Patents by Inventor Akira Irie
Akira Irie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240141464Abstract: A steel sheet may be used for hot-dip galvanizing capable of manufacturing hot-dip galvannealed steel sheet(s) with a high Si content and in which alloying unevenness is suppressed. Such a steel sheet for hot-dip galvanizing may include an internal oxide layer containing an oxide of Si between a surface layer of the steel sheet and a steel sheet base portion. The Si content in a chemical composition of the steel sheet may be 1.0 mass % or more. A solid solution Si amount from a surface of the steel sheet to a depth of 1 ?m measured at all four positions including positions of 10 mm, 30 mm, and 50 mm from an edge in a coil width direction and a position of a center in the coil width direction at a rear end in a rolling direction of the steel sheet for hot-dip galvanizing may be 1.4 wt. % or less.Type: ApplicationFiled: March 2, 2022Publication date: May 2, 2024Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventors: Akira KAWAKAMI, Hiroo SHIGE, Hiroshi IRIE, Takayuki MAEDA, Hang YU
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Publication number: 20240133013Abstract: A method for manufacturing a hot-dip galvanized steel sheet having a high Si content and good plating adhesion. The method for manufacturing a hot-dip galvanized steel sheet includes the following: hot-rolling a steel raw material having a Si content of 1.0 mass % or more and coiling a steel sheet at 500° C. to 700° C.; subjecting a surface of the steel sheet after the coiling to an oxidation treatment at a heating temperature of a steel sheet temperature of 750° C. or lower, and subsequently subjecting the surface to a reduction treatment; and subjecting the steel sheet after the reduction treatment to a hot-dip galvanizing treatment to form a Zn-plated layer on a surface of the steel sheet.Type: ApplicationFiled: March 2, 2022Publication date: April 25, 2024Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)Inventors: Akira KAWAKAMI, Hiroo SHIGE, Hiroshi IRIE, Takayuki MAEDA, Hang YU
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Publication number: 20220181748Abstract: This secondary cell module has: a plurality of unit cells, each having a pair of positive and negative electrode terminals; a first bus bar providing an electrical connection between unit cells; and a second bus bar disposed on at least two unit cells of the plurality of unit cells and electrically connected to an external terminal. In addition, the present invention is characterized in that the second bus bar has a first metal member connected to the positive or negative electrode terminal, a second metal member connected to the external terminal, a third metal member connected to a voltage detection terminal, a first linkage member connecting the first metal member to the second metal member, and a second linkage member connecting the first metal member to the third metal member, and the first linkage member and the second linkage member are connected to each other via the first metal member.Type: ApplicationFiled: February 23, 2022Publication date: June 9, 2022Inventors: Akira IRIE, Sadayuki AOKI, Kazunori OJIMA, Osamu KUBOTA
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Publication number: 20210218082Abstract: Provided is a battery pack capable of preventing a damage to the insulation layer on the bottom face of each of battery cells and improving the cooling performance for the battery cells as compared with the conventional configuration. A battery pack includes a plurality of battery cells 10, a plurality of cell holders 20, a plurality of plates 30, an insulation layer 40 on the entire bottom face 10b of each battery cell 10, a heat-transfer sheet 50, and a cooler 60 to cool the battery cells 10 via the heat-transfer sheet 50. The lower end 30b of each plate 30 protrudes downward from the lower face 40b of each insulation layer 40. The cell holder 20 has supports that support the side faces of the battery cell 10 and an opening 22 that exposes the entire lower face 40b of the insulation layer 40 to the heat-transfer sheet 50.Type: ApplicationFiled: March 6, 2019Publication date: July 15, 2021Applicant: Vehicle Energy Japan Inc.Inventors: Osamu KUBOTA, Sadayuki AOKI, Kazunori OJIMA, Yoshitaka WATAHIKI, Akira IRIE, Tatsuo SUGAWARA
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Patent number: 7488676Abstract: A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.Type: GrantFiled: December 9, 2005Date of Patent: February 10, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yasuhiko Kanaya, Akira Irie, Katsuhiro Nagasawa, Toru Yuki
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Publication number: 20060127652Abstract: There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.Type: ApplicationFiled: December 9, 2005Publication date: June 15, 2006Inventors: Yasuhiko Kanaya, Akira Irie, Katsuhiro Nagasawa, Toru Yuki
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Patent number: 6694627Abstract: A printed circuit board processing machine has: a table that can travel in a X-direction carrying a printed circuit board thereon; a cross rail arranged so as to straddle the table; a plurality of sliders supported for independently movement in a Y-direction by the cross rail; a plurality of spindles supported for movement in a Z-direction by the sliders; a magnetic rail of a linear-motor fixed to the cross rail; and a plurality of coils of the linear-motor fixed to the sliders so as to oppose the magnetic rail.Type: GrantFiled: April 24, 2001Date of Patent: February 24, 2004Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yasushi Ito, Akira Irie
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Patent number: 6623219Abstract: Nuts 22, 23 are engaged with one ball screw 10, and the nut 22 is directly fixed on a slider main body 7s. The nut 23 is rotatably held by a bearing 25, and a bearing holder 24 holding the bearing 25 is fixed on a slider main body 7t. And, a gear 26 is fixed on the side of the nut 23, and a gear 29 engaging with the gear 26 is provided. And, a motor 28 for driving a gear 29 is fixed on a bracket 27, being united with the slider main body 7t. The ball screw 10 is stopped and the motor 28 is rotated so as to individually position the slider 7b. Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.Type: GrantFiled: January 11, 2001Date of Patent: September 23, 2003Assignee: Hitachi Via Mechanics, Ltd.Inventors: Katsuhiro Nagasawa, Tamio Otani, Akira Irie
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Publication number: 20020152619Abstract: A printed circuit board processing machine has: a table that can travel in a X-direction carrying a printed circuit board thereon; a cross rail arranged so as to straddle the table; a plurality of sliders supported for independently movement in a Y-direction by the cross rail; a plurality of spindles supported for movement in a Z-direction by the sliders; a magnetic rail of a linear-motor fixed to the cross rail; and a plurality of coils of the linear-motor fixed to the sliders so as to oppose the magnetic rail.Type: ApplicationFiled: April 24, 2001Publication date: October 24, 2002Applicant: Hitachi Via Mechanics, Ltd.Inventors: Yasushi Ito, Akira Irie
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Publication number: 20010019686Abstract: Nuts 22, 23 are engaged with one ball screw 10, and the nut 22 is directly fixed on a slider main body 7s. The nut 23 is rotatably held by a bearing 25, and a bearing holder 24 holding the bearing 25 is fixed on a slider main body 7t. And, a gear 26 is fixed on the side of the nut 23, and a gear 29 engaging with the gear 26 is provided. And, a motor 28 for driving a gear 29 is fixed on a bracket 27, being united with the slider main body 7t. The ball screw 10 is stopped and the motor 28 is rotated so as to individually position the slider 7b. Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.Type: ApplicationFiled: January 11, 2001Publication date: September 6, 2001Inventors: Katsuhiro Nagasawa, Tamio Otani, Akira Irie
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Patent number: 5876156Abstract: A printed circuit board working machine includes a spindle which holds a cutting tool and is movable to bring the tool into contact with and away from a printed-circuit board to be worked. A device for pressing down the printed-circuit board comprises a support mechanism associated with the spindle of the working machine for relative movement thereto, a plurality of holding sections movably supported by the mechanism and a driving mechanism for the holding sections. The holding sections are formed with holes of different sizes, respectively. When working operation, after the support mechanism causes the holding sections to move away to a position free from interference with the tool, the driving mechanism moves the holding sections to align one of the through holes, corresponding to a size of the tool to be used, with the tool.Type: GrantFiled: August 22, 1996Date of Patent: March 2, 1999Assignee: Hitachi Seiko, Ltd.Inventors: Kouji Yamaura, Tamio Otani, Akira Irie
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Patent number: 5111573Abstract: A device for exchanging tools for use with a spindle has a tool holding device having a plurality of tool holding members disposed at predetermined intervals. Each tool holding member is supported for movement in its axial direction and is axially driven by a drive device so that a tool is transferred between the tool holding member and the spindle. The invention is also concerned with a tool exchanging method.Type: GrantFiled: April 18, 1991Date of Patent: May 12, 1992Assignee: Hitachi Seiko Ltd.Inventors: Yasushi Ito, Tamio Otani, Tadanori Dobashi, Akira Irie, Akihiro Matsuya
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Patent number: 5109584Abstract: An apparatus and method for supplying a printed circuit board to a printed circuit board drilling machine and for returning the printed circuit board after the drilling. A stocker stores a plurality of printed circuit boards in a tilted state, and a plurality of conveyor rollers provides a conveying path for the printed circuit boards. A conveyor device which includes conveyor rollers provides a conveying path connected to the first mentioned conveying path. The arrival of the printed circuit board is detected at a predetermined position, and the printed circuit board is then decelerated by braking in response to a signal from the detection. A device is provided on the printed circuit board drilling machine for delivering the printed circuit board to the printed circuit board drilling machine.Type: GrantFiled: July 17, 1990Date of Patent: May 5, 1992Assignee: Hitachi Seiko Ltd.Inventors: Akira Irie, Yasuhiko Kanaya, Tamio Ohtani
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Patent number: 4982831Abstract: An apparatus and method for supplying a printed circuit board to a printed circuit board drilling machine and for returning the printed circuit board after the drilling. A stocker stores a plurality of printed circuit boards in a tilted state, and a plurality of conveyor rollers provides a conveying path for the printed circuit boards. A conveyor device which includes conveyor rollers provides a conveying path connected to the first mentioned conveying path. The arrival of the printed circuit board is detected at a predetermined position, and the printed circuit board is then decelerated by braking in response to a signal from the detection. A device is provided on the printed circuit board drilling machine for delivering the printed circuit board to the printed circuit board drilling machine.Type: GrantFiled: February 28, 1989Date of Patent: January 8, 1991Assignee: Hitachi Seiko, Ltd.Inventors: Akira Irie, Yasuhiko Kanaya, Tamio Ohtani