20, and a casing 10 which houses the main circuit board 20, the power component 22, and the filter component 24. The casing 10 includes a base plate 11 which includes a flat surface 11a in which a fin 14 for heat dissipation is provided on a bottom-surface side, and a protruding part 15 which protrudes from the flat surface toward the fin. The power component 22 and the main circuit board 20 are placed on the flat surface, and the filter component 24 is housed in the protruding part 15.
    Type: Application
    Filed: January 18, 2017
    Publication date: July 20, 2017
    Applicant: TDK CORPORATION
    Inventors: Kengo TSUJIMOTO, Kouji UTSUI, Akira IKEZAWA
  • Patent number: 9241419
    Abstract: A bracket fixing hole that is configured to insert a screw part of a bracket fixing screw that is configured to mount the bracket to a bracket mounting part, a clamp hole that is configured to mount a cable clamp, and at least two notches that are configured to position the bracket to the at least two convex parts of the bracket mounting part are formed to a bracket. The bracket fixing hole and the clamp hole are faced on the opposed sides in such a manner that a first line segment that connects parts of the two notches is disposed between the holes. A second line segment that connects a center of the bracket fixing hole and a center of the clamp hole and the first line segment generally bisect each other at right angles. A gravity center is disposed on the side of the bracket fixing hole to the first line segment.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: January 19, 2016
    Assignee: TDK Corporation
    Inventor: Akira Ikezawa
  • Patent number: 9181971
    Abstract: A bus bar includes a bus bar body and a spacer provided on the bus bar body, the spacer being an insulator. The bus bar body includes a through hole portion that allows a part of a fixing member for fixing the bus bar body to be inserted therethrough. The spacer includes a head portion and a body portion extending therefrom. When the spacer is provided on the bus bar body, the head portion covers at least part of a peripheral edge region of an end opening of the through hole and the body portion covers an inner peripheral surface of the through hole portion. An outer peripheral surface of the body portion of the spacer is fixedly adhered to the inner peripheral surface of the through hole portion so that resistance occurs when the spacer moves toward the head portion side relative to the bus bar body.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: November 10, 2015
    Assignee: TDK Corporation
    Inventors: Akira Ikezawa, Masaki Kan
  • Publication number: 20150208534
    Abstract: According to a bobbin 50 (an insulating component) that constitutes an electronic component 100 (a conductive component 200), two leg sections 61A, 61B of a magnetic body core 61 are inserted into core leg section accommodating sections 511, 512 of a first magnetic body core accommodating section, and a magnetic body core 62 is accommodated in a second core accommodating section 517. Further, since a bus bar 20 is inserted into an aperture section 513 formed between the two core leg section accommodating sections 511, 512, a high insulation property between the bus bar 20 and the pair of magnetic body cores 61, 62 is maintained by the bobbin 50. Further, since the bobbin 50 can be locked to the bus bar 20 by a locking section 515 and the bobbin 50 and the bus bar 20 can be integrated through this locking, good workability can be obtained.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 23, 2015
    Inventor: Akira IKEZAWA
  • Publication number: 20150208546
    Abstract: As a thermal conductive material having fluidity is applied on a base plate, probability of a decrease in thermal conductive performance, i.e., probability of a decrease in a heat radiation property caused by a human work, can be suppressed in comparison with the case in which a heat transfer sheet is installed. When the thermal conductive material having fluidity is used, thermal conductive performance is obtained by applying the thermal conductive material is applied and thus reliability is improved. In addition, as stepped sections are formed at sidewalls of circumferential edges of protrusion surfaces on which the thermal conductive material is applied, even when the thermal conductive material having fluidity sticks out of the protrusion surfaces, since the thermal conductive material is accommodated in the stepped sections, the thermal conductive material is suppressed from sticking to another electronic component or the like to improve reliability.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 23, 2015
    Inventor: Akira IKEZAWA
  • Patent number: 9082544
    Abstract: To improve the insulation property of a coil winding wire without increasing the number of components. In a case where a coil winding wire 3 is inserted into a region formed by two side wall portions 41 and 42 and two connection portions 43 and 44 and this result is sandwiched between magnetic core members 6A and 6B, it is possible to prevent the two side wall portions 41 and 42 from contacting the coil winding wire 3 and the outer electronic components. Further, since the coil winding wire 3 is sandwiched by the connection portion 42 formed at the upper surface side of the coil winding wire 3 and the connection portion 44 formed at the lower surface side thereof from the upper and lower surfaces of the coil winding wire, the insulation property with respect to other electronic components in the up and down direction is also maintained.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: July 14, 2015
    Assignee: TDK CORPORATION
    Inventor: Akira Ikezawa
  • Patent number: 9071005
    Abstract: To improve airtightness while reducing a usage amount of a resin for a sealing operation. A terminal block 20 of an electronic device 100 includes a resinous portion 21, a terminal member 23, and a connection member 25. Then, since a first area A1 and a second area A2 are divided by a partition wall 273 in the terminal block 20, it is possible to individually charge a charging resin 29A for blocking a through-hole A22 and a charging resin 29B for blocking a boundary portion between the terminal member 23 and the resinous portion 21. Thus, since the charging amounts of the charging resins 29A and 29B may be respectively adjusted, it is possible to appropriately charge the charging resin for improving the airtightness and to reduce the usage amount of the charging resin for a sealing operation.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 30, 2015
    Assignee: TDK CORPORATION
    Inventor: Akira Ikezawa
  • Patent number: 9030811
    Abstract: An electronic device chassis includes a base plate for disposing an electronic device circuit thereon, and a cover for the electronic device circuit housing. The base plate includes a bottom portion and a wall portion. The wall portion includes a screw fastening portion including a contact surface that contacts the cover. The cover includes a screw hole for attaching the base plate. The contact surface of the screw fastening portion is higher than an upper surface other than the contact surface of the wall portion. The upper surface portion covers the side of the housing space facing the base plate. The external side surface cover is provided at a peripheral edge of the upper surface cover portion, and extends toward the base plate so as to be longer than a difference between the contact surface of the screw fastening portion and the upper surface of the wall portion.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: May 12, 2015
    Assignee: TDK Corporation
    Inventor: Akira Ikezawa
  • Publication number: 20140242838
    Abstract: To improve airtightness while reducing a usage amount of a resin for a sealing operation. A terminal block 20 of an electronic device 100 includes a resinous portion 21, a terminal member 23, and a connection member 25. Then, since a first area A1 and a second area A2 are divided by a partition wall 273 in the terminal block 20, it is possible to individually charge a charging resin 29A for blocking a through-hole A22 and a charging resin 29B for blocking a boundary portion between the terminal member 23 and the resinous portion 21. Thus, since the charging amounts of the charging resins 29A and 29B may be respectively adjusted, it is possible to appropriately charge the charging resin for improving the airtightness and to reduce the usage amount of the charging resin for a sealing operation.
    Type: Application
    Filed: January 23, 2014
    Publication date: August 28, 2014
    Applicant: TDK CORPORATION
    Inventor: Akira IKEZAWA
  • Publication number: 20140240070
    Abstract: To improve the insulation property of a coil winding wire without increasing the number of components. In a case where a coil winding wire 3 is inserted into a region formed by two side wall portions 41 and 42 and two connection portions 43 and 44 and this result is sandwiched between magnetic core members 6A and 6B, it is possible to prevent the two side wall portions 41 and 42 from contacting the coil winding wire 3 and the outer electronic components. Further, since the coil winding wire 3 is sandwiched by the connection portion 42 formed at the upper surface side of the coil winding wire 3 and the connection portion 44 formed at the lower surface side thereof from the upper and lower surfaces of the coil winding wire, the insulation property with respect to other electronic components in the up and down direction is also maintained.
    Type: Application
    Filed: January 23, 2014
    Publication date: August 28, 2014
    Applicant: TDK CORPORATION
    Inventor: Akira IKEZAWA
  • Patent number: 8217749
    Abstract: A coil component includes coil windings, and resin portions that are insulating members having electrical insulation properties and integrally formed with the coil windings covering parts of surfaces of the coil windings, and the coil component is sandwiched by magnetic core members in directions of winding axes of the coil windings. The coil windings are composed of a plurality of plate-like coil members in a ring shape having ends joined in a stacking direction with a clearance therebetween to be continuous in a predetermined winding direction. The resin portions that are the insulating members cover outermost plate surfaces of the coil members facing the magnetic core members, a space between the adjacent coil members, and inner perimeter edges of the coil members, and have openings along the directions of winding axes of the coil windings.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: July 10, 2012
    Assignee: TDK Corporation
    Inventor: Akira Ikezawa
  • Patent number: 8077003
    Abstract: A coil component includes a first coil winding wound around a first axis, a second coil winding wound around a second axis and juxtaposed to the first coil winding, a connecting member for electrically connecting second terminals that are one end of the first coil winding and one end of the second coil winding, and a heat conductive member mounted on the connecting member and having electrical insulation properties and heat conductivity. The first and second coil windings are each wound such that magnetic flux is generated by a current flowing through the first and second coil windings to pass through an opening of the first coil winding and through an opening of the second coil winding in an opposite direction to the direction passing the opening of the first coil winding. Accordingly, heat generated in the first and second coil windings is dissipated from the heat conductive member.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: December 13, 2011
    Assignee: TDK Corporation
    Inventor: Akira Ikezawa
  • Publication number: 20100237971
    Abstract: A coil component includes a first coil winding wound around a first axis, a second coil winding wound around a second axis and juxtaposed to the first coil winding, a connecting member for electrically connecting second terminals that are one end of the first coil winding and one end of the second coil winding, and a heat conductive member mounted on the connecting member and having electrical insulation properties and heat conductivity. The first and second coil windings are each wound such that magnetic flux is generated by a current flowing through the first and second coil windings to pass through an opening of the first coil winding and through an opening of the second coil winding in an opposite direction to the direction passing the opening of the first coil winding. Accordingly, heat generated in the first and second coil windings is dissipated from the heat conductive member.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 23, 2010
    Applicant: TDK Corporation
    Inventor: Akira IKEZAWA
  • Publication number: 20100237977
    Abstract: A coil component includes coil windings, and resin portions that are insulating members having electrical insulation properties and integrally formed with the coil windings covering parts of surfaces of the coil windings, and the coil component is sandwiched by magnetic core members in directions of winding axes of the coil windings. The coil windings are composed of a plurality of plate-like coil members in a ring shape having ends joined in a stacking direction with a clearance therebetween to be continuous in a predetermined winding direction. The resin portions that are the insulating members cover outermost plate surfaces of the coil members facing the magnetic core members, a space between the adjacent coil members, and inner perimeter edges of the coil members, and have openings along the directions of winding axes of the coil windings.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 23, 2010
    Applicant: TDK CORPORATION
    Inventor: Akira IKEZAWA
  • Patent number: 7408436
    Abstract: A bobbin has a bobbin body capable of fitting into the inside of a winding, and a protrusion protruding from the outer peripheral surface of the bobbin body and capable of intervening between windings. Preferably, stopper means is further provided for preventing the bobbin from rotating. This means is a stopper piece which protrudes from the outer peripheral surface of the bobbin body substantially on the opposite side of the protrusion, and fits in a slit formed at a bend of the winding. The stopper means may have a flange extending from one end of the bobbin body, and a stopper protrusion protruding from a flange edge in a direction opposite to a direction in which the bobbin body extends, for engagement with a core. The protrusion may have a thickness dimension equal to or larger than a spacing between windings.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: August 5, 2008
    Assignee: TDK Corporation
    Inventor: Akira Ikezawa
  • Publication number: 20070171023
    Abstract: A bobbin has a bobbin body capable of fitting into the inside of a winding, and a protrusion protruding from the outer peripheral surface of the bobbin body and capable of intervening between windings. Preferably, stopper means is further provided for preventing the bobbin from rotating. This means is a stopper piece which protrudes from the outer peripheral surface of the bobbin body substantially on the opposite side of the protrusion, and fits in a slit formed at a bend of the winding. The stopper means may have a flange extending from one end of the bobbin body, and a stopper protrusion protruding from a flange edge in a direction opposite to a direction in which the bobbin body extends, for engagement with a core. The protrusion may have a thickness dimension equal to or larger than a spacing between windings.
    Type: Application
    Filed: January 27, 2005
    Publication date: July 26, 2007
    Applicant: TDK CORPORATION
    Inventor: Akira Ikezawa
  • Patent number: 5743182
    Abstract: A stencil printing apparatus is provided, which comprises a pressure chamber having a first wall and a second wall both of which face each other and are built up together via a frame-like packing, said first wall comprising a frame member which has flexibility in all directions and on which a diaphragm having flexibility is extended; means for supporting a stencil so as to have the stencil disposed opposite to said diaphragm in the pressure chamber; means for supporting printing paper so as to have the printing paper disposed between the stencil and the second wall in the pressure chamber, and means for reducing pressure in the pressure chamber. The diaphragm may be extended on the frame member by laminating it onto the frame member, and the packing and the means for supporting a stencil may be installed on part of said diaphragm overlapping with the frame member. The means for supporting a stencil may be a pair of fabric fastener, one half of the pair being fixed to the frame member.
    Type: Grant
    Filed: May 7, 1996
    Date of Patent: April 28, 1998
    Assignee: Riso Kagaku Corporation
    Inventors: Akio Kobayashi, Yoshifumi Noguchi, Masakazu Kawano, Akira Ikezawa